Patents by Inventor Kwang Seok Oh
Kwang Seok Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923280Abstract: A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.Type: GrantFiled: September 2, 2021Date of Patent: March 5, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Won Bae Bang, Kwang Seok Oh
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Patent number: 11878010Abstract: Disclosed is a composition for preventing or treating chronic obstructive pulmonary disease containing regorafenib as an active ingredient, and particularly a pharmaceutical composition for preventing or treating chronic obstructive pulmonary disease containing regorafenib or a pharmaceutically acceptable salt thereof as an active ingredient, in which regorafenib is capable of effectively inhibiting increased immune response, which is a symptom of chronic obstructive pulmonary disease, and of improving and restoring changed lung structure and damaged lung function, and can be effectively used for the manufacture of a medicament for the prevention, amelioration, or treatment of chronic obstructive pulmonary disease, such as emphysema, chronic bronchitis, asthma, or pneumonia.Type: GrantFiled: July 6, 2022Date of Patent: January 23, 2024Assignee: Chungbuk National University Industry-Academic Cooperation FoundationInventors: Eung Gook Kim, Eun Young Shin, Kwang Seok Oh
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Patent number: 11877454Abstract: A vertical memory device includes a substrate, a plurality of gate electrodes vertically stacked over the substrate in a cell array region, and a plurality of multi-layered pad portions formed over the substrate in a contact region. Each multi-layered pad portion of the plurality of multi-layered pad portions extends from an end of a gate electrode of the plurality of gate electrodes. Each multi-layered pad portion of the plurality of multi-layered pad portions includes a lower pad, an upper pad spaced vertically apart from the lower pad, a buffer pad formed between the lower pad and the upper pad, and a pad interconnection portion interconnecting the lower pad and the upper pad.Type: GrantFiled: April 5, 2021Date of Patent: January 16, 2024Assignee: SK hynix Inc.Inventor: Kwang-Seok Oh
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Patent number: 11854991Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: October 26, 2021Date of Patent: December 26, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Publication number: 20230352370Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: May 5, 2023Publication date: November 2, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
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Patent number: 11793772Abstract: Provided is a composition comprising 2,4,6-trihydroxyacetophenone (THA) as an active ingredient, and a method for preventing, alleviating or treating breast cancer using the composition by inhibiting the activity of polo-like kinase 1 (PlK1).Type: GrantFiled: October 19, 2017Date of Patent: October 24, 2023Assignee: KOREA UNITED PHARM. INC.Inventors: Keon Wook Kang, Kwang-Seok Oh, Youngchul Kim, Sung Baek Jeong
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Patent number: 11646248Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.Type: GrantFiled: March 22, 2022Date of Patent: May 9, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
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Publication number: 20230061201Abstract: Disclosed is a composition for preventing or treating chronic obstructive pulmonary disease containing regorafenib as an active ingredient, and particularly a pharmaceutical composition for preventing or treating chronic obstructive pulmonary disease containing regorafenib or a pharmaceutically acceptable salt thereof as an active ingredient, in which regorafenib is capable of effectively inhibiting increased immune response, which is a symptom of chronic obstructive pulmonary disease, and of improving and restoring changed lung structure and damaged lung function, and can be effectively used for the manufacture of a medicament for the prevention, amelioration, or treatment of chronic obstructive pulmonary disease, such as emphysema, chronic bronchitis, asthma, or pneumonia.Type: ApplicationFiled: July 6, 2022Publication date: March 2, 2023Inventors: Eung Gook KIM, Eun Young SHIN, Kwang Seok OH
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Publication number: 20220415733Abstract: In one example, an electronic device comprises a cavity substrate comprising a substrate base comprising a top side and a bottom side and a cavity wall over the substrate base and defining a cavity, an electronic component over the substrate base and in the cavity, a lid comprising a top side and a bottom side, wherein the lid is over the substrate base and the cavity wall to define an interior of the cavity and an exterior of the cavity, an adhesive between the bottom side of the lid and a top side of the cavity wall, and a vent seal between the interior of the cavity and the exterior of the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 29, 2021Publication date: December 29, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kwang Seok Oh, Chang Uk Jang, Jin Seok Ryu, Seung Jae Yu, Weilung Lu, Adrian Arcedera, Seung Mo Kim, Kyung Han Ryu, Yi Seul Han, Woo Jun Kim, Tae Yong Lee
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Publication number: 20220216132Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: March 22, 2022Publication date: July 7, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
