Patents by Inventor Kyu-Bum Han

Kyu-Bum Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210313694
    Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 7, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki LIM, Young Sik HUR, Kyu Bum HAN, Ju Hyoung PARK, Myeong Woo HAN, Jeong Ki RYOO
  • Patent number: 11128030
    Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: September 21, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Hyung Ho Seo, Young Kyoon Im, Kyu Bum Han, Jeong Ki Ryoo
  • Patent number: 11121476
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
  • Publication number: 20210275983
    Abstract: The present invention relates to a dielectric packing material for converting carbon dioxide to a valuable material using non-thermal plasma technology, and more particularly, to a dielectric packing material for converting carbon dioxide to a valuable material using non-thermal plasma technology, wherein the dielectric packing material is packed in a non-thermal plasma reactor for conversion of carbon dioxide to a valuable material and is formed to have a hollow structure with multiple edges on the surface thereof to effectively scatter non-thermal plasma at the edges and thereby to improve CO2 conversion and energy efficiency.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventor: Kyu Bum Han
  • Publication number: 20210175629
    Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung In KANG, Jeong Ki RYOO, Kyu Bum HAN
  • Patent number: 11018418
    Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: May 25, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Yong An, Sang Jong Lee, Seong Hee Choi, Kyu Bum Han, Jeong Ki Ryoo, Byeong Cheol Moon, Chang Hak Choi
  • Publication number: 20210151899
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Application
    Filed: March 18, 2020
    Publication date: May 20, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hyoung PARK, Young Sik HUR, Sung Yong AN, Myeong Woo HAN, Kyu Bum HAN, Dae Ki LIM
  • Patent number: 11005184
    Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: May 11, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Jeong Ki Ryoo, Kyu Bum Han, Young Kyoon Im
  • Patent number: 10985442
    Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki Ryoo, Nam Ki Kim, Eun Young Jung, Hong In Kim, Ju Hyoung Park, Won Cheol Lee, Kyu Bum Han
  • Patent number: 10957982
    Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung In Kang, Jeong Ki Ryoo, Kyu Bum Han
  • Publication number: 20200411997
    Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Nam Ki KIM, Jeong Ki RYOO, Kyu Bum HAN, Young Kyoon IM
  • Publication number: 20200412017
    Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.
    Type: Application
    Filed: October 24, 2019
    Publication date: December 31, 2020
    Applicants: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Ju Hyoung PARK, Jung Woo SEO, Jung Suek OH, Jeong Ki RYOO, Kyu Bum HAN
  • Publication number: 20200411991
    Abstract: An antenna apparatus includes a feed line; a ground plane surrounding a portion of the feed line; a feed via electrically connected to the feed line and extending from a first side of the feed line; a first end-fire antenna pattern disposed on a first side of at least a portion of the ground plane and spaced apart from the ground plane, and electrically connected to the feed via; a second end-fire antenna pattern disposed on a second side of the feed line opposite the first side of the feed line and spaced apart from the first end-fire antenna pattern; and a core via electrically connecting the first end-fire antenna patterns to the second end-fire antenna pattern.
    Type: Application
    Filed: January 8, 2020
    Publication date: December 31, 2020
    Applicants: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Ju Hyoung PARK, In Seop YOON, Jung Suek OH, Jeong Ki RYOO, Kyu Bum HAN
  • Publication number: 20200358158
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 12, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin NAM, Kyu Bum HAN, Jae Soon LEE, Young Kyoon IM
  • Publication number: 20200328518
    Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.
    Type: Application
    Filed: October 23, 2019
    Publication date: October 15, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Won Cheol LEE, Sung Yong AN, Kyu Bum HAN
  • Publication number: 20200303805
    Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.
    Type: Application
    Filed: July 18, 2019
    Publication date: September 24, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki RYOO, Nam Ki KIM, Eun Young JUNG, Hong In KIM, Ju Hyoung PARK, Won Cheol LEE, Kyu Bum HAN
  • Patent number: 10763563
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin Nam, Kyu Bum Han, Jae Soon Lee, Young Kyoon Im
  • Publication number: 20200259267
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.
    Type: Application
    Filed: October 31, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
  • Publication number: 20200259269
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Application
    Filed: December 23, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
  • Publication number: 20200220268
    Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.
    Type: Application
    Filed: June 11, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics., Ltd.
    Inventors: Nam Ki KIM, Jeong Ki RYOO, Kyu Bum HAN, Young Kyoon IM, Won Cheol LEE