Patents by Inventor Kwan Cheung

Kwan Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040151414
    Abstract: A co-planar waveguide interferometric electro-optic modulator is disclosed. A Z-cut lithium niobate electro-optic substrate includes a first and second waveguide that are formed in the lithium niobate electro-optic substrate. An elongate RF electrode at least partially covers one of the waveguides. A slotted electrode is disclosed formed by two elongate substantially-parallel electrodes one of which is at least partially covers the other of the waveguides. At least one electrode is substantially greater, preferably at least twice the width of the elongate RF electrode.
    Type: Application
    Filed: November 24, 2003
    Publication date: August 5, 2004
    Applicant: JDS Uniphase Corporation
    Inventors: Siu Kwan Cheung, Srinath Chakravarthy, Karl Kissa
  • Publication number: 20040066549
    Abstract: A reduced size RF signal and ground electrode interface is configured to provide better field confinement of dominant coplanar waveguide mode in the propagation direction and reduce coupling RF energy into a substrate beneath the launch, while matching the impedance of the launch to both that of the coplanar microwave electrode structure overlying the interaction region, and that of the external RF connection to the launch. In ground plane embodiments, an underlying ground plane provides better modal confinement of the dominant coplanar waveguide mode and precludes coupling of RF power to the substrate under the launch. In other embodiments, finite width electrodes provide better modal transition and mitigate against coupling to substrate modes, while providing a pad geometry that facilitates connections to external transmission line components.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 8, 2004
    Applicant: JDS Uniphase Corporation
    Inventors: Grant T. Kiehne, Siu Kwan Cheung, Gregory J. McBrien
  • Patent number: 6675065
    Abstract: A method for tagging the mail pieces in a mail tray and validating the integrity of the mail pieces in the tray. The method is accomplished by: determining the measurement of an edge of each mail piece that will be placed in a tray; determining the thickness of each mail piece that will be placed in the tray; determining the number of mail pieces that will be placed in the tray; calculating an incremental pattern dab that is going to be placed on the edge of each mail piece; placing a portion of the pattern on the edge of each mail piece that is going to form the mail pieces of the tray; and placing the mail pieces in the tray in an ordered manner so that the edges having dabs will be visible, and the dabs will form a pattern that indicates only the determined number of mail pieces are in the tray.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: January 6, 2004
    Assignee: Pitney Bowes Inc.
    Inventors: Thomas J. Foth, Kenneth G. Miller, Richard W. Heiden, Brian M. Romansky, Kwan Cheung Wong
  • Publication number: 20030083780
    Abstract: A method for tagging the mail pieces in a mail tray and validating the integrity of the mail pieces in the tray. The method is accomplished by: determining the measurement of an edge of each mail piece that will be placed in a tray; determining the thickness of each mail piece that will be placed in the tray; determining the number of mail pieces that will be placed in the tray; calculating an incremental pattern dab that is going to be placed on the edge of each mail piece; placing a portion of the pattern on the edge of each mail piece that is going to form the mail pieces of the tray; and placing the mail pieces in the tray in an ordered manner so that the edges having dabs will be visible, and the dabs will form a pattern that indicates only the determined number of mail pieces are in the tray.
    Type: Application
    Filed: May 1, 2002
    Publication date: May 1, 2003
    Applicant: Pitney Bowes Incorporated
    Inventors: Thomas J. Foth, Kenneth G. Miller, Richard W. Heiden, Brian M. Romansky, Kwan Cheung Wong
  • Patent number: 6466444
    Abstract: A heat sink including a first and a second group of heat dissipating members integrally formed and extending upwardly from a base portion. The first group of heat dissipation members includes a plurality of fin-shaped members each having main heat dissipation surfaces surrounded by thin peripheral edges including a top edge, an inside edge and an outside edge. The thin peripheral top edges generally extend from the interior of the base portion towards the outside periphery of the base portion. The main heat dissipation surfaces on adjacent heat dissipation members are substantially opposing to each other, and the second group of heat dissipation members is disposed between the first group of heat dissipation members and the center of the base portion.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: October 15, 2002
    Inventor: Wai Kwan Cheung
  • Publication number: 20020135961
    Abstract: A high efficiency heat sink comprising a U-shaped copper tube and a press-formed sealed vacuum vessel formed of pure copper sheet. The sealed vacuum vessel contains fibers that are strongly absorbent and are impregnated with a refrigerant. The thermal energy effect of the surface with which the inhibited glycol refrigerant employed by the present invention is in contact causes the glycol to vaporize and ascend into the orifice of the U-shaped copper tube. A fan causes the orifice of the U-shaped copper tube of the evaporator to cool and condenses the vapor to liquid, and the liquid flows back again into the sealed vacuum vessel, thus forming a cyclic type heat exchanger and achieving the optimum heat dispersal effect.
    Type: Application
    Filed: August 23, 2001
    Publication date: September 26, 2002
    Inventor: Wai Kwan Cheung
  • Publication number: 20010055199
    Abstract: A heat sink including a first and a second group of heat dissipating members integrally formed and extending upwardly from a base portion. The first group of heat dissipation members includes a plurality of fin-shaped members each having main heat dissipation surfaces surrounded by thin peripheral edges including a top edge, an inside edge and an outside edge. The thin peripheral top edges generally extend from the interior of the base portion towards the outside periphery of the base portion. The main heat dissipation surfaces on adjacent heat dissipation members are substantially opposing to each other, and the second group of heat dissipation members is disposed between the first group of heat dissipation members and the center of the base portion.
    Type: Application
    Filed: May 10, 2001
    Publication date: December 27, 2001
    Inventor: Wai Kwan Cheung
  • Publication number: 20010033550
    Abstract: Method and system for providing autonomous real time updates of a network topology. The method is based on a physical layer point-to-point protocol residing in each network element. Either responsive to a request from a network management system or responsive to network trigger event a network initiates a request to its neighboring network elements. The neighboring network elements respond to the request by identifying themselves via an electronic serial number and the port by which they are connected to the requesting network element. The requesting network element then forwards the response to the request to a network management system. The network management system then use the responses to construct a network topology.
    Type: Application
    Filed: January 27, 2001
    Publication date: October 25, 2001
    Inventors: Thomas Clyde Banwell, Nim Kwan Cheung, Phiroz Madon
  • Patent number: 6134936
    Abstract: A production method and its corresponding mold for manufacturing aluminum alloy heat sinks with extra high profile ratios. The mold comprises a feed section and a form section. The form section is made from a high strength mold steel and contains a plurality of fin forms. The form section includes one or more crossbeams supporting the fin forms. The feed section is generally coaxial with the form section. The mold allows the extrusion of aluminum alloy heat sinks with extra high profile ratios which are difficult to produce by other methods.
    Type: Grant
    Filed: February 5, 1999
    Date of Patent: October 24, 2000
    Assignee: Hoi Po Metal Manufactory Co., LTD
    Inventor: Wai-Kwan Cheung
  • Patent number: D493478
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: July 27, 2004
    Assignee: Thermo CRS Ltd.
    Inventors: Simon Treadwell, James Hoi Kwan Cheung, Thomas Ian Hatherley, Michael Paul Riff, Bradley Kenneth Klinck