Abstract: A method, system, and computer instructions for using the language of the business domain to express subscriptions to a publish/subscribe messaging system. The resulting notifications sent to the subscriber are instances of the business model used to create the subscription. In other words, a subscriber may subscribe to the messaging system against the same information that the subscriber receives in a notification from the messaging system. The present invention uses the model from the business domain as the basis for notification subscriptions to allow for defining filters directly against the model's attributes, reducing problems caused by translating business models to a middleware description.

Abstract: A method for validating messages in a message queuing software environment before the messages are transmitted to the recipient programs comprising a Message Validating Program (MVP). The present invention makes the message queuing software more efficient by eliminating the transmission of invalid messages through the message channels. The MVP acquires the messages as they are originated by the sender program and analyzes the message by comparing the message header and the message body to validating criteria. The validating criteria are the properties, ranges, types, character sets, and formats of data in the message header and message body that the recipient programs will accept. If the message body and the message header meet the validating criteria, then the message is forwarded to the appropriate message queue. If the message body and/or the message header do not meet the validating criteria, then an error is indicated to the sender program.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thickness of a structure on a specimen and at least one additional property of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: A system and method for load balancing a publish/subscribe messaging system comprising a topic subscription program, a publication program, and a message delivery program is disclosed. The topic subscription program allows a subscriber to subscribe to a topic, and to share a subscription to that topic with other subscribers within the messaging system. The publication program publishes messages to a topic. The message delivery program sends a copy of a message to each subscription and chooses the subscriber within the subscription to receive the message in accordance with a subscription dispatcher. A messaging system which has been configured in accordance with one aspect of the present invention can include a message server; one or more topics stored in the message server; one or more subscriptions associated with at least one of the topics in the message server; and, a subscription program, a publication program and a message delivery program in the server.

Abstract: An alternative registry lookup Java naming and directory interface (JNDI) provider is used to lookup a service endpoint in a registry of a Web service. The alternative registry lookup JNDI provider examines the new registry file for a service-ref-name element and determines if the element is present. If the element is present, the registry lookup JNDI provider retrieves location of the service endpoint using information in the new registry file. If the element is absent, lookup of the service endpoint is deferred to a standard JNDI provider, which determines the location of a service endpoint based on a Web Services Description Language (WSDL) file.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a layer formed on a specimen by a deposition process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, flatness, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to an etch process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: The present invention is a method, system and apparatus for routing messages in a computing enterprise. In accordance with the present invention, one or more stateless message brokers can be coupled to a database of message routing filters. Subscribers to particular messages in the message routing system can register individual filters in the database which describe which types of messages are to be routed to the subscribers rather than with individual stateful message brokers. When a stateless message broker receives an incoming message, the message broker can formulate a single database query based upon artifact attributes encapsulated within the message and the message broker can forward the query to the database. Using the single query, the database can resolve a set of zero or more subscribers who have registered a filter matching the artifact elements in the query. The resolved set of subscribers can be returned to the stateless message broker which can route the messages accordingly.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an implant characteristic and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: A method, system, and computer-program product for automatically monitoring websites (e.g., web-based shopping sites, catalogs, auction sites, etc.) for acquisition parameters (e.g., prices, rental amounts, trading/barter requirements, etc.) on one or more commodities, for a predetermined time period.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: A lens delivery system having a plunger, an injector body and a nozzle portion connected to the injector body, the nozzle portion having a hinged lid and a hollow body with a lens holding platform formed beneath the hinged lid. The inside of the hinged lid contains ribs that help to hold a lens stationary on the platform when the lid is closed. The cartridge has an elongated nozzle tube or tip with a bore, the bore communicating with the lens holding platform. The bottom of the bore is rounded, which causes the edges of the lens between the lens haptics to fold upwardly as the lens is pushed down the bore from the platform by the plunger. The central portion of the optic of the lens is prevented from moving upward during folding by a projection in the lid between the ribs. A removable pin fits into the lid and prevents the lens from moving down the bore of the tip during shipment and storage.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro defects and overlay of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a specimen prior to, during, or subsequent to ion implantation. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, at least one characteristic of defects on at least two sides of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.