Abstract: A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer.

Abstract: A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Abstract: A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.

Abstract: A magnetic body holding device includes: a first pole piece having a first interaction surface and a second interaction surface; a second pole piece having a third interaction surface and a fourth interaction surface; a first stationary magnet disposed to be adjacent to the first interaction surface and the third interaction surface; a second stationary magnet disposed to be adjacent to the second interaction surface and the fourth interaction surface; a rotary magnet rotatably disposed between the first stationary magnet and the second stationary magnet; a first coil disposed between the first stationary magnet and the rotary magnet and wound around at least one of the first pole piece and the second pole piece; and a second coil disposed between the second stationary magnet and the rotary magnet and wound around at least one of the first pole piece and the second pole piece.

Abstract: Disclosed is a magnetic force control device improved to be installed even in a narrow space having a small height. The magnetic force control device includes a first pole piece having a first interaction surface, a second pole piece having a second interaction surface, a third pole piece connected to the second pole piece, a coil wound around at least one of the second pole piece and the third pole piece, a stationary magnet fixed between the first pole piece and the second pole piece and a rotary magnet disposed between the first pole piece and the third pole piece and configured to be rotatable by controlling a current flowing through the coil.

Abstract: A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

Abstract: The present disclosure discloses a method of manufacturing a multilayer perovskite structure, and a multilayer perovskite structure and solar cell manufactured using the same. The method of manufacturing a multilayer perovskite structure according to an embodiment of the present disclosure includes a step of forming a first perovskite layer using a compound including a first perovskite precursor on a base substrate; a step of forming a second perovskite layer using a compound including a second perovskite precursor on a donor substrate; and a step of laminating the first and second perovskite layers so that the first and second perovskite layers contact each other and then applying heat or pressure to form a multilayer perovskite structure.

Abstract: An air purifying unit in which leakage of air flowing between a filter and a blowing fan is significantly reduced, and an air cleaning/ventilation device including the same, are provided. In addition, there are an air cleaning/ventilation device detachably installed in a window, used as a ventilation device, and used as an indoor air cleaning device.

Abstract: Provided herein are bacterial strains that are capable of degrading nitrite and/or TSNAs. Also provided herein are methods of using such bacterial strains to degrade nitrite and/or TSNAs.

Abstract: A method for manufacturing a semiconductor device is provided. A first vertical structure and a second vertical structure are formed on a substrate. The second vertical structure is positioned right next to the first vertical structure. The second vertical structure is positioned right next to the first vertical structure. An insulating layer is formed on the substrate between the first and second vertical structures. A gate metal and a gate dielectric layer, are formed on the first and second vertical structures. A portion of the gate metal, gate dielectric layer, and insulating layer is removed. A portion of the substrate is removed. The portion of the substrate is removed after the gate metal is formed on the first and second vertical structure.

Abstract: A magnetic force control device includes a magnetic flow generating section configured to be freely rotatable to at least define a first arrangement state and a second arrangement state and including a permanent magnet, a magnetic flow section having at least one interaction surface and including at least one pole piece made of a magnetic material in which a magnetic flow is formed therein, the pole piece is disposed such that an effect of a magnetic flow from the magnetic flow generating section on the interaction surface is minimized when the magnetic flow generating section defines the first arrangement state, and the effect of the magnetic flow from the magnetic flow generating section on the interaction surface is maximized when the magnetic flow generating section defines the second arrangement state; and at least one coils wound around the pole piece.

Abstract: A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer.

Abstract: A multilayer electronic device may include a plurality of dielectric layers and a signal path having an input and an output. An inductor may include a conductive layer formed on one of the plurality of dielectric layers and may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The inductor may include an outer perimeter that includes a first straight edge facing outward in a first direction and a second straight edge parallel to the first straight edge and facing outward in the first direction. The second straight edge may be offset from the first straight edge by an offset distance that is less than about 500 microns and less than about 90% of a first width of the inductor in the first direction at the first straight edge.

Abstract: A magnetic force control device includes a first pole piece having an interaction surface, made of a ferromagnetic material, and configured to be in contact with an N pole of a permanent magnet, a second pole piece having an interaction surface, made of a ferromagnetic material, and configured to be in contact with an S pole of the permanent magnet or another permanent magnet different from the permanent magnet, rotary permanent magnet configured to be rotatable to define a first arrangement state in which an N pole thereof is magnetically connected to the second pole piece and an S pole thereof is magnetically connected to the first pole piece and a second arrangement state in which the N pole is magnetically connected to the first pole piece and the S pole is magnetically connected to the second pole piece.

Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Abstract: A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

Abstract: A multilayer filter may include a signal path having an input, an output, and a conductive layer overlying at least one of a plurality of dielectric layers. The conductive layer may be elongated in the first direction and may have a first edge aligned with the first direction and a second edge parallel with the first edge. The conductive layer may include a protrusion extending in the second direction and having an end edge that is parallel with the first edge and offset from the first edge in the second direction by a protrusion length that is greater than about 50 microns. The multilayer filter may include an inductor that is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground.

Abstract: A multilayer electronic device may include a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z-direction. The second conductive layer may overlap the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area and an offset edge within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges may be less than about 500 microns.

Abstract: A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.