Abstract: A battery module includes a battery cell stack in which a plurality of battery cells are stacked; a module frame for housing the battery cell stack; and a heat sink which is formed under the bottom portion of the module frame and cools the plurality of battery cells. The heat sink includes a lower plate and a partition wall portion forming a flowing path of a refrigerant, and the partition wall portion is formed of a shape memory alloy, and the shape of the partition wall portion is deformed according to temperature, thereby changing the flow of the refrigerant.

Abstract: A substrate cleaning composition, a method of cleaning a substrate using the same, and a method of fabricating a semiconductor device using the same, the substrate cleaning composition including a styrene copolymer including a first repeating unit represented by Formula 1-la and a second repeating unit represented by Formula 1-1b; an additive represented by Formula 2-1; and an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

Abstract: A semiconductor package includes a sub semiconductor package disposed over a substrate. The sub semiconductor package includes a sub semiconductor chip with chip pads on its upper surface, a sub molding layer that surrounds the sub semiconductor chip, and a redistribution conductive layer that is connected to each of the chip pads and extends over an upper surface of the sub molding layer. The redistribution conductive layer includes a signal redistribution conductive layer that extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion and a power redistribution conductive layer with a length that is shorter than a length of the signal redistribution conductive layer. The semiconductor package also includes a sub signal interconnector, sub power interconnector, and at least one main semiconductor chip formed over the sub semiconductor package and electrically connected to the substrate or the sub semiconductor chip.

Abstract: A battery module including a battery cell having an electrode lead protruding from an end part thereof, a cell tray on which a plurality of battery cells are mounted, and a busbar mounted on one end part of the cell tray positioned in a direction parallel to a protruding direction of the electrode lead and welded to the electrode lead. The busbar comprises a busbar plate, which is a portion welded to the electrode lead, and a busbar connection part that is formed by bending one end of the busbar plate in a direction perpendicular to a surface of the busbar plate.

Abstract: The present disclosure relates to a battery module having a simplified structure and a method for manufacturing the same.

Abstract: A lamp for a vehicle includes a light source unit, and a light guide lens unit disposed above the light source unit. The light guide lens unit is configured to allow a distance from a center of the light source unit to a peripheral end to be substantially constant. The light guide lens unit includes a reflection unit disposed at a central portion of one surface of the light guide lens unit for reflecting a light incident from the light source unit from a center of the light guide lens unit toward the peripheral end. Further, the reflection unit includes a diffusion lens unit for diffusing the light incident from the light source unit. Accordingly, a first part of the light incident to the light guide lens unit is reflected by the reflection unit, and a second part of the light incident to the light guide lens unit passes through the reflection unit and is incident to the diffusion lens unit.

Abstract: Disclosed is a modified iron oxyhydroxynitrate including iron oxyhydroxynitrate and hydrogen phosphate ions adsorbed on a surface thereof. Also disclosed is a method for preparing the same, a positive electrode for a lithium secondary battery including the modified iron oxyhydroxynitrate as a positive electrode additive, and a lithium secondary battery including the same.

Abstract: The present invention relates to a controlled-release type fertilizer with remarkably decreased floating property, comprising a granular fertilizer core; a coating layer (shell) formed on the surface of the granular fertilizer core, and comprising olefin-based resin; and additives attached on the coating layer, and comprising polyoxyethylene alkyl(-aryl)ether.

Abstract: The present invention relates to a controlled-release type fertilizer with outstandingly decreased floating property, comprising a granular fertilize core; a coating layer (shell) formed on the surface of the granular fertilizer core, and comprising olefin-based resin; and additives attached on the coating layer, and comprising ethylene oxide-propylene oxide-ethylene oxide(EO-PO-EO) or propylene oxide-ethylene oxide-propylene oxide(PO-EO-PO) tri-block copolymer.

Abstract: A semiconductor package including: a base layer; a first chip stack and a second chip stack sequentially stacked over the base layer, each of the first and second chip stacks including a plurality of semiconductor chips which are offset stacked to expose chip pads at one side edge thereof, and the chip pads including stack identification pads for identifying the first chip stack and the second chip stack and chip identification pads for identifying the plurality of semiconductor chips in each of the first and second chip stacks; a first inter-chip wire and a second inter-chip wire connecting power-applied ones of the chip identification pads of the plurality of semiconductor chips of the first and second chip stacks; a first stack wire and second stack wire connecting the chip identification pad of a lowermost semiconductor chip of the first and second chip stacks to the base layer.

Abstract: A semiconductor package including: a base layer; and a first chip stack and a second chip stack sequentially stacked over the base layer, each of the first and second chip stacks including first to fourth semiconductor chips which are offset stacked to expose chip pads at one side edge thereof, and the chip pads including stack identification pads for identifying the first chip stack and the second chip stack, and first and second chip identification pads for identifying the first to fourth semiconductor chips in each of the first and second chip stacks.

