Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: Embodiments of a photoresist supply system including a photoresist nozzle device are provided. The photoresist nozzle device includes a tube including a first segment, a curved segment connected to the first segment, and a second segment connected to the curved segment. The photoresist nozzle device also includes a nozzle connected to the second segment.

Abstract: An intelligent air-conditioning controlling system comprises an intelligent controlling device, an air-conditioning, a plurality of sensing devices, and a cloud server. The intelligent controlling device receives environment information and user information from the plurality of sensing devices, and calculates a target temperature. The cloud server retrieves a usage record of a user according to the user information, and executes a big data analysis for generating a historical record and recommended environment temperature according to historical data and the environment information. The intelligent controlling device receives the usage record, the historical record and recommended environment temperature and a control parameter from the cloud server, and generates a control command for the air-conditioning in accordance with the target temperature, the usage record, the historical record and recommended environment temperature and the control parameter.

Abstract: A light emitting diode (LED) array optical cup structure with a focal position includes a substrate, at least three reflective optical cups disposed on the substrate, and a plurality of LEDs in a quantity corresponding to the reflective optical cups. The reflective optical cups are arranged closely side by side to form a geometric shape, and each is tapered downwards to form a cone-shaped accommodating space including an opening. The LEDs are disposed on the substrate and respectively accommodated in the cone-shaped accommodating space, and form a focal position at a center thereof. Accordingly, with the design of the reflective optical cups arranged closely side by side, the LEDs are caused to produce the focal position, and so existing conventional secondary optical components may be adopted to save production costs and satisfy manufacturing requirements.

Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.

Abstract: A brush for back surface treatment (BST) is provided. The brush includes a base portion and a brushing portion. The brushing portion is connected to the base portion. The brushing portion has a plurality of gutters disposed on a surface away from the base portion, in which at least one of the gutters has at least one open end located at least partially on a perimeter of the surface.

Abstract: A brush for back surface treatment (BST) is provided. The brush includes a base portion and a brushing portion. The brushing portion is connected to the base portion. The brushing portion has a plurality of gutters disposed on a surface away from the base portion, in which at least one of the gutters has at least one open end located at least partially on a perimeter of the surface.

Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.

Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.

Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.

Abstract: An intelligent air-conditioning controlling system comprises an intelligent controlling device, an air-conditioning, a plurality of sensing devices, and a cloud server. The intelligent controlling device receives environment information and user information from the plurality of sensing devices, and calculates a target temperature. The cloud server retrieves a usage record of a user according to the user information, and executes a big data analysis for generating a historical record and recommended environment temperature according to historical data and the environment information. The intelligent controlling device receives the usage record, the historical record and recommended environment temperature and a control parameter from the cloud server, and generates a control command for the air-conditioning in accordance with the target temperature, the usage record, the historical record and recommended environment temperature and the control parameter.

Abstract: An intelligent air-conditioning controlling system at least comprises an intelligent controlling device, an air-conditioning, and a plurality of beacons respectively arranged at different zones of a space for sensing environment information in the space. The intelligent controlling device receives the environment information from the beacons, and determines if the space is a comfortable environment based on the environment information. If the entire space is determined an uncomfortable environment, the intelligent controlling device controls the air-conditioning to directly set a target temperature to a comfortable range. If only a specific zone of the space is determined the uncomfortable environment, the intelligent controlling device controls the air-conditioning to execute an adjusting operation in accordance with a position of the specific zone.

Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.

Abstract: Embodiments of a photoresist supply system including a photoresist nozzle device are provided. The photoresist nozzle device includes a tube including a first segment, a curved segment connected to the first segment, and a second segment connected to the curved segment. The photoresist nozzle device also includes a nozzle connected to the second segment.

Abstract: A UV curing system includes an enclosure defining an interior, a UV radiation source disposed within the interior of the enclosure, and a first window disposed within the interior of the enclosure. The first window creates a barrier that separates the UV radiation source and a processing chamber. A second window is disposed within the interior of the enclosure at a distance from the first window to define a gas channel. The second window defines a plurality of openings such that the gas channel is in fluid communication with the processing chamber. A gas inlet conduit is in fluid communication with the gas channel and is configured to introduce a cooling gas into the gas channel. A gas outlet is in fluid communication with the processing chamber and is configured to remove gas from the processing chamber.

Abstract: A UV curing system includes an enclosure defining an interior, a UV radiation source disposed within the interior of the enclosure, and a first window disposed within the interior of the enclosure. The first window creates a barrier that separates the UV radiation source and a processing chamber. A second window is disposed within the interior of the enclosure at a distance from the first window to define a gas channel. The second window defines a plurality of openings such that the gas channel is in fluid communication with the processing chamber. A gas inlet conduit is in fluid communication with the gas channel and is configured to introduce a cooling gas into the gas channel. A gas outlet is in fluid communication with the processing chamber and is configured to remove gas from the processing chamber.

Abstract: A wafer curing apparatus including a plate configured to pass ultraviolet light. The wafer curing apparatus further includes an antireflective coating on a light incident surface of the plate. The antireflective coating has an opening in a central portion thereof. A method of curing a wafer including emitting ultraviolet light from an ultraviolet light source. The method further includes transmitting the ultraviolet light through an ultraviolet transmissive plate having an antireflective coating thereon. The antireflective coating including an opening in a central portion thereof. The method further includes irradiating a wafer with the ultraviolet light transmitted through the ultraviolet transmissive plate.