Patents by Inventor Kwang-Soo Park

Kwang-Soo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130020327
    Abstract: The present invention relates to a stopper including: an outer cap having an upper surface with a discharge hole and a side extending downward from the outer edge of the upper surface; and an inner cap having a cylindrical body and a protrusion and combined with the outer cap, in which the protrusion has an inclined surface extending upward from the lower edge of the body toward the center and a plurality of inlet/outlet holes formed around the inclined surface, and a container having the stopper. According to the present invention, it is possible to provide a stopper that makes it possible to discharge a desired amount of liquid substance by removing slosh generated when the liquid substance is discharged out of a container, and a container having the stopper.
    Type: Application
    Filed: April 29, 2011
    Publication date: January 24, 2013
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Kwang Soo Park, Jin Hwan Lee
  • Publication number: 20120325866
    Abstract: A fluid storage tank includes: a tank body in which a fluid is stored; and an ejection outlet that is formed on a top surface of the tank body in order to eject the fluid stored in the tank body, wherein the ejection outlet includes a tapered portion having an inner diameter that is increased upward away from the tank body. Accordingly, the fluid is prevented from being jiggled or splashed when being poured.
    Type: Application
    Filed: March 17, 2011
    Publication date: December 27, 2012
    Inventors: Jin Hwan Lee, Sang Gwon Moon, Kwang Soo Park
  • Patent number: 8288494
    Abstract: The present invention provides a transparent thermoplastic resin composition which may comprise (A) about 1 to about 100 parts by weight of an ultra-high molecular weight branched acrylic copolymer resin; (B) about 0 to about 99 parts by weight of an acrylic resin; and (C) about 0 to about 40 parts by weight of an acrylic impact modifier, based on 100 parts by weight of (A) and (B). The ultra-high molecular branched acrylic copolymer resin (A) may be prepared by polymerizing a monomer mixture comprising (a1) about 50 to about 99.899% by weight of a mono-functional monomer, (a2) about 0.1 to about 40% by weight of a (meth)acrylic monomer having a flexible segment represented following Chemical Formula 1, and (a3) about 0.001 to about 10% by weight of a branch-inducing monomer. The thermoplastic resin composition of the present invention can have improved transparency, scratch resistance, flowability, and impact strength.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: October 16, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Kee Hae Kwon, Jin Hwa Chung, Kwang Soo Park, Dong Kil Choi, Il Jin Kim
  • Publication number: 20120152884
    Abstract: The invention relates to a stopper assembly, and more particularly, to an improved stopper to prevent a sloshing of an its liquefied content when a bottle is tilted to allow a predetermined amount of the content to be poured and to allow the content to be easily discharged. A stopper assembly includes a inner cap 20 coupled to an inlet of a bottle 10, an outer cap 30 coupled openly and closely to an outer side of the inner cap 20 to seal the inlet of the bottle 10, wherein the inner cap 20 includes a cylindrical shaped body 21 coupled to the inlet of the bottle 10; a protrusion 22 forming slope 22a extending toward a center of an upper side of the body 21 from an edge of an lower end of the body 21 and forming an plurality of exit holes 22b around the slope 22a.
    Type: Application
    Filed: November 5, 2009
    Publication date: June 21, 2012
    Inventors: Jin Hwan Hwan Lee, Sung Kyu Cho, Kwang Soo Park
  • Publication number: 20120093514
    Abstract: The present invention provides a bi-directional CWDM (or DWDM) transmission system using SWBiDi transceivers for a continuous and simultaneous communication in both directions comprising an optical link fiber, first n CWDM (or DWDM) SWBiDi transceivers at a first end of the optical link fiber, second n CWDM (or DWDM) SWBiDi transceivers at a second end of the optical link fiber, a first optical CWDM (or DWDM) MUX/DEMUX between first n CWDM (or DWDM) SWBiDi transceivers and the optical link fiber, and a second optical CWDM (or DWDM) MUX/DEMUX between second n DWDM SWBiDi transceivers and the optical link fiber.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 19, 2012
    Inventors: Kwang Soo Park, Won Ki Lee, Moon Soo Park, Yong Kwan Park
  • Patent number: 8154946
    Abstract: A device to selectively activate memory chips includes a memory unit including n memory chips activated in response to n memory chip activation signals (n is a natural number), a controller to generate m control signals (m is a natural number), and a memory chip activation signal generator to combine m chip enable (CE) signals to generate the n memory chip activation signals.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: April 10, 2012
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventor: Kwang-Soo Park
  • Publication number: 20120063240
    Abstract: A memory system includes a controller having first and second input/output terminals, and first and second memory devices each having first and second input/output terminals. The system includes a path selection mechanism for selectively employing one of the first and second terminals of either the controller or the first memory device for communicating a first input/output signal between the controller and the first memory device, and employing the other one of the first and second terminals for communicating a second input/output signal between the controller and the first memory device. The path selection mechanism selectively employs the first and second terminals in accordance with data indicating which of the first and second terminals of the first memory device is connected to the first terminal of the controller and which of the first and second terminals of the first memory device is connected to the second terminal of the controller.
    Type: Application
    Filed: August 23, 2011
    Publication date: March 15, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Kwang-Soo Park
  • Patent number: 8116093
    Abstract: A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: February 14, 2012
    Assignee: Samsung Electronics Co. Ltd.
