Patents by Inventor Kwang-Joo Lee

Kwang-Joo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same
    Patent number: 11702571
    Abstract: An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: July 18, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Sera Kim, Ji Ho Han, Kwang Joo Lee
  • Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
    Patent number: 11702520
    Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: July 18, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Minsu Jeong, You Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl Cho
  • CURING AGENT, ADHESIVE COMPOSITION FOR SEMICONDUCTOR COMPRISING SAME, ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR PACKAGE USING SAME
    Publication number: 20230220153
    Abstract: The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.
    Type: Application
    Filed: April 16, 2021
    Publication date: July 13, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Seung Hee NAM, Kwang Joo LEE, Jung Hak KIM, Eun Byurl CHO, Young Sam KIM
  • SEMICONDUCTOR ADHESIVE COMPOSITION AND SEMICONDUCTOR ADHESIVE FILM COMPRISING CURED PRODUCT THEREOF
    Publication number: 20230174834
    Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.
    Type: Application
    Filed: October 20, 2020
    Publication date: June 8, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Kwang Joo LEE, Jung Hak KIM, Ju Hyeon KIM, Yoon Sun JANG
  • APPARATUS FOR SEPARATING SEMICONDUCTOR CHIP AND METHOD FOR SEPARATING SEMICONDUCTOR BY USING SAME
    Publication number: 20230051048
    Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.
    Type: Application
    Filed: February 4, 2021
    Publication date: February 16, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Ju Hyeon KIM, Kwang Joo LEE, Jung Hak KIM, Yoon Sun JANG
  • Method for manufacturing semiconductor package
    Patent number: 11527503
    Abstract: The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 13, 2022
    Assignee: LG CHEM, LTD.
    Inventors: You Jin Kyung, Minsu Jeong, Kwang Joo Lee
  • Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same
    Patent number: 11515245
    Abstract: The present invention relates to a method for manufacturing an insulating layer for a semiconductor package which can improve reliability and have excellent heat resistance by removing pores generated in the insulating layer during manufacture of an insulating layer for a semiconductor package using magnetic characteristics, and an insulating layer for a semiconductor package obtained using the method for manufacturing the insulating layer for a semiconductor package.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: November 29, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Minsu Jeong, You Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl Cho
  • Adhesive film for semiconductor
    Patent number: 11479699
    Abstract: The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 25, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Jang, Heejung Kim, Kwang Joo Lee
  • Adhesive composition
    Patent number: 11466184
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Jang, Sera Kim, Ji Ho Han, Kwang Joo Lee, Bora Yeon, Kwang Su Seo
  • Back-grinding tape
    Patent number: 11466178
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
  • Back grinding tape
    Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • Dicing die-bonding film
    Patent number: 11404301
    Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 2, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Ji Ho Han, Se Ra Kim, Mun Seop Song, Kwang Joo Lee, Yeong Im Yu
  • ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE COMPRISING THE SAME
    Publication number: 20220186092
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
    Type: Application
    Filed: August 13, 2020
    Publication date: June 16, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • Method for manufacturing insulating film and semiconductor package
    Patent number: 11361878
    Abstract: The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 14, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Woo Jae Jeong, You Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong
  • ADHESIVE COMPOSITION FOR DICING FILM, DICING FILM AND DICING DIE BOND FILM
    Publication number: 20220154043
    Abstract: The present disclosure provides an adhesive composition for a dicing film, a dicing film, and a dicing die-bonding film, which have excellent pickup performance.
    Type: Application
    Filed: October 8, 2021
    Publication date: May 19, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Ji Ho HAN, Da Ae KIM, Kwang Joo LEE, Mi JANG, Bo Ra YEON, Kwang Su SEO, Mi Seon KIM
  • ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE INCLUDING THE SAME
    Publication number: 20220154053
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.
    Type: Application
    Filed: August 14, 2020
    Publication date: May 19, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • RESIN COMPOSITION FOR BONDING SEMICONDUCTOR AND ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME
    Publication number: 20220098455
    Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 31, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Jong Min Jang, Byoung Ju Choi, Kwang Joo Lee, Yu Lin Sun
  • ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE USING THE SAME AND DICING DIE BONDING FILM USING THE SAME
    Publication number: 20220089916
    Abstract: The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 24, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Jong Min JANG, Kwang Joo LEE, Yu Lin SUN
  • NON-CONDUCTIVE FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR LAMINATE
    Publication number: 20210388244
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 16, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, You Jin KYUNG, Kwang Joo LEE, Ji Ho HAN, Bora YEON, Mi JANG
  • Method for manufacturing heating element
    Patent number: 11178730
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: November 16, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang