Patents by Inventor Kwang-Joo Lee

Kwang-Joo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240375305
    Abstract: A shaving blade is proposed. The shaving blade includes a substrate having a cutting edge, a substrate tip, and a plurality of coating layers laminated on the substrate. A first thickness of the substrate is defined as a thickness measured at a first distance that is 8 micrometers from the substrate tip along a central axis. A second thickness of the substrate is defined as a thickness measured at a second distance that is 16 micrometers from the substrate tip along the central axis. A third thickness of the substrate is defined as a thickness measured at a third distance that is 32 micrometers from the substrate tip along the central axis. The plurality of coating layers include a first coating layer, a second coating layer, and a third coating layer, and contain one or more of chromium boride (CrB), chromium carbide (CrC), or Diamondlike carbon (DLC).
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Hyun Ju LEE, Kwang Choon RYU, Min Joo PARK
  • Publication number: 20240316810
    Abstract: A razor blade is proposed. The razor blade may include a substrate having a cutting edge formed at a tip. A thickness T4 of the substrate measured at a distance of 4 ?m from the tip may be between 1.00 ?m and 1.70 ?m. A thickness T250 of the substrate measured at a distance of 250 ?m from the tip may be between 44 ?m and 60.56 ?m, for example between 47.5 ?m and 60.56 ?m. A ratio of the T4 to the T250 may be 0.032 or less. A rate of increase in thickness in a first section in a region distanced 40 ?m to 100 ?m from the tip may be less than a rate of increase in thickness in a second section in a region distanced 100 ?m or more from the tip.
    Type: Application
    Filed: June 4, 2024
    Publication date: September 26, 2024
    Inventors: Hyun Ju LEE, Hyun Kyu JUNG, Seung Ki LEE, Kwang Choon RYU, Min Joo PARK
  • Patent number: 12095105
    Abstract: A battery pack has reduced manufacturing cost, improved heat dissipation efficiency, and enhanced product stability. The battery pack includes a cover structure including a first cover frame having a plate shape with both front and rear ends bent leftward to form an inner space and a second cover frame having a portion coupled to the first cover frame and having a plate shape with both front and rear ends bent rightward to form an inner space; a first battery module having a plurality of battery cells; and a second battery module having a plurality of battery cells.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: September 17, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jae-Yong Hur, Jin-Oh Yang, Kwang-Bae Lee, Young-Su Son, Kun-Joo Yang
  • Publication number: 20240301034
    Abstract: Described herein are compositions of therapeutic extracellular vesicles, and methods and systems of producing the therapeutic extracellular vesicles. Also described herein are methods of treating a disease or condition with the therapeutic extracellular vesicles.
    Type: Application
    Filed: October 20, 2023
    Publication date: September 12, 2024
    Inventors: Ly James LEE, Junfeng SHI, Kwang Joo KWAK, Wen Jing LU, Yi YOU, Yu TIAN, Feng LAN, Andrew Stephen LEE
  • Patent number: 12076874
    Abstract: A shaving blade is proposed. The shaving blade includes a substrate having a cutting edge, a substrate tip, and a plurality of coating layers laminated on the substrate. A first thickness of the substrate is defined as a thickness measured at a first distance that is 8 micrometers from the substrate tip along a central axis. A second thickness of the substrate is defined as a thickness measured at a second distance that is 16 micrometers from the substrate tip along the central axis. A third thickness of the substrate is defined as a thickness measured at a third distance that is 32 micrometers from the substrate tip along the central axis. The plurality of coating layers include a first coating layer, a second coating layer, and a third coating layer, and contain one or more of chromium boride (CrB), chromium carbide (CrC), or Diamondlike carbon (DLC).
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: September 3, 2024
    Assignee: Dorco Co., Ltd.
    Inventors: Hyun Ju Lee, Kwang Choon Ryu, Min Joo Park
  • Publication number: 20240292675
    Abstract: A display device includes: a substrate; an insulating film on the substrate and having an isolation groove defining a first isolated area and a second isolated area; a first transistor in the first isolated area; and a pixel electrode connected to the first transistor and overlapping the isolation groove.
