Abstract: An embodiment of the present disclosure may provide an Internet-of-Things (IoT) sensor attached to the surface of industrial equipment to acquire data, the IoT sensor including: a first substrate; a first connector electrically connected to the first substrate and attached to the surface of the first substrate to transfer a measurement signal of the sensor; a cable formed of a flexible conductive wire and having one end connected to the first connector; a second connector connected to the other end of the cable and configured to receive the measurement signal of the sensor; and a communication module attached to a second substrate connected to the second connector.

Abstract: An embodiment of the present disclosure may provide an Internet-of-Things (IoT) sensor attached to the surface of industrial equipment to acquire data, the IoT sensor including: a first substrate; a first connector electrically connected to the first substrate and attached to the surface of the first substrate to transfer a measurement signal of the sensor; a cable formed of a flexible conductive wire and having one end connected to the first connector; a second connector connected to the other end of the cable and configured to receive the measurement signal of the sensor; and a communication module attached to a second substrate connected to the second connector.

Abstract: Disclosed are a microgrid gateway and a control method thereof. That is, according to the embodiment of the present invention, after various data is temporarily stored in the specific system module, when the input is completed, the abnormality of the corresponding specific system module is determined by the reset module in the process of storing the various data temporarily stored in the database, thereby reducing a database access load and securing gateway hardware performance hard to an operating environment.

Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

Abstract: A semiconductor device has a substrate. A conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

Abstract: The present invention relates to an apparatus for measuring biological information supporting multiplex communication. The apparatus for measuring biological information, according to one embodiment of the present invention, comprises: a measuring portion for measuring biological information through a biosensor; a data communication portion for transreceiving the biological information that is measured with an external device through a wireless communication network, which supports a client mode and an AP mode; and a control portion for accessing a communication network by controlling the client mode or the AP mode in a WiFi module. The present invention can transmit data to the external device through a connected AP by operating a wireless communication module in the client mode, or communicate data with the external device through a communication module of terminals, which connect by self-switching to the AP mode when the connected AP does not exist.

Abstract: Disclosed herein are semiconductor packages. A semiconductor package may include a substrate configured to include a first face and a second face opposite the first face and to have a recess formed in the first face. The semiconductor package may include a first semiconductor chip disposed on the bottom of the recess. The semiconductor package may include a second semiconductor chip disposed on the second face of the substrate. The semiconductor package may include a third semiconductor chip disposed over the first face of the substrate and the first semiconductor chip. The semiconductor package may include a fourth semiconductor chip disposed over the third semiconductor chip.

Abstract: Disclosed herein are semiconductor packages. A semiconductor package may include a substrate configured to include a first face and a second face opposite the first face and to have a recess formed in the first face. The semiconductor package may include a first semiconductor chip disposed on the bottom of the recess. The semiconductor package may include a second semiconductor chip disposed on the second face of the substrate. The semiconductor package may include a third semiconductor chip disposed over the first face of the substrate and the first semiconductor chip. The semiconductor package may include a fourth semiconductor chip disposed over the third semiconductor chip.

Abstract: A semiconductor package including a premold which is used to define support structure for a semiconductor die which is mounted to the premold by a layer of suitable adhesive. Embedded within the premold are lands which each include oppose upper and lower surfaces exposed in respective ones of upper and lower surfaces define by the premold. The semiconductor die, which is attached to the upper surface of the premold by the adhesive layer, is electrically connected to the exposed upper surfaces of the lands through the use of conductive wires. The semiconductor die, conductive wires, and the upper surface of the premold are covered or encapsulated by a package body. The package body does not cover any portion of the lower surface of the premold, thus allowing the exposed lower surfaces of the lands to be placed into electrical connection or communication with an underlying substrate such as a PCB or motherboard.

Abstract: Disclosed are a method, apparatus, and system for controlling a terminal device. A method of controlling a terminal device is performed by a terminal device control unit included in the terminal device. The method may include determining whether or not to change a state of the terminal device into a terminal device control state based on range information including at least one of a control area and a control period in which the terminal device is controlled and the real-time information of the terminal device, changing the state of the terminal device into the terminal device control state based on a result of the determination, and controlling the terminal device based on the control information in the terminal device control state.

Abstract: The present invention provides a method for controlling a mobile device adaptively to the user by collecting and analyzing the behavior pattern of the users of the mobile devices, and generating the suitable policy for each of the users. The method may comprise gathering, by the mobile device, behavior patterns of the user, sending, by the mobile device, information about the gathered behavior patterns to an analysis device, analyzing, by the analysis device, the information about the behavior patterns, generating, by the analysis device, media control information based on the behavior patterns and access authority of the user by referring to a management table comprising a list of one or more mobile devices and one or more information about behavior patterns, sending it, by the analysis device, to the mobile device, and controlling the mobile device based on the media control information.

Abstract: A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded, in the insulating layer; and an adhesive layer for fixing the electronic devices.

Abstract: A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

Abstract: The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided.

Abstract: A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

Abstract: The present invention relates to an apparatus for measuring biological information supporting multiplex communication. The apparatus for measuring biological information, according to one embodiment of the present invention, comprises: a measuring portion for measuring biological information through a biosensor; a data communication portion for transreceiving the biological information that is measured with an external device through a wireless communication network, which supports a client mode and an AP mode; and a control portion for accessing a communication network by controlling the client mode or the AP mode in a WiFi module. The present invention can transmit data to the external device through a connected AP by operating a wireless communication module in the client mode, or communicate data with the external device through a communication module of terminals, which connect by self-switching to the AP mode when the connected AP does not exist.