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Publication number: 20220181265Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 26, 2021Publication date: June 9, 2022Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Publication number: 20220024932Abstract: The present invention provides a compound having a specific chemical structure and having PDE9A inhibitory activity, or a pharmaceutically acceptable salt thereof. The present invention provides a composition containing the compound or a pharmaceutically acceptable salt thereof. The present invention provides a pharmaceutical use, for treating or preventing PDE9A-related diseases, of the compound according to the present invention, a salt thereof, and a composition containing the compound or salt. The present invention also provides a method for treating or preventing PDE9A-related diseases, the method comprising administering an effective amount of the compound according to the present invention, a salt thereof, or a composition containing the compound or salt to a subject in need of treatment.Type: ApplicationFiled: December 5, 2019Publication date: January 27, 2022Inventors: Chae Jo LIM, Kwang-Seok OH, Jeong Hyun LEE, Kyu Yang YI, Nack Jeong KIM, Byung Ho LEE, Ho Won SEO, Soo Hee KIM, Junyoung CHOI, Mi Young LEE, Ju Hee LEE
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Publication number: 20220017528Abstract: The present invention provides a compound having a specific chemical structure and having PDE9A inhibitory activity, or a pharmaceutically acceptable salt thereof. The present invention provides a composition containing the compound or a pharmaceutically acceptable salt thereof. The present invention provides a pharmaceutical use, for treating or preventing PDE9A-related diseases, of the compound according to the present invention, a salt thereof, and a composition containing the compound or salt. The present invention also provides a method for treating or preventing PDE9A-related diseases, the method comprising administering an effective amount of the compound according to the present invention, a salt thereof, or a composition containing the compound or salt to a subject in need of treatment.Type: ApplicationFiled: December 5, 2019Publication date: January 20, 2022Inventors: Chae Jo LIM, Kwang-Seok OH, Jeong Hyun LEE, Kyu Yang YI, Nack Jeong KIM, Byung Ho LEE, Ho Won SEO, Soo Hee KIM, Junyoung CHOI, Mi Young LEE, Ju Hee LEE
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Publication number: 20210398888Abstract: A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Inventors: Won Bae Bang, Kwang Seok Oh
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Patent number: 11158582Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 4, 2019Date of Patent: October 26, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Patent number: 11127134Abstract: The present specification provides a film defect detection system. The film defect detection system may comprise an image acquisition unit configured to acquire an image of a film in a manufacturing process of the film; a defect detection unit configured to detect defects in the film by analyzing the acquired image of the film, using a machine learning algorithm learned to detect a defect in advance, when receiving the acquired image of the film; and an information output unit configured to output information on the defects in the film detected by the defect detection unit.Type: GrantFiled: October 1, 2019Date of Patent: September 21, 2021Assignee: SKC CO., LTD.Inventors: Il Taek Hong, In Suk Oh, Hyeon Guk Kim, Kwang Seok Oh
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Patent number: 11114369Abstract: A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.Type: GrantFiled: June 28, 2019Date of Patent: September 7, 2021Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Won Bae Bang, Kwang Seok Oh
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Publication number: 20210249439Abstract: A vertical memory device includes a substrate, a plurality of gate electrodes vertically stacked over the substrate in a cell array region, and a plurality of multi-layered pad portions formed over the substrate in a contact region. Each multi-layered pad portion of the plurality of multi-layered pad portions extends from an end of a gate electrode of the plurality of gate electrodes. Each multi-layered pad portion of the plurality of multi-layered pad portions includes a lower pad, an upper pad spaced vertically apart from the lower pad, a buffer pad formed between the lower pad and the upper pad, and a pad interconnection portion interconnecting the lower pad and the upper pad.Type: ApplicationFiled: April 5, 2021Publication date: August 12, 2021Applicant: SK hynix Inc.Inventor: Kwang-Seok OH
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Publication number: 20210175177Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: December 4, 2019Publication date: June 10, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Patent number: 10998333Abstract: A vertical memory device includes a substrate, a plurality of gate electrodes vertically stacked over the substrate in a cell array region, and a plurality of multi-layered pad portions formed over the substrate in a contact region. Each multi-layered pad portion of the plurality of multi-layered pad portions extends from an end of a gate electrode of the plurality of gate electrodes. Each multi-layered pad portion of the plurality of multi-layered pad portions includes a lower pad, an upper pad spaced vertically apart from the lower pad, a buffer pad formed between the lower pad and the upper pad, and a pad interconnection portion interconnecting the lower pad and the upper pad.Type: GrantFiled: July 1, 2019Date of Patent: May 4, 2021Assignee: SK hynix Inc.Inventor: Kwang-Seok Oh