    Type: Application
    Filed: November 2, 2023
    Publication date: August 29, 2024
    Inventors: Dong Hwan SHIM, Kwang Woo PARK, Eon Joo LEE, Jin Yong LEE, Cheol JANG, Yong Seon JO
  • Publication number: 20240279277
    Abstract: Disclosed is a novel peptide, which is a highly functional peptide derived from a natural fermentation product exhibiting an anti-wrinkle activity. A tetrapeptide consists of an amino acid sequence of glycine (Gly)-glutamine (Gln)-valine (Val)-serine (Ser) (SEQ ID NO: 1). The peptide is synthesized by utilizing 2-(4-nitrophenyl) sulfonylethoxycarbonyl-amino acid (Nsc-amino acid) as an intermediate. The anti-wrinkle activity is exhibited through the inhibition of elastase. The anti-wrinkle activity is exhibited through collagen synthesis. A method of preventing skin wrinkle, includes applying to a skin a tetrapeptide consisting of an amino acid sequence GQVS (SEQ ID NO: 1).
    Type: Application
    Filed: April 18, 2024
    Publication date: August 22, 2024
    Applicant: ANPEP INC.
    Inventors: Sang Moon KANG, Kee Young LEE, Kwang Soon CHOI, Sang Joo CHA
  • Publication number: 20240279721
    Abstract: The present invention discloses a method of detecting the presence of mutated genes, mRNAs or microRNAs in a subject. The method comprises the following steps: (1) Provide a body fluid sample containing cells, circulating tumor cells (CTCs), and/or extracellular vesicles (EVs); and use an analyzer having overhang molecular beacons to measure fluorescence signals generated by interactions between the body fluid sample and the overhang molecular beacons, so as to detect the presence of the mutated genes, mRNAs or microRNA. Furthermore, a biochip comprising a gold coating substrate and tethered lipoplex nanoparticles encapsulating the overhang molecular beacons is also provided in the invention.
    Type: Application
    Filed: July 11, 2023
    Publication date: August 22, 2024
    Inventors: Ly James LEE, Jiaming HU, Kwang Joo KWAK
  • Patent number: 12065595
    Abstract: The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: August 20, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Sera Kim, Ji Ho Han, Mi Jang, Kwang Joo Lee
  • Publication number: 20240254372
    Abstract: An adhesive composition for a semiconductor process, a film for a semiconductor process comprising the same, and a method for manufacturing a semiconductor package using the same are provided. The adhesive composition provides the film for a semiconductor process having excellent adhesion reliability to a wafer even during a process of debonding a carrier from the wafer.
    Type: Application
    Filed: July 29, 2022
    Publication date: August 1, 2024
    Inventors: Hee SONG, Ji Ho HAN, Kwang Joo LEE
  • Publication number: 20240255823
    Abstract: An infrared adaptive transparent camouflage film includes a substrate, a graphene layer, an electrode layer and an ion gel layer. The substrate has dielectric. The graphene layer is disposed on the substrate and stacked in multiple layer. The electrode layer is disposed over the substrate and is spaced apart from the graphene layer. The ion gel layer is disposed over the graphene layer and the electrode layer, or disposed between the graphene layer and the electrode layer, to dope the graphene layer electrically.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 1, 2024
    Inventors: Mi Kyung LIM, Hyeon Don KIM, Kwang Seop KIM, Jae Hyun KIM, Hyun June JUNG, Hak Joo LEE, Seung Min HYUN
  • Patent number: 12024654
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: July 2, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, You Jin Kyung, Kwang Joo Lee, Ji Ho Han, Bora Yeon, Mi Jang
  • Patent number: 12006308
    Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: June 11, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Youngsam Kim, Junghak Kim, Ju Hyeon Kim, Kwang Joo Lee
  • Patent number: 11993731
    Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: May 28, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Junghak Kim, You Jin Kyung, Kwang Joo Lee, Minsu Jeong, Ju Hyeon Kim, Youngsam Kim
  • Patent number: 11939494
    Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Jang, Byoung Ju Choi, Kwang Joo Lee, Yu Lin Sun
  • Patent number: 11932784
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 19, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Da Ae Kim, Ji Ho Han, Kwang Joo Lee, Eun Yeong Kim, Mi Jang
  • Patent number: 11879075
    Abstract: The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: January 23, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Wanjung Kim, Jong Min Jang, Byung Ju Choi, Kwang Joo Lee
  • Patent number: 11834415
    Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: December 5, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Ju Hyeon Kim, Junghak Kim, Seunghee Nam, Kwang Joo Lee
  • Publication number: 20230295388
    Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Minsu JEONG, You Jin KYUNG, Byung Ju CHOI, Woo Jae JEONG, Kwang Joo LEE, Eunbyurl CHO
  • Patent number: 11760907
    Abstract: The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: September 19, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Jang, Kwang Joo Lee, Yu Lin Sun