Patents by Inventor Kyu-Bum Han

Kyu-Bum Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200259267
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.
    Type: Application
    Filed: October 31, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
  • Publication number: 20200259269
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Application
    Filed: December 23, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
  • Publication number: 20200220268
    Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.
    Type: Application
    Filed: June 11, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics., Ltd.
    Inventors: Nam Ki KIM, Jeong Ki RYOO, Kyu Bum HAN, Young Kyoon IM, Won Cheol LEE
  • Patent number: 10679955
    Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 9, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han
  • Publication number: 20200176877
    Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.
    Type: Application
    Filed: June 11, 2019
    Publication date: June 4, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Nam Ki KIM, Jeong Ki RYOO, Kyu Bum HAN, Young Kyoon IM
  • Publication number: 20200112081
    Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.
    Type: Application
    Filed: July 8, 2019
    Publication date: April 9, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong In KIM, Hyung Ho SEO, Young Kyoon IM, Kyu Bum HAN, Jeong Ki RYOO
  • Publication number: 20200007103
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Application
    Filed: October 31, 2018
    Publication date: January 2, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin NAM, Kyu Bum HAN, Jae Soon LEE, Young Kyoon IM
  • Publication number: 20190326674
    Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
    Type: Application
    Filed: March 8, 2019
    Publication date: October 24, 2019
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung In KANG, Jeong Ki RYOO, Kyu Bum HAN
  • Publication number: 20190237861
    Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
    Type: Application
    Filed: November 9, 2018
    Publication date: August 1, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Yong AN, Sang Jong LEE, Seong Hee CHOI, Kyu Bum HAN, Jeong Ki RYOO, Byeong Cheol MOON, Chang Hak CHOI
  • Publication number: 20190194529
    Abstract: A delivery vehicle is used in a smart proppant platform technology. The delivery vehicle includes a porous substrate and an active agent that interacts with at least one constituent in an operating environment of a target location in which the delivery vehicle is deployed. The active agent changes physical or chemical characteristics of the constituent to facilitate a beneficial effect. A non-polymeric encapsulating coating is maintained until the delivery vehicle reaches the target location, wherein the operating environment of the target location causes the encapsulating coating to dissolve and release the active agent into the operating environment of the target location to facilitate the beneficial effect. In one disclosed example, the proppant is designed to maintain the opening of a hydraulically induced fracture in a subterranean formation, while also allowing for the controlled delivery of active agents. It may be used to enhance the recovery of oils and gases.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 27, 2019
    Inventors: Kyu-Bum Han, James J. Steppan, Balakrishnan Nair, John McLennan, Taylor D. Sparks
  • Patent number: 10190041
    Abstract: The present disclosure describes proppant materials encapsulated with a polymer encapsulation layer. Proppant particles are formed with a core having relatively larger inner pores and a shell having relatively smaller shell pores. The shell pores and/or inner pores can be loaded with a treatment product, such as a methanogenic microbial consortium capable of converting coal into methane. The polymer encapsulation layer surrounds the shell and provides for sustained time-release of the treatment product when the proppant material has been delivered to a subterranean formation.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: January 29, 2019
    Assignee: University of Utah Research Foundation
    Inventors: Kyu-Bum Han, John Fuertez, John McLennan, Taylor D. Sparks
  • Patent number: 10170410
    Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: January 1, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Tae Hoon Kim
  • Publication number: 20180256613
    Abstract: The present invention relates to nanoemulsion type synthetic red blood cells having a calcium phosphate coating of controllable thickness, and to a preparation method thereof. According to the present invention, Ca2+ and PO42? coating layers are uniformly and sequentially formed using a layer-by-layer (LBL) coating method while controlling the thicknesses of the coating layers. Thus, the oxygen capacity and oxygen release rate of the synthetic red blood cells can be controlled, and the synthetic red blood cells can be retrieved and reused.
    Type: Application
    Filed: March 29, 2017
    Publication date: September 13, 2018
    Inventor: Kyu-Bum Han
  • Patent number: 10071111
    Abstract: The present invention relates to nanoemulsion type synthetic red blood cells having a calcium phosphate coating of controllable thickness, and to a preparation method thereof. According to the present invention, Ca2+ and PO42? coating layers are uniformly and sequentially formed using a layer-by-layer (LBL) coating method while controlling the thicknesses of the coating layers. Thus, the oxygen capacity and oxygen release rate of the synthetic red blood cells can be controlled, and the synthetic red blood cells can be retrieved and reused.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: September 11, 2018
    Inventor: Kyu-Bum Han
  • Patent number: 10068824
    Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Thomas A Kim, Kyu Bum Han, Chang Moo Jung, Kyung In Kang, Sang Kyu Lee
  • Patent number: 10068855
    Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Kwan Hoo Son
  • Publication number: 20180197831
    Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.
    Type: Application
    Filed: October 19, 2017
    Publication date: July 12, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyun KIM, Thomas A. KIM, Kyu Bum HAN
  • Publication number: 20180076147
    Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.
    Type: Application
    Filed: May 18, 2017
    Publication date: March 15, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun KIM, Thomas A. KIM, Kyu Bum HAN, Kwan Hoo SON
  • Publication number: 20180053719
    Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
    Type: Application
    Filed: May 19, 2017
    Publication date: February 22, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyun KIM, Thomas A. KIM, Kyu Bum HAN, Tae Hoon KIM
  • Publication number: 20180037810
    Abstract: The present disclosure describes proppant materials encapsulated with a polymer encapsulation layer. Proppant particles are formed with a core having relatively larger inner pores and a shell having relatively smaller shell pores. The shell pores and/or inner pores can be loaded with a treatment product, such as a methanogenic microbial consortium capable of converting coal into methane. The polymer encapsulation layer surrounds the shell and provides for sustained time-release of the treatment product when the proppant material has been delivered to a subterranean formation.
    Type: Application
    Filed: June 2, 2017
    Publication date: February 8, 2018
    Inventors: Kyu-Bum Han, John Fuertez, John McLennan, Taylor D. Sparks