Abstract: A scheme is described of remote control of the slicing level of a receiver in a smart SFP (or SFP+, or XFP) duplex (or BiDi, or SWBiDi) transceiver in a communication system using an operating system with OAM and PP functions, an OAM, PP & Payload Processor, a transceiver, a BERT, and an optical link in the field.

Abstract: An eco-friendly (meth)acrylic flame retardant copolymer includes a phosphorous-based acrylic monomer to provide a high index of refraction and excellent flame retardancy.

Abstract: Disclosed herein is a thermoplastic (meth)acrylate copolymer, which includes a derivative unit obtained from a monomer mixture including: (A) an aromatic (meth)acrylate having an index of refraction from about 1.580 to about 1.700; and (B) a monofunctional unsaturated monomer.

Abstract: A thermoplastic resin composition according to the present invention is characterized by comprising: (A) a polycarbonate resin; and (B) a biphenyl group-containing (meth)acrylic copolymer. As such, the refractive index of the biphenyl group-containing (meth)acrylic copolymer (B) can be approximately from 1.495 to 1.640. The thermoplastic resin composition exhibits superior balance of material properties such as impact strength, internal scratch resistance, transparency, thermal resistance and appearance.

Abstract: The present invention provides a flame retardant acrylic-based copolymer which includes a derivative unit obtained from a monomer mixture comprising: (A) a (meth)acrylic monomer; (B) at least one vinyl monomer selected from the group consisting of an aromatic vinyl monomer and an unsaturated nitrile monomer; and (C) a phosphorus-based (meth)acrylic monomer. The flame retardant acrylic copolymer has high refractivity and exhibits excellent flame retardancy and scratch resistance.

Abstract: A (meth)acrylic copolymer is a copolymer of a monomer mixture including a phosphorus-based (meth)acrylic monomer represented by Formula 1, and a monofunctional unsaturated monomer. The (meth)acrylic copolymer can have improved refractive index, excellent flame resistance, transparency, scratch resistance and/or environment-friendliness: wherein R1 is hydrogen or methyl, R2 is a substituted or unsubstituted C1-C20 hydrocarbon group, R3 and R4 are the same or different and are each independently a substituted or unsubstituted C6-C20 cyclic hydrocarbon group, m is an integer from 1 to 10, and n is an integer from 0 to 5.

Abstract: A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number.

Abstract: A memory system includes a controller having first and second input/output terminals, and first and second memory devices each having first and second input/output terminals. The system includes a path selection mechanism for selectively employing one of the first and second terminals of either the controller or the first memory device for communicating a first input/output signal between the controller and the first memory device, and employing the other one of the first and second terminals for communicating a second input/output signal between the controller and the first memory device. The path selection mechanism selectively employs the first and second terminals in accordance with data indicating which of the first and second terminals of the first memory device is connected to the first terminal of the controller and which of the first and second terminals of the first memory device is connected to the second terminal of the controller.

Abstract: A container cap according to the present invention includes a lower cap combined with a container and comprising an opening communicating with an inside of the container; and an upper cap combined with the lower cap to cover the opening. Further, the upper cap includes a cover covering the opening; a rim provided around the cover and partly connected to the cover; a connection part connecting the rim and the cover; and a handle connected to the rim and having a round shape, which curves outwards from a center of the cover, viewed on a plane.

Abstract: The present invention relates to an environmentally friendly flame-retardant polycarbonate resin composition having scratch resistance, which includes a specific (meth)acrylic flame-retardant copolymer to improve flame retardancy and scratch resistance.

Abstract: An aromatic vinyl-based thermoplastic resin composition includes a rubber-modified acrylic graft copolymer and a branched aromatic vinyl copolymer resin including a silicon compound.

Abstract: A polycarbonate resin composition according to the present invention comprises a polycarbonate resin and an ultra-high molecular weight branched acrylic copolymer resin and can have excellent transparency, appearance, and flowability, as well as scratch resistance and impact strength.

Abstract: The present invention provides a flame-retardant and scratch-resistant polycarbonate resin composition including a (meth)acrylic flame-retardant copolymer.

Abstract: An eco-friendly (meth)acrylic flame retardant copolymer includes a phosphorous-based acrylic monomer to provide a high index of refraction and excellent flame retardancy.

Abstract: The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.

Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

Abstract: A scheme is described for remote control of the wavelength of a tunable transmitter in a smart SFP transceiver, a smart SFP+ transceiver, a smart XFP transceiver, a smart duplex transceiver, a smart BiDi transceiver, or a smart SWF BiDi transceiver in a communication system using an operating system with OAM and PP functions; an OAM, PP & Payload Processor; a transceiver; an optical spectrum analyzer; a BERT; and an optical link in the field.

Abstract: A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number.

Abstract: A scheme is described of remote control of the slicing level of a receiver in a smart SFP (or SFP+, or XFP) duplex (or BiDi, or SWBiDi) transceiver in a communication system using an operating system with OAM and PP functions, an OAM, PP & Payload Processor, a transceiver, a BERT, and an optical link in the field.

Abstract: A scheme is described for remote control of the output power of a transmitter in a smart SFP (or SFP+, or XFP) duplex (or BiDi, or SWBiDi) transceiver in a communication system using an operating system with OAM and PP functions, an OAM, PP & Payload Processor, a transceiver, an optical power meter (optional), a BERT, and an optical link in the field.