Patents by Inventor Kwang-Joo Lee

Kwang-Joo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive film for semiconductor
    Patent number: 11479699
    Abstract: The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 25, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Jang, Heejung Kim, Kwang Joo Lee
  • Back-grinding tape
    Patent number: 11466178
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
  • Adhesive composition
    Patent number: 11466184
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Jang, Sera Kim, Ji Ho Han, Kwang Joo Lee, Bora Yeon, Kwang Su Seo
  • Back grinding tape
    Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • Dicing die-bonding film
    Patent number: 11404301
    Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 2, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Ji Ho Han, Se Ra Kim, Mun Seop Song, Kwang Joo Lee, Yeong Im Yu
  • ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE COMPRISING THE SAME
    Publication number: 20220186092
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
    Type: Application
    Filed: August 13, 2020
    Publication date: June 16, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • Method for manufacturing insulating film and semiconductor package
    Patent number: 11361878
    Abstract: The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 14, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Woo Jae Jeong, You Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong
  • ADHESIVE COMPOSITION FOR DICING FILM, DICING FILM AND DICING DIE BOND FILM
    Publication number: 20220154043
    Abstract: The present disclosure provides an adhesive composition for a dicing film, a dicing film, and a dicing die-bonding film, which have excellent pickup performance.
    Type: Application
    Filed: October 8, 2021
    Publication date: May 19, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Ji Ho HAN, Da Ae KIM, Kwang Joo LEE, Mi JANG, Bo Ra YEON, Kwang Su SEO, Mi Seon KIM
  • ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE INCLUDING THE SAME
    Publication number: 20220154053
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.
    Type: Application
    Filed: August 14, 2020
    Publication date: May 19, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • RESIN COMPOSITION FOR BONDING SEMICONDUCTOR AND ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME
    Publication number: 20220098455
    Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 31, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Jong Min Jang, Byoung Ju Choi, Kwang Joo Lee, Yu Lin Sun
  • ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE USING THE SAME AND DICING DIE BONDING FILM USING THE SAME
    Publication number: 20220089916
    Abstract: The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 24, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Jong Min JANG, Kwang Joo LEE, Yu Lin SUN
  • NON-CONDUCTIVE FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR LAMINATE
    Publication number: 20210388244
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 16, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, You Jin KYUNG, Kwang Joo LEE, Ji Ho HAN, Bora YEON, Mi JANG
  • Method for manufacturing heating element
    Patent number: 11178730
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: November 16, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang
  • METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20210313290
    Abstract: The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.
    Type: Application
    Filed: January 23, 2020
    Publication date: October 7, 2021
    Applicant: LG CHEM, LTD.
    Inventors: You Jin KYUNG, Minsu JEONG, Kwang Joo LEE
  • ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20210292618
    Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.
    Type: Application
    Filed: May 8, 2020
    Publication date: September 23, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Youngsam KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Junghak KIM, Ju Hyeon KIM
  • ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM CONTAINING THE SAME
    Publication number: 20210292616
    Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 23, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Junghak KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Ju Hyeon KIM, Youngsam KIM
  • ADHESIVE SHEET FOR TEMPORARY FIXATION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20210171802
    Abstract: An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
    Type: Application
    Filed: March 28, 2019
    Publication date: June 10, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Sera KIM, Ji Ho HAN, Kwang Joo LEE
  • Adhesive film, preparation method of semiconductor device, and semiconductor device
    Patent number: 11021634
    Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: June 1, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Kwang Joo Lee, Young Kook Kim, Seung Hee Nam
  • ADHESIVE COMPOSITION
    Publication number: 20210155831
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Application
    Filed: June 17, 2019
    Publication date: May 27, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi JANG, Sera KIM, Ji Ho HAN, Kwang Joo LEE, Bora YEON, Kwang Su SEO
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10991678
    Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: April 27, 2021
    Inventors: Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Jung Ho Jo, Kwang Joo Lee, Seung Hee Nam, Young Kook Kim