Patents by Inventor Kwang-wook Lee
Kwang-wook Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978769Abstract: A semiconductor device includes a source/drain pattern disposed on a substrate and a source/drain contact connected to the source/drain pattern. The source/drain contact includes a lower contact structure extending in a first direction and an upper contact structure protruding from the lower contact structure. The upper contact structure includes a first sidewall and a second sidewall facing away from each other in the first direction. The first sidewall of the upper contact structure includes a plurality of first sub-sidewalls, and each of the first sub-sidewalls includes a concave surface.Type: GrantFiled: May 12, 2022Date of Patent: May 7, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kwang-Young Lee, Jin Wook Lee
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Publication number: 20240145346Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Publication number: 20240128136Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.Type: ApplicationFiled: February 16, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
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Publication number: 20240128605Abstract: Provided are an electrode assembly, a battery, and a battery pack and vehicle including the same. An electrode assembly, in which a first electrode, a second electrode, and a separator interposed therebetween are wound about an axis to define a core and an outer circumferential surface. At least one of the first electrode and the second electrode includes, at a long side end portion, an uncoated portion exposed beyond the separator in a direction of the axis. At least a part of the uncoated portion is bent in a radial direction of the electrode assembly to define a bent surface region having overlapping layers of the uncoated portion. The bent surface region includes a welding target region having a number of the overlapping layers of the uncoated portion, and the welding target region extends along a radial direction of the electrode assembly.Type: ApplicationFiled: February 18, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Min-Woo KIM, Do-Gyun KIM, Kyung-Wook CHO, Geon-Woo MIN, Min-Ki JO, Jae-Woong KIM, Kwang-Su HWANGBO, Hae-Jin LIM, Su-Ji CHOI, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG
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Publication number: 20240112002Abstract: Disclosed is an interface system including a first neuron cluster that outputs a first neuron signal including a first neuron request and first neuron data by performing a first arithmetic operation, and a first interface circuit that stores the first neuron data and outputs a first response, in response to the first neuron request. The first neuron cluster outputs a second neuron signal including a second neuron request and second neuron data by performing a second arithmetic operation, in response to the first response. Before the first data is transmitted to a second neuron cluster different from the first neuron cluster, the first interface circuit outputs the first response in response to a fact that the first neuron data is stored.Type: ApplicationFiled: June 29, 2023Publication date: April 4, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Young Hwan BAE, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In San JEON
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Publication number: 20240104962Abstract: Disclosed are a fingerprint forgery detection device and a method of operating the same. The fingerprint forgery detection device includes a memory that stores a first feature signal including biological channel feature information of a user, a transmitter including at least one transmission electrode for transmitting a pulse signal to the user, a receiver including at least one reception electrode for receiving a biological channel response signal in response to the transmitted pulse signal, and a signal processor for processing the biological channel response signal to detect whether a fingerprint is forged, and at least one processor that controls the memory, the transmitter, and the receiver.Type: ApplicationFiled: June 23, 2023Publication date: March 28, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Tae Wook KANG, Sung Eun KIM, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE
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Publication number: 20240097799Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.Type: ApplicationFiled: June 26, 2023Publication date: March 21, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
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Publication number: 20240097074Abstract: A display device includes a substrate including an emission area and a non-emission area, alignment electrodes arranged to be spaced from each other in a first direction on the substrate and extending in a second direction crossing the first direction, and pixels arranged along the second direction. Pixels adjacent to each other in the second direction from among the pixels may be configured to emit light of different colors. Each of the pixels may include first light emitting elements on the alignment electrodes and arranged along the second direction, second light emitting elements on the alignment electrodes, spaced from the first light emitting elements in the first direction, and arranged along the second direction, a first pixel electrode electrically connected to a first driving power and first ends of the first light emitting elements, a second pixel electrode spaced from the first pixel electrode in the first direction.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Inventors: Myeong Hun SONG, Jang Soon PARK, Sung Geun BAE, Tae Hee LEE, Hyun Wook LEE, Kwang Taek HONG
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Patent number: 11935926Abstract: A method for fabricating a semiconductor device includes forming a stack structure including a horizontal recess over a substrate, forming a blocking layer lining the horizontal recess, forming an interface control layer including a dielectric barrier element and a conductive barrier element over the blocking layer, and forming a conductive layer over the interface control layer to fill the horizontal recess.Type: GrantFiled: January 18, 2023Date of Patent: March 19, 2024Assignee: SK hynix Inc.Inventors: Hyeng-Woo Eom, Jung-Myoung Shim, Young-Ho Yang, Kwang-Wook Lee, Won-Joon Choi
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Publication number: 20240086603Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRONICS CO, LTD.Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
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Patent number: 11927764Abstract: Disclosed is a head mounted display device. The head mounted display device includes a head mount unit wearable on a head of a user, a display unit supported on the head mount unit and sending an image to eyes of the user, and a position adjustment unit coupled to the head mount unit, connected to the display unit, and moving the display unit relative to the head mount unit such that a position of the display unit varies with respect to the eyes of the user.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: MEGAGEN IMPLANT CO., LTD.Inventors: Kwang Bum Park, Hyun Wook An, Keun Oh Park, Tae Gyoun Lee
