Patents by Inventor Kyung Ho Lee
Kyung Ho Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10651219Abstract: An image sensor and a method for fabricating the same are provided, in which the image sensor includes a substrate including a first sensing region having a photoelectric device therein, a boundary isolation film partitioning the first sensing region, an inner reflection pattern film within the substrate in the sensing region, an infrared filter on the substrate, and a micro lens on the infrared filter.Type: GrantFiled: June 10, 2019Date of Patent: May 12, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Soo Choi, Kyung Ho Lee
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Publication number: 20200119064Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Inventors: Jung Bin YUN, Eun Sub SHIM, Kyung Ho LEE, Sung Ho CHOI, Jung Hoon PARK, Jung Wook LIM, Min Ji JUNG
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Publication number: 20200119065Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Inventors: Jung Bin YUN, Eun Sub SHIM, Kyung Ho LEE, Sung Ho CHOI, Jung Hoon PARK, Jung Wook LIM, Min Ji JUNG
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Publication number: 20200119066Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Inventors: Jung Bin YUN, Eun Sub SHIM, Kyung Ho LEE, Sung Ho CHOI, Jung Hoon PARK, Jung Wook LIM, Min Ji JUNG
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Patent number: 10623675Abstract: An image sensor according to some example embodiments includes a pixel array unit including a plurality of transmission signal lines and a plurality of output signal lines, and a plurality of pixels connected to the plurality of transmission signal lines and the plurality of output signal lines. Each of the plurality of pixels includes a plurality of photoelectric conversion elements, which are configured to detect and photoelectrically convert incident light. The plurality of pixels include at least one autofocusing pixel and at least one normal pixel.Type: GrantFiled: March 27, 2019Date of Patent: April 14, 2020Assignee: Samsung Electronics Co., Ltd.Inventor: Kyung Ho Lee
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Patent number: 10577192Abstract: A tablet transfer apparatus includes a fixed plate provided with a rotary shaft penetrating therethrough, a negative pressure space formed therein to allow negative pressure to be partially applied to the negative pressure space, and a suction hole communicating at least with the negative pressure space; and a rotary plate combined with the rotary shaft to rotate, and provided with a concave groove formed in a circumferential surface of the rotary plate to communicate with the negative pressure space.Type: GrantFiled: April 14, 2016Date of Patent: March 3, 2020Assignee: ENCLONY INCInventors: Kyung-Ho Lee, Byung-In Kim
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Patent number: 10573676Abstract: Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.Type: GrantFiled: January 4, 2018Date of Patent: February 25, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Jung Bin Yun, Eun Sub Shim, Kyung Ho Lee, Sung Ho Choi, Jung Hoon Park, Jung Wook Lim, Min Ji Jung
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Publication number: 20200027914Abstract: An image sensor includes a pixel array including a plurality of pixels arranged in a first direction and a second direction. Each pixel of the plurality of pixels includes a plurality of photodiodes disposed adjacent to one another in at least one of the first direction and the second direction. The image sensor further includes a control logic configured to generate image data by obtaining pixel signals from the plurality of pixels, and read a pixel voltage corresponding to charges generated by two or more of the plurality of photodiodes included in one of the plurality of pixels, at substantially the same time.Type: ApplicationFiled: March 4, 2019Publication date: January 23, 2020Inventor: KYUNG HO LEE
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Publication number: 20200022258Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.Type: ApplicationFiled: April 22, 2019Publication date: January 16, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung-Jun LIM, Seong-Hwan PARK, Kyung-Ho LEE, Kyung-Moon JUNG, Chul-Kyu KIM
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Patent number: 10504855Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.Type: GrantFiled: October 25, 2018Date of Patent: December 10, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Moon Jung, Chul Kyu Kim, Seok Hwan Kim, Kyung Ho Lee, Seong Hwan Park
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Publication number: 20190355508Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.Type: ApplicationFiled: November 14, 2018Publication date: November 21, 2019Inventors: Sung Jun Lim, Yeong Min Jeong, Kyung Ho Lee, Han Kim, Sang Jong Lee, Su Bong Jang
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Publication number: 20190348210Abstract: An inductor includes: a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked; and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected to each other through a coil connection portion and form a coil having both ends connected to the first and second external electrodes through a coil withdrawal portion, and wherein the coil connection portion is configured as a material having a higher thermal expansion coefficient than that of the insulating layers.Type: ApplicationFiled: October 9, 2018Publication date: November 14, 2019Inventors: Sung Jun Lim, Yeong Min Jeong, Han Kim, Kyung Ho Lee
