Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.

Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.

Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

Abstract: A delivery vehicle is used in a smart proppant platform technology. The delivery vehicle includes a porous substrate and an active agent that interacts with at least one constituent in an operating environment of a target location in which the delivery vehicle is deployed. The active agent changes physical or chemical characteristics of the constituent to facilitate a beneficial effect. A non-polymeric encapsulating coating is maintained until the delivery vehicle reaches the target location, wherein the operating environment of the target location causes the encapsulating coating to dissolve and release the active agent into the operating environment of the target location to facilitate the beneficial effect. In one disclosed example, the proppant is designed to maintain the opening of a hydraulically induced fracture in a subterranean formation, while also allowing for the controlled delivery of active agents. It may be used to enhance the recovery of oils and gases.

Abstract: The present disclosure describes proppant materials encapsulated with a polymer encapsulation layer. Proppant particles are formed with a core having relatively larger inner pores and a shell having relatively smaller shell pores. The shell pores and/or inner pores can be loaded with a treatment product, such as a methanogenic microbial consortium capable of converting coal into methane. The polymer encapsulation layer surrounds the shell and provides for sustained time-release of the treatment product when the proppant material has been delivered to a subterranean formation.

Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.

Abstract: The present invention relates to nanoemulsion type synthetic red blood cells having a calcium phosphate coating of controllable thickness, and to a preparation method thereof. According to the present invention, Ca2+ and PO42? coating layers are uniformly and sequentially formed using a layer-by-layer (LBL) coating method while controlling the thicknesses of the coating layers. Thus, the oxygen capacity and oxygen release rate of the synthetic red blood cells can be controlled, and the synthetic red blood cells can be retrieved and reused.

Abstract: The present invention relates to nanoemulsion type synthetic red blood cells having a calcium phosphate coating of controllable thickness, and to a preparation method thereof. According to the present invention, Ca2+ and PO42? coating layers are uniformly and sequentially formed using a layer-by-layer (LBL) coating method while controlling the thicknesses of the coating layers. Thus, the oxygen capacity and oxygen release rate of the synthetic red blood cells can be controlled, and the synthetic red blood cells can be retrieved and reused.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.

Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.

Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.

Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.

Abstract: The present disclosure describes proppant materials encapsulated with a polymer encapsulation layer. Proppant particles are formed with a core having relatively larger inner pores and a shell having relatively smaller shell pores. The shell pores and/or inner pores can be loaded with a treatment product, such as a methanogenic microbial consortium capable of converting coal into methane. The polymer encapsulation layer surrounds the shell and provides for sustained time-release of the treatment product when the proppant material has been delivered to a subterranean formation.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: A method of controlling torque of a permanent magnet synchronous motor (PMSM) by using a speed-torque lookup table may include: receiving a current direct-current (DC) link voltage of an inverter configured to drive the PMSM and a speed of a rotor of the PMSM; calculating a change ratio of a DC link voltage based on the current DC link voltage and a DC link voltage at a time when the speed-torque lookup table is generated; calculating a normalized speed of the rotor according to a change in the DC link voltage by using the speed of the rotor and the change ratio of the DC link voltage; and/or transferring the normalized speed of the rotor as an input to the speed-torque lookup table.

Abstract: According to example embodiments, a method of driving a power switch device includes applying a first voltage to a gate electrode of the power switch device, and applying a drive voltage to the gate electrode of the power switch device after applying the first voltage to the gate electrode of the power switch device. The first voltage is higher than the drive voltage of the power switch device in a turn-on state.

Abstract: A power conversion apparatus including a current source converter configured to convert Alternate Current (AC) power to Direct Current (DC) power; a power controller configured to set a d-axis current command and a q-axis current command, which correspond to the AC power to the current source converter, by reflecting a difference between a measurement DC link voltage measured at an output terminal of the current source converter and a DC link voltage set by a DC link voltage command; and a phase angle controller configured to adjust a phase angle of the current source converter and transmit the adjusted phase angle to the current source converter, in response to the d-axis current command and the q-axis current command.