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Patent number: 11926951Abstract: Disclosed are a motor control apparatus and a motor control method. Specifically, the motor control apparatus includes an inverter part configured to convert a direct current (DC) input into an alternating current (AC) output and provide the AC output to the motor, and a controller configured to control the inverter part in relation to driving of the motor, and the controller controls the inverter part to apply a first pattern voltage having the same phase to the motor and then apply a second pattern voltage having different phases to the motor.Type: GrantFiled: December 7, 2021Date of Patent: March 12, 2024Assignee: LG ELECTRONICS INC.Inventors: Ki Wook Lee, Han Su Jung, Kwang Sik Kim
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Publication number: 20240074736Abstract: An ultrasonic image providing method of the present disclosure includes: receiving ultrasonic images; measuring a plurality of similarities for a plurality of measurement items for at least one of the ultrasonic images; comparing the plurality of similarities with corresponding default thresholds, respectively; when none of the plurality of similarities is greater than the corresponding default threshold, selecting a measurement item maintaining the greatest similarity among the plurality of similarities for a reference time; and providing an ultrasonic image for the selected measurement item as an ultrasonic image.Type: ApplicationFiled: August 19, 2021Publication date: March 7, 2024Applicant: SAMSUNG MEDISON CO., LTD.Inventors: Ja Young Kwon, Ye Jin Park, Jin Yong Lee, Sung Wook Park, Jin Ki Park, Dong Eun Lee, Ji Hun Lee, Kwang Yeon Choi
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Patent number: 11923882Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.Type: GrantFiled: March 25, 2021Date of Patent: March 5, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
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Patent number: 11588026Abstract: A method for fabricating a semiconductor device includes forming a stack structure including a horizontal recess over a substrate, forming a blocking layer lining the horizontal recess, forming an interface control layer including a dielectric barrier element and a conductive barrier element over the blocking layer, and forming a conductive layer over the interface control layer to fill the horizontal recess.Type: GrantFiled: January 13, 2020Date of Patent: February 21, 2023Assignee: SK hynix Inc.Inventors: Hyeng-Woo Eom, Jung-Myoung Shim, Young-Ho Yang, Kwang-Wook Lee, Won-Joon Choi
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Patent number: 10922692Abstract: Provided is a method comprising acquiring information on a branch formed on blockchain data, calculating a difference in a block height between a target block corresponding to a current block height of the blockchain data and a block in a non-branched state based on the information on the branch and calculating a transaction confirmation reliability of transaction data recorded in the target block based on the difference in the block height, wherein the transaction confirmation reliability indicates a probability that, for as k blocks are further connected after the target block, a position of the block at which the transaction data is recorded will not change, wherein k is an integer greater than zero.Type: GrantFiled: March 23, 2018Date of Patent: February 16, 2021Assignee: SAMSUNG SDS CO., LTD.Inventors: Ji Hwan Rhie, Hee Jung Wang, Kwang Wook Lee, Dong Hoe Kim, Seung Won Son
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Publication number: 20200388686Abstract: A method for fabricating a semiconductor device includes forming a stack structure including a horizontal recess over a substrate, forming a blocking layer lining the horizontal recess, forming an interface control layer including a dielectric barrier element and a conductive barrier element over the blocking layer, and forming a conductive layer over the interface control layer to fill the horizontal recess.Type: ApplicationFiled: January 13, 2020Publication date: December 10, 2020Inventors: Hyeng-Woo EOM, Jung-Myoung SHIM, Young-Ho YANG, Kwang-Wook LEE, Won-Joon CHOI
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Patent number: 10818522Abstract: Disclosed are a supercritical process chamber and an apparatus having the same. The process chamber includes a body frame having a protrusion protruding in an upward vertical direction from a first surface of the body frame and a recess defined by the protrusion and the first surface of the body frame; a cover frame; a buffer chamber arranged between the body frame and the cover frame; and a connector. The buffer chamber includes an inner vessel detachably coupled to the body frame providing a chamber space in the recess and an inner cover detachably coupled to the cover frame. The inner cover is in contact with a first surface of the inner vessel enclosing the chamber space from surroundings. The connector couples the body frame and the cover frame having the buffer chamber arranged therebetween such that the enclosed chamber space is transformed into a process space in which the supercritical process is performed.Type: GrantFiled: May 14, 2018Date of Patent: October 27, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Jine Park, Byung-Kwon Cho, Yong-Jhin Cho, Yong-Sun Ko, Yeon-Jin Gil, Kwang-Wook Lee
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Patent number: 10714499Abstract: The method of manufacturing a semiconductor device include: forming conductive patterns in interlayer spaces between interlayer insulating layers, the conductive patterns being separated from each other by a slit passing through the interlayer insulating layers, wherein the conductive patterns include a first by-product; generating a second by-product of a gas phase by reacting the first by-product remaining in the conductive patterns with source gas; and performing an out-gassing process to remove the second by-product.Type: GrantFiled: June 25, 2019Date of Patent: July 14, 2020Assignee: SK hynix Inc.Inventors: Won Joon Choi, Min Sung Ko, Kyeong Bae Kim, Jong Gi Kim, Dong Sun Sheen, Jung Myoung Shim, Young Ho Yang, Hyeng Woo Eom, Kwang Wook Lee, Woo Jae Chung
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Patent number: RE49957Abstract: Provided are a method and apparatus for providing and using content advisory (CA) information on Internet contents. A method of providing CA information by using a CA information server, includes receiving a request for the CA information on a content, from an Internet Protocol television (IPTV); searching for CA information on the content; and transmitting the found CA information to the IPTV. A method of using CA information when an IPTV reproduces a content not having the CA information, according to the present invention, includes transmitting a request for CA information, to a CA information server; receiving the CA information from the CA information server; analyzing the CA information; and applying the CA information.Type: GrantFiled: May 29, 2020Date of Patent: April 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jung-shin Park, Kwang-hyuk Kim, Sung-wook Ahn, Sung-wook Byun, Sang-woong Lee, Eun-Hee Rhim, O-hoon Kwon, Sung-jin Park, In-chul Hwang, Mun-jo Kim