Patents by Inventor Kyu-Bum Han
Kyu-Bum Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11855355Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.Type: GrantFiled: December 29, 2021Date of Patent: December 26, 2023Assignees: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB FoundationInventors: Ju Hyoung Park, Jung Woo Seo, Jung Suek Oh, Jeong Ki Ryoo, Kyu Bum Han
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Publication number: 20230258419Abstract: The present disclosure relates to particles for heat transfer and/or heat storage. Particularly, by coating metal oxides on the silica surface, the solar absorptivity becomes higher than the conventional ceramic proppant. The particles the present disclosure are durable at ultra-high temperatures while their solar absorptivity is recoverable multiple time as heat transfer and/or heat storage. The present disclosure can be applied to concentrating solar power industry. The present disclosure significantly reduces the Levelized cost of the energy due to low-cost product and high solar absorptivity.Type: ApplicationFiled: February 14, 2023Publication date: August 17, 2023Inventors: Kyu Bum HAN, Eunjin JEON, Patrick DAVENPORT, Zhiwen MA
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Patent number: 11721913Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: GrantFiled: August 11, 2021Date of Patent: August 8, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
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Patent number: 11699855Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.Type: GrantFiled: February 19, 2021Date of Patent: July 11, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung In Kang, Jeong Ki Ryoo, Kyu Bum Han
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Patent number: 11658420Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.Type: GrantFiled: September 16, 2020Date of Patent: May 23, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Kyu Bum Han, Young Kyoon Im
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Patent number: 11646504Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.Type: GrantFiled: April 7, 2022Date of Patent: May 9, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Young Sik Hur, Sung Yong An, Myeong Woo Han, Kyu Bum Han, Dae Ki Lim
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Publication number: 20220344821Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.Type: ApplicationFiled: July 6, 2022Publication date: October 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Won Cheol LEE, Sung Yong AN, Kyu Bum HAN
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Patent number: 11417959Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.Type: GrantFiled: October 23, 2019Date of Patent: August 16, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Won Cheol Lee, Sung Yong An, Kyu Bum Han
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Publication number: 20220231431Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.Type: ApplicationFiled: April 7, 2022Publication date: July 21, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hyoung PARK, Young Sik HUR, Sung Yong AN, Myeong Woo HAN, Kyu Bum HAN, Dae Ki LIM
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Patent number: 11342663Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.Type: GrantFiled: June 11, 2019Date of Patent: May 24, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Kyu Bum Han, Young Kyoon Im, Won Cheol Lee
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Patent number: 11342643Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.Type: GrantFiled: July 23, 2020Date of Patent: May 24, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Joong Jin Nam, Kyu Bum Han, Jae Soon Lee, Young Kyoon Im
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Patent number: 11322857Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.Type: GrantFiled: March 18, 2020Date of Patent: May 3, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Young Sik Hur, Sung Yong An, Myeong Woo Han, Kyu Bum Han, Dae Ki Lim
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Patent number: 11316272Abstract: An antenna apparatus includes a feed line; a ground plane surrounding a portion of the feed line; a feed via electrically connected to the feed line and extending from a first side of the feed line; a first end-fire antenna pattern disposed on a first side of at least a portion of the ground plane and spaced apart from the ground plane, and electrically connected to the feed via; a second end-fire antenna pattern disposed on a second side of the feed line opposite the first side of the feed line and spaced apart from the first end-fire antenna pattern; and a core via electrically connecting the first end-fire antenna patterns to the second end-fire antenna pattern.Type: GrantFiled: January 8, 2020Date of Patent: April 26, 2022Assignees: Samsung Electro-Mechanics Co., Ltd., SEOUL NATIONAL UNIVERSITY R&BD FOUNDATIONInventors: Ju Hyoung Park, In Seop Yoon, Jung Suek Oh, Jeong Ki Ryoo, Kyu Bum Han
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Publication number: 20220123480Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.Type: ApplicationFiled: December 29, 2021Publication date: April 21, 2022Applicants: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB FoundationInventors: Ju Hyoung PARK, Jung Woo SEO, Jung Suek OH, Jeong Ki RYOO, Kyu Bum HAN
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Publication number: 20220102872Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
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Patent number: 11245192Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.Type: GrantFiled: August 25, 2020Date of Patent: February 8, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dae Ki Lim, Young Sik Hur, Kyu Bum Han, Ju Hyoung Park, Myeong Woo Han, Jeong Ki Ryoo
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Patent number: 11245201Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.Type: GrantFiled: October 24, 2019Date of Patent: February 8, 2022Assignees: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB FoundationInventors: Ju Hyoung Park, Jung Woo Seo, Jung Suek Oh, Jeong Ki Ryoo, Kyu Bum Han
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Patent number: 11233336Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: GrantFiled: October 31, 2019Date of Patent: January 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An
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Publication number: 20210376490Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
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Publication number: 20210313694Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.Type: ApplicationFiled: August 25, 2020Publication date: October 7, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Dae Ki LIM, Young Sik HUR, Kyu Bum HAN, Ju Hyoung PARK, Myeong Woo HAN, Jeong Ki RYOO