Abstract: The present disclosure relates to a hybrid organic-inorganic thin film producing method including an interlayer connection between an inorganic cross-linked layer and an organic polymer through a molecular layer deposition (MLD) method, a hybrid organic-inorganic thin film produced by the producing method, and an organic electronic device and a thin film transistor containing the hybrid organic-inorganic thin film.

Abstract: Provided is a grain-oriented electric steel sheet and a method for manufacturing same, the steel sheet having superior magnetic properties. The method comprises heating a slab comprising 2.0 to 4.5 weight % of Si, 0.001 to 0.10 weight % of C, 0.010 weight % or lower of Al, 0.08 weight % or lower of Mn, 0.005 weight % or lower of N, 0.002 to 0.050 weight % of S, the remainder being Fe and other unavoidable impurities, performing hot-rolling of the heated slab, performing cold-rolling one time or two or more times including an intermediate annealing, performing decarbonization and re-crystallizing annealing, and performing secondary re-crystallizing annealing.

Abstract: The present disclosure relates to a hybrid organic-inorganic thin film producing method including an interlayer connection between an inorganic cross-linked layer and an organic polymer through a molecular layer deposition (MLD) method, a hybrid organic-inorganic thin film produced by the producing method, and an organic electronic device and a thin film transistor containing the hybrid organic-inorganic thin film.

Abstract: A method for manufacturing a high magnetic flux density grain oriented electrical steel sheet is disclosed. A silicon steel slab is heated and hot-rolled, and the steel sheet is annealed and cold-rolled and decarburized. An annealing separator is spread on the steel sheet, and a final high temperature annealing is carried out. The silicon steel contains in weight % 0.02-0.045% of C, 2.90-3.30% of Si, 0.05-0.30% of Mn, 0.005-0.019% of Al, 0.003-0.008% of N, 0.006% or less of S (the above being main ingredients), 0.001-0.012% of B, and a balance of Fe and unavoidable impurities; or the above main ingredients plus 0.30-0.70% of Cu, 0.03-0.07% of Ni, 0.03-0.07% of Cr, and a balance of Fe and unavoidable impurities; or the above main ingredients plus 0.001-0.012% of B, 0.30-0.70% of Cu, 0.03-0.07% of Ni, 0.03-0.07% of Cr, and a balance of Fe and unavoidable impurities.