Patents by Inventor Kyu Won Lee

Kyu Won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128930
    Abstract: The present disclosure relates to an offset elimination operation of an internal operational amplifier of a data driving circuit and relates to a technique that applies different offset elimination methods for each position of an operational amplifier.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Yong Sung AHN, Ji Won KIM, Hyo Joong KIM, Kyung Min SHIN, Kyu Tae LEE, Ha Rim CHOI
  • Publication number: 20240128517
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
  • Publication number: 20240125706
    Abstract: A surface plasmon resonance imaging apparatus is provided. The surface plasmon resonance imaging apparatus includes a light irradiation unit configured to irradiate polarized light onto a metal coating film provided on one surface of a prism, a light modulator configured to spatially pattern-encode light reflected by the metal coating film and the prism, a light detector configured to detect a pattern-encoded light signal, obtained through pattern-encoding by the light modulator, as a spectral signal, a signal processor configured to spatially decode the spectral signal and analyze a decoded spectral signal to generate characteristic data of a sample provided on the metal coating film, and an output unit configured to output the characteristic data of the sample as a two-dimensional (2D) image.
    Type: Application
    Filed: December 29, 2022
    Publication date: April 18, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: SOOCHEOL KIM, JeongKyun KIM, Hyunseok KIM, Jin Hwa RYU, SO YUNG PARK, Hoe-Sung YANG, KANG BOK LEE, Sun-Hwa LIM, Kwang-Soo CHO, Kyu Won HAN, Sang Gi HONG
  • Patent number: 11959857
    Abstract: Provided is a Raman scattering measurement apparatus including a light source which emits light to smoke particles, a filter configured to block light which is incident to the smoke particles and passes through the particle and to allow Raman scattered light to pass therethrough, and a photodetector which detects the Raman scattered light passing through the filter in order to distinguish fire smoke generated due to a true fire from non-fire smoke generated due to daily life or industrial activity. The present invention also provides a fire determination apparatus including a unit which reads a Raman shift from Raman scattered light detected by the photodetector of the Raman scattering measurement apparatus, estimates a smoke component from the read Raman shift, and determines fire/non-fire from the estimated smoke component and a method thereof.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: April 16, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hoe Sung Yang, Soo Cheol Kim, Hyun Seok Kim, Sang Hyun Mo, So Young Park, Kang Bok Lee, Kyu Won Han
  • Publication number: 20240109419
    Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 4, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Hun JEONG, Mun Soo CHUNG, Kyu Won JEONG, Tae Woo KIM, Jong Dae KIM, Beom Sik KIM, Sang Don LEE
  • Patent number: 11945915
    Abstract: A method for synthesizing a pre-hydrolyzed polysilicate, wherein a polysilicate is applied as a reactant when synthesizing the pre-hydrolyzed polysilicate, and the total amount of water added in the reaction system is specified. The method is capable of omitting a condensation reaction by applying a polysilicate as a reactant, thereby significantly shortening synthesis time and reducing production costs when compared with a typical synthesis method in which alkoxysilane-based monomer compound is used as a reactant. In addition, the gelation reaction time and the weight average molecular weight can be easily controlled, and a pre-hydrolyzed polysilicate excellent in storage stability and processability can be synthesized.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 2, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Kyu Reon Lee, Kyoung Shil Oh, Jong Hun Kim, Se Won Baek
  • Publication number: 20240097168
    Abstract: A vehicle is provided that includes a DC converter having a first end connected to a fuel cell, a second end connected to a high-voltage battery, and at least one switching element connected between the first end and the second end, a fuel cell control unit which controls an activation state of a running command for start of the fuel cell based on an on-off state of vehicle start, and a converter controller which controls a running state of the DC converter according to an initial start sequence, a shutdown sequence, or a restart sequence for the fuel cell based on the activation state of the running command.
    Type: Application
    Filed: March 8, 2023
    Publication date: March 21, 2024
    Inventors: Beom Sik KIM, Kyu Won JEONG, Tae Woo KIM, Jae Hun JEONG, Mun Soo CHUNG, Sang Don LEE
  • Publication number: 20240097566
    Abstract: A DC-DC converter, a vehicle including the converter, and a controlling method thereof are provided. The DC-DC converter includes a first capacitor connected to a first DC terminal, a second capacitor connected to a second DC terminal, a plurality of converting circuits each including at least an inductor and a plurality of switching elements, and connected to each other in parallel between the first capacitor and the second capacitor, and a controller configured to control an ON/OFF state of the plurality of switching elements provided of each of the converting circuits. When external power connection with respect to each of the first DC terminal and the second DC terminal is disconnected, the controller is configured to control states of the plurality of switching elements to sequentially provide a plurality of different discharge paths between opposite terminals of the second capacitor via the plurality of converting circuits.