    Inventors: Kwang-Soo Park, Jong-Hoon Kim
  • Publication number: 20120031799
    Abstract: Disclosed is a food storage container including a container body including a bottom part and a lateral part to form an interior space, a bottom film attached to the bottom part, and a lateral film forming a first overlapping part where the lateral film overlaps with the bottom film and a second overlapping part where an end portion overlaps with another end portion, and being attached to the lateral part. The food storage container has an improved film structure as compared with a conventional complicated film structure and has a high oxygen barrier performance.
    Type: Application
    Filed: January 4, 2011
    Publication date: February 9, 2012
    Inventors: Gu-Hoan Cha, Kwang-Soo Park, Kyoung-Sik Jo, Ki-Min Rhyu
  • Patent number: 8107271
    Abstract: A termination circuit is connected to an input buffer receiving a data signal, and includes at least one termination resistor connected to the input buffer for impedance matching. At least one switch controls a connection between the input buffer and a corresponding one of the at least one termination resistors. A control signal generator generates a control signal for selectively enabling the termination circuit by controlling each of the at least one switches. The control signal has an input period less than or equal to an input period of a data signal.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: January 31, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-Soo Park, Jae-Jun Lee, Jong-Hoon Kim, Hoe-Ju Chung
  • Publication number: 20120016068
    Abstract: Disclosed is an aromatic vinyl-based thermoplastic resin composition. The thermoplastic resin composition is based on a thermoplastic resin including a rubber-modified acrylic graft copolymer and uses a branched aromatic vinyl copolymer resin including a silicon compound. The thermoplastic resin composition can exhibit both improved impact resistance and flowability. In addition, the thermoplastic resin composition can have excellent weather resistance and moldability.
    Type: Application
    Filed: December 7, 2010
    Publication date: January 19, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Jin Hwa CHUNG, Kee Hae KWON, Il Jin KIM, Kwang Soo PARK, Ja Kwan KOO
  • Patent number: 8089860
    Abstract: Data transmission system and method are provided. The transmission system includes a data converter and data restoring unit. The data converter converts N-bit first data to be transmitted into M-bit second data, where M is greater than N and the second data is arranged in a minimum unit greater than 1, each minimum unit including at least successive data bits having the same phase. The transmitter compresses the second data prior to transmission via a channel having performance characteristics defining a minimum pulse width, and a receiver receives and de-compresses the transmitted second data. The data restoring unit then restores the first data from the second.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: January 3, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Hoon Kim, Jae-Jun Lee, Kwang-Soo Park
  • Patent number: 8037584
    Abstract: A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes are disclosed. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: October 18, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang-Soo Park, Sim-Hwan Park, Jeong-Yeon Jeong, Dae-Jung Byun
  • Patent number: 8040201
    Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: October 18, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-Soo Park, Byoung-Ha Oh, Yong-Ho Ko
  • Patent number: 7990168
    Abstract: A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: August 2, 2011
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Jong-hoon Kim, Hyun-ae Lee, Jin-ho So, Kwang-soo Park
  • Publication number: 20110160380
    Abstract: A polycarbonate resin composition according to the present invention comprises a polycarbonate resin and an ultra-high molecular weight branched acrylic copolymer resin and can have excellent transparency, appearance, and flowability, as well as scratch resistance and impact strength.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 30, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Kee Hae Kwon, Jin Hwa Chung, Kwang Soo Park, Sang Ki Park, Il Jin Kim
  • Publication number: 20110160383
    Abstract: The present invention provides a transparent thermoplastic resin composition which may comprise (A) about 1 to about 100 parts by weight of an ultra-high molecular weight branched acrylic copolymer resin; (B) about 0 to about 99 parts by weight of an acrylic resin; and (C) about 0 to about 40 parts by weight of an acrylic impact modifier, based on 100 parts by weight of (A) and (B). The ultra-high molecular branched acrylic copolymer resin (A) may be prepared by polymerizing a monomer mixture comprising (a1) about 50 to about 99.899% by weight of a mono-functional monomer, (a2) about 0.1 to about 40% by weight of a (meth)acrylic monomer having a flexible segment represented following Chemical Formula 1, and (a3) about 0.001 to about 10% by weight of a branch-inducing monomer. The thermoplastic resin composition of the present invention can have improved transparency, scratch resistance, flowability, and impact strength.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Kee Hae Kwon, Jin Hwa Chung, Kwang Soo Park, Dong Kil Choi, Il Jin Kim
  • Publication number: 20110063790
    Abstract: An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.
    Type: Application
    Filed: May 21, 2010
    Publication date: March 17, 2011
    Inventors: Kwang-soo Park, Kyung-suk Kim
  • Publication number: 20110032740
    Abstract: A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number.
    Type: Application
    Filed: August 3, 2010
    Publication date: February 10, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventor: Kwang-soo PARK
  • Patent number: 7818488
    Abstract: Pairs of registers with reduced pins are disposed to overlap on front and back surfaces of a memory module. An input signal INS is transferred through the registers in series in a daisy chain fashion to avoid divergence of the input signal INS for preserved signal integrity. Each register buffers the input signal INS to memory banks disposed closely to sides of the register for reduced wiring area.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: October 19, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-Soo Park, Jeong-Hyeon Cho, Byung-Se So, Jung-Joon Lee, Young Yun, Kwang-Seop Kim