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Publication number: 20190341354Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.Type: ApplicationFiled: October 25, 2018Publication date: November 7, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Moon JUNG, Chul Kyu KIM, Seok Hwan KIM, Kyung Ho LEE, Seong Hwan PARK
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Patent number: 10452852Abstract: A method for measurement of an information-security-controlling status in accordance with the present disclosure includes receiving actual inspection data obtained by actually inspecting whether each domain complies with each security-controlling item, computing security-controlling status measurement scores for each domain on the basis of a significance grade of each control item, the degree of compliance with a corresponding control item, and a weighting set by a measurement manager, computing a final security-controlling status measurement score for a parent organization to which each domain belongs on the basis of an average of the security-controlling status measurement scores for each domain, and outputting the computed security-controlling status measurement scores and final security-controlling status measurement score.Type: GrantFiled: August 24, 2015Date of Patent: October 22, 2019Assignee: Korea University Research and Business FoundationInventors: Kyung Ho Lee, Young In You, Seon Ju Kim, In Hyun Cho, Hyun Sik Yoon
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Patent number: 10442634Abstract: A tablet inspection apparatus includes a supply unit including a rotary plate inclinedly disposed, and a transfer plate having a downwardly inclined surface, inclined outwardly on the same level as top dead center of the rotary plate while rotating with the rotary plate around the rotary plate, a first rotary unit inclinedly disposed with respect to the supply unit, and formed such that suction force is applied in a certain section in a circumferential direction, and a second rotary unit installed on one side of the first rotary unit, and formed such that suction force is applied in a certain section in a circumferential direction.Type: GrantFiled: April 14, 2016Date of Patent: October 15, 2019Assignee: ENCLONY INCInventors: Kyung-Ho Lee, Byung-In Kim
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Publication number: 20190296071Abstract: An image sensor and a method for fabricating the same are provided, in which the image sensor includes a substrate including a first sensing region having a photoelectric device therein, a boundary isolation film partitioning the first sensing region, an inner reflection pattern film within the substrate in the sensing region, an infrared filter on the substrate, and a micro lens on the infrared filter.Type: ApplicationFiled: June 10, 2019Publication date: September 26, 2019Inventors: Sung Soo CHOI, Kyung Ho LEE
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Publication number: 20190296072Abstract: An image sensor and a method for fabricating the same are provided, in which the image sensor includes a substrate including a first sensing region having a photoelectric device therein, a boundary isolation film partitioning the first sensing region, an inner reflection pattern film within the substrate in the sensing region, an infrared filter on the substrate, and a micro lens on the infrared filter.Type: ApplicationFiled: June 10, 2019Publication date: September 26, 2019Inventors: Sung Soo CHOI, Kyung Ho LEE
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Patent number: 10408703Abstract: A method of checking a sealing state of a housing includes starting an operation of a pressure sensor configured to measure an internal pressure of the housing. The method includes checking whether or not the housing is pressed. The method further includes checking the sealing state of the housing through checking a measured value of the pressure sensor under a pressure of the housing. An apparatus for checking a sealing state of a housing includes the housing configured to keep an internal space thereof sealed off from an outside, a pressure sensor configured to measure a pressure of the internal space, and an interface unit configured to provide to the pressure sensor a control signal that controls an operation of the pressure sensor, and provide pressure information detected through the pressure sensor.Type: GrantFiled: March 12, 2014Date of Patent: September 10, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Kwang-Min Kil, Seong-Joon Kweon, Kyung-Ho Lee
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Patent number: 10403588Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.Type: GrantFiled: January 10, 2017Date of Patent: September 3, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Han Kim, Kyung Moon Jung, Seok Hwan Kim, Kyung Ho Lee, Kang Heon Hur
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Patent number: 10377577Abstract: A tablet supply apparatus includes: a base frame; a rotary plate rotatably installed on the base frame to outwardly position a tablet by centrifugal force, and inclinedly positioned to have a top dead center point and a bottom dead center point; a transfer plate positioned to surround the rotary plate, rotated with the rotary plate, and having an inclined surface outwardly and downwardly inclined on the same level as that of the top dead center point of the rotary plate, in order to receive the tablet from the top dead center point of the rotary plate; and a guide unit disposed on the outer peripheral surface of the transfer plate, the guide unit allowing the tablet, positioned and transferred on the inclined surface of the transfer plate, to be discharged toward the rotary plate of the inspection unit by centrifugal force and a sliding movement.Type: GrantFiled: April 14, 2016Date of Patent: August 13, 2019Assignee: ENCLONY INCInventors: Kyung-Ho Lee, Byung-In Kim