    Type: Application
    Filed: July 3, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Beom Sik KIM, Kyu Won JEONG, Tae Woo KIM, Jae Hun JEONG, Mun Soo CHUNG, Sang Don LEE
  • Publication number: 20240083351
    Abstract: A lighting device includes a light guide plate configured to guide and diffuse a light from a light source, and a garnish body including a lighting area to which the diffused light is radiated, wherein the light guide plate is disposed at a predetermined angle with respect to the garnish body.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 14, 2024
    Inventors: Jun Geun Oh, Min Ha Lee, Kyu Rok Kim, Byoung Wook Kim, Hoe Won Jung, Ho Sung Shin, Seong Cheon Cho
  • Publication number: 20240077417
    Abstract: The disclosure relates to a non-dispersive infrared (NDIR) gas sensor which detects the concentration of gas with a simple structure and method by manufacturing an optical waveguide with a gas-permeable polymer material instead of a conventional cavity or chamber type. An optical signal travels through the optical waveguide of gas-permeable polymer by total internal reflection, and the gas naturally penetrates the optical waveguide without the use of separate inlet and outlet openings, so that the optical signal and gas particles come into contact with each other within the optical waveguide. Since the optical signal detected by a photodetector at the other end of the optical waveguide after traveling while contacting the gas particles has properties changed according to the concentration of the gas which they have contacted in the optical waveguide, it is possible to measure the concentration of a specific gas from the detected optical signal.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 7, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jin Hwa RYU, Soocheol KIM, Hyunseok KIM, So Yung PARK, Hoe-Sung YANG, Kang Bok LEE, Kwang-Soo CHO, Kyu Won HAN
  • Patent number: 11923035
    Abstract: A pseudo dual port memory device in which an operating speed is improved and stability is increased is provided. The pseudo dual port memory device may include a memory cell, a pair of bit lines connected to the memory cell, a write driver, a sense amp, and a column multiplexer which is connected to the bit lines, receives a write multiplexer control signal and a read multiplexer control signal, connects the bit lines to the write driver in response to the write multiplexer control signal, and connects the bit lines to the sense amp in response to the read multiplexer control signal. A precharge control signal generation circuit which is connected to the column multiplexer may generate a precharge control signal on the basis of the read and write multiplexer control signals, and a bit line precharge circuit may precharge the bit lines based on the precharge control signal.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan Ho Lee, Tae Min Choi, Jeong Kyun Kim, Hyeong Cheol Kim, Suk Youn, Ju Chang Lee, Kyu Won Choi
  • Publication number: 20240071306
    Abstract: A display device according to one or more embodiments of the disclosure includes a pixel circuit layer including a base layer and circuit elements on the base layer; and a display layer on the pixel circuit layer. The display layer includes a first electrode on the pixel circuit layer; an insulating layer on the first electrode; a second electrode on the insulating layer; a light emitting stacked structure on the second electrode and including a first insulating layer, a second insulating layer, and a light emitting layer between the first insulating layer and the second insulating layer; and a third electrode on the light emitting stacked structure. The light emitting layer includes a two-dimensional material, is separated from the second electrode by the first insulating layer, and is separated from the third electrode by the second insulating layer.
    Type: Application
    Filed: May 18, 2023
    Publication date: February 29, 2024
    Inventors: Yun JANG, Yun Hee PARK, Yi Seop SHIM, Hyun Seung LEE, Kyu Won JO, Kyung Seon TAK
  • Publication number: 20220382255
    Abstract: An embodiment of the present disclosure may provide an Internet-of-Things (IoT) sensor attached to the surface of industrial equipment to acquire data, the IoT sensor including: a first substrate; a first connector electrically connected to the first substrate and attached to the surface of the first substrate to transfer a measurement signal of the sensor; a cable formed of a flexible conductive wire and having one end connected to the first connector; a second connector connected to the other end of the cable and configured to receive the measurement signal of the sensor; and a communication module attached to a second substrate connected to the second connector.
    Type: Application
    Filed: November 10, 2021
    Publication date: December 1, 2022
    Applicant: HYOSUNG P&M CO., LTD.
    Inventor: Kyu Won LEE
  • Publication number: 20190326756
    Abstract: Disclosed are a microgrid gateway and a control method thereof. That is, according to the embodiment of the present invention, after various data is temporarily stored in the specific system module, when the input is completed, the abnormality of the corresponding specific system module is determined by the reset module in the process of storing the various data temporarily stored in the database, thereby reducing a database access load and securing gateway hardware performance hard to an operating environment.
    Type: Application
    Filed: April 18, 2018
    Publication date: October 24, 2019
    Inventors: Jungwon CHO, Kyu Won LEE, Ssang Seok OH, Hak JANG
  • Patent number: 9888569
    Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: February 6, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
  • Patent number: 9799621
    Abstract: A semiconductor device has a substrate. A conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: October 24, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Soo Won Lee, Kyu Won Lee, Eun Jin Jeong
  • Patent number: 9781835
    Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: October 3, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Won Suk Jung, Kyu Won Lee, Yun Ho An, Woo Young Lee
  • Patent number: 9661759
    Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: May 23, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Su Kim, Ki Do Chun, Kyu Won Lee, Sang Myung Lee
  • Patent number: 9569590
    Abstract: The present invention relates to an apparatus for measuring biological information supporting multiplex communication. The apparatus for measuring biological information, according to one embodiment of the present invention, comprises: a measuring portion for measuring biological information through a biosensor; a data communication portion for transreceiving the biological information that is measured with an external device through a wireless communication network, which supports a client mode and an AP mode; and a control portion for accessing a communication network by controlling the client mode or the AP mode in a WiFi module. The present invention can transmit data to the external device through a connected AP by operating a wireless communication module in the client mode, or communicate data with the external device through a communication module of terminals, which connect by self-switching to the AP mode when the connected AP does not exist.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: February 14, 2017
    Assignee: INFOPIA CO., LTD.
    Inventors: Byeong Woo Bae, Sung Dong Lee, Hong Seong Suk, Kyu Won Lee
  • Publication number: 20160379961
    Abstract: Disclosed herein are semiconductor packages. A semiconductor package may include a substrate configured to include a first face and a second face opposite the first face and to have a recess formed in the first face. The semiconductor package may include a first semiconductor chip disposed on the bottom of the recess. The semiconductor package may include a second semiconductor chip disposed on the second face of the substrate. The semiconductor package may include a third semiconductor chip disposed over the first face of the substrate and the first semiconductor chip. The semiconductor package may include a fourth semiconductor chip disposed over the third semiconductor chip.
    Type: Application
    Filed: October 14, 2015
    Publication date: December 29, 2016
    Inventors: Kyu Won LEE, Ki Ill MOON, Cheol Woo HAN