Abstract: A panel control circuit configured to control a display panel includes a plurality of pixels. The panel control circuit includes a controller configured to output an image data and a source driver, including an output circuit and an output control circuit, configured to generate data signals based on the image data. The controller is configured to output an output change signal for changing an output of the source driver. The output circuit is configured to output the data signals to the display panel, and the output control circuit is configured to output an adjusting current to the output circuit in a signal transition section of the output change signal.

Abstract: A lamp for a vehicle includes a light source unit, and a light guide lens unit disposed above the light source unit. The light guide lens unit is configured to allow a distance from a center of the light source unit to a peripheral end to be substantially constant. The light guide lens unit includes a reflection unit disposed at a central portion of one surface of the light guide lens unit for reflecting a light incident from the light source unit from a center of the light guide lens unit toward the peripheral end. Further, the reflection unit includes a diffusion lens unit for diffusing the light incident from the light source unit. Accordingly, a first part of the light incident to the light guide lens unit is reflected by the reflection unit, and a second part of the light incident to the light guide lens unit passes through the reflection unit and is incident to the diffusion lens unit.

Abstract: The present invention relates to a method for producing metallic lithium, and specifically a method for preparing lithium metal according to an embodiment of the present invention, comprises: preparing lithium phosphate; preparinge a mixture by adding a chlorine compound to the lithium phosphate; heating the mixture; obtaining lithium chloride by reacting the lithium phosphate and the chloride compound in the mixture; producing molten lithium metal by electrolyzing the lithium chloride; and recovering the molten lithium metal is disclosed.

Abstract: A semiconductor package includes: a sub semiconductor package disposed over a substrate, the sub semiconductor package including a sub semiconductor chip which has chip pads on its upper surface, a molding layer which surrounds side surfaces of the sub semiconductor chip, and a redistribution layer formed over the sub semiconductor chip and the molding layer, the redistribution layer including redistribution conductive layers which are connected to the chip pads of the sub semiconductor chip and extend onto edges of the molding layer while having redistribution pads on their end portions; first sub package interconnectors connected to the redistribution pads to electrically connect the sub semiconductor chip and the substrate; a capacitor formed in the molding layer and including a first electrode, a second electrode, and a body portion, the first and second electrodes having upper surfaces which are connected to the redistribution conductive layers, respectively.

Abstract: A vehicle lamp includes a light source system; a reflection system including a plurality of reflective faces to reflect light beams emitted from the light source system to travel forward; and an optical system including a plurality of lenses respectively corresponding to the plurality of reflective faces. The optical system is configured to transmit at least a portion of light reflected from each of the plurality of reflective faces through a corresponding lens among the plurality of lenses to form a predetermined light irradiation pattern.

Abstract: An implantable lead having adjustable electrode locations and a system for controlling the same. The implantable lead may include a plurality of first electrodes exposed and formed at an upper part of a main body at given intervals, a plurality of second electrodes coupled to a stepped lower part of the main body and configured to deliver a stimulus signal to a core area into which the lead is inserted, and a plurality of signal lines embedded in the main body and configured to connect the first electrodes and the second electrodes in a one-to-one manner. In this case, a slot for coupling and up and down movement of the second electrodes may be formed in the lower part. As the second electrodes are individually moved along the slot by an external force acting on the signal lines, locations of the second electrodes in the lower part may be adjusted.

Abstract: A semiconductor package includes a sub semiconductor package disposed over a substrate. The sub semiconductor package includes a sub semiconductor chip with chip pads on its upper surface, a sub molding layer that surrounds the sub semiconductor chip, and a redistribution conductive layer that is connected to each of the chip pads and extends over an upper surface of the sub molding layer. The redistribution conductive layer includes a signal redistribution conductive layer that extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion and a power redistribution conductive layer with a length that is shorter than a length of the signal redistribution conductive layer. The semiconductor package also includes a sub signal interconnector, sub power interconnector, and at least one main semiconductor chip formed over the sub semiconductor package and electrically connected to the substrate or the sub semiconductor chip.

Abstract: A semiconductor package includes: a sub semiconductor package disposed over a substrate, the sub semiconductor package including a sub semiconductor chip which has chip pads on its upper surface, a molding layer which surrounds side surfaces of the sub semiconductor chip, and a redistribution layer formed over the sub semiconductor chip and the molding layer, the redistribution layer including redistribution conductive layers which are connected to the chip pads of the sub semiconductor chip and extend onto edges of the molding layer while having redistribution pads on their end portions; first sub package interconnectors connected to the redistribution pads to electrically connect the sub semiconductor chip and the substrate; a capacitor formed in the molding layer and including a first electrode, a second electrode, and a body portion, the first and second electrodes having upper surfaces which are connected to the redistribution conductive layers, respectively.

Abstract: A panel control circuit configured to control a display panel includes a plurality of pixels. The panel control circuit includes a controller configured to output an image data and a source driver, including an output circuit and an output control circuit, configured to generate data signals based on the image data. The controller is configured to output an output change signal for changing an output of the source driver. The output circuit is configured to output the data signals to the display panel, and the output control circuit is configured to output an adjusting current to the output circuit in a signal transition section of the output change signal.