Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract: A super-hydrophobic fiber of the present disclosure includes: a nano-needle fiber having a surface including needle-shaped nano structures; and a coating layer disposed on the surface including the nano structures, and containing a hydrophobic material. The fiber has no aging effect, and thus, is excellent in durability, and has such a large contact angle and such as small sliding angle that the fiber may not be wet with water. A method for fabricating the super-hydrophobic fiber includes: a preparation step of preparing a pre-treating fiber; an etching step of etching a surface and an inner portion of the pre-treating fiber to fabricate a nano-needle fiber having a surface on which needle-shaped nano structures are formed; and a coating step of forming a coating layer containing a hydrophobic material, and enables mass production and is performed by simple processes.

Abstract: A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate including a mounting electrode formed on both sides and a wiring; a plurality of first electronic devices mounted on the substrate; a second electronic devices mounted on the substrate; and a via through which the wiring of the substrate and the second electronic devices are connected.

Abstract: Disclosed herein is a MEMS device package including a hollow tubular part, a top cap formed to cover a top opening of the tubular part, a bottom cap formed to cover a bottom opening of the tubular part, and a sensor device equipped in a cavity of the tubular part. The MEMS device can use tubular parts having a variety of cross sections and also enhance an impact resistance by inserting a damper into the tubular part.

Abstract: There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors.

Abstract: There is provided a semiconductor package including a first semiconductor package including a first semiconductor chip and a first substrate on which the first semiconductor chip is mounted and in which a via hole is formed outwardly of the first semiconductor chip, a second semiconductor package including a second semiconductor chip, a second substrate, on which the second semiconductor chip is mounted and in which a through hole is formed outwardly of the second semiconductor chip, and a connection member extended from the second substrate and connected to the first substrate, and a conductive member disposed in the through hole and extended to the outside of the second substrate to be electrically connected to a first upper wiring pattern formed on the first substrate. The second substrate and the connection member are formed of a conductive material.

Abstract: Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.

Abstract: Disclosed herein are an external connection terminal, a semiconductor package having the external connection terminal, and a method of manufacturing the same. The external connection terminal includes an internal insulating material, an external insulating material formed to enclose the internal insulating material, and metal lines formed between the internal insulating material and the external insulating material.

Abstract: Disclosed herein is a power semiconductor package. The power semiconductor package according to a preferred embodiment of the present invention includes: a semiconductor device; a circuit pattern formed on the semiconductor device; a molding member burying the semiconductor device and the circuit pattern and formed so as to expose one surface of the circuit pattern; and a heat radiating member adhered to the circuit pattern exposed by the molding member and formed of a non-conductive material.

Abstract: The invention features a composition comprising a self-healing interpenetrating network hydrogel comprising a first network and a second network. The first network comprises covalent crosslinks and the second network comprises ionic or physical crosslinks. For example, the first network comprises a polyacrylamide polymer and second network comprises an alginate polymer.

Abstract: An electrode for a lithium secondary battery including a silicon-based alloy having an expansion coefficient of 10% or greater and an electrochemically inactive whisker, and a lithium secondary battery using the electrode for a lithium secondary battery.

Abstract: A method to prepare low reflective surface according to an example of the present invention comprises: the first step to prepare materials having pillar structure on the surface; the second step to prepare aluminum surface-materials by treating for the pillar structure to have aluminum surface; and the third step to prepare a low reflective surface with dual protuberance structure by forming nano-flake layer on the pillar surface of the material surface through oxidation of the surface aluminum of the aluminum surface-materials. The method to prepare low reflective surface can provide a low reflective surface structure that can be applied to photovoltaic device surface or various display surface as a surface able to reduce reflection significantly by absorbing wavelengths in the range of visible and infrared ray through internally total reflection with simple, low cost, and ecofriendly process.

Abstract: A method for fabricating a hydrophilic aluminum surface includes: an activation step of preparing doped aluminum having an activated surface through doping treatment on a part or whole of an aluminum surface with applying reactive gas thereto; and a structure forming step of preparing a hydrophilic aluminum surface through oxidizing treatment on the doped aluminum to have nano-patterns comprising nano-protrusion structures on the aluminum surface. Hydrophobic aluminum can be fabricated into artificially hydrophilic or super-hydrophilic aluminum, and the hydrophilic aluminum surface body that does not have an aging effect and has long-lasting hydrophilicity can be provided.

Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Abstract: Disclosed is a membrane electrode assembly with enhanced hydrophobicity and a method for manufacturing the same. In particular, a nano pattern with a high aspect ratio is formed in a catalyst support on the surface of a catalyst layer constituting the membrane electrode assembly using plasma etching. A hydrophobic thin film is then formed on the nano pattern formed in the catalyst support.

Abstract: Disclosed is a membrane electrode assembly with enhanced hydrophobicity and a method for manufacturing the same. In particular, a nano pattern with a high aspect ratio is formed in a catalyst support on the surface of a catalyst layer constituting the membrane electrode assembly using plasma etching. A hydrophobic thin film is then formed on the nano pattern formed in the catalyst support.