Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: The disclosure concerns method of making a molded substrate, comprising providing a carrier; forming a first conductive layer and first vertical conductive contacts over the carrier; disposing a first layer of encapsulant over the first conductive layer and first vertical conductive contacts; planarizing the first vertical conductive contacts and the first layer of encapsulant to form a first planar surface; forming a second conductive layer and second vertical conductive contacts over the first layer of encapsulant and configured to be electrically coupled with the first conductive layer and first vertical conductive contacts; disposing a second layer of encapsulant over the second conductive layer and second vertical conductive contacts; planarizing the second vertical conductive contacts and the second layer of encapsulant to form a second planar surface; and forming first conductive bumps over the second planar surface, opposite the carrier.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: A method of making a semiconductor device may include providing a large semiconductor die comprising conductive interconnects with a first encapsulant disposed over four side surfaces of the large semiconductor die, over the active surface of the large semiconductor die, and around the conductive interconnects. A first build-up interconnect structure may be formed over the large semiconductor die and over the first encapsulant. Vertical conductive interconnects may be formed over the first build-up interconnect structure and around an embedded device mount site. An embedded device comprising through silicon vias (TSVs) may be disposed over the embedded device mount site. A second encapsulant may be disposed over the build-up structure, and around at least five sides of the embedded device. A second build-up structure may be formed disposed over the planar surface and configured to be electrically coupled to the TSVs of the embedded device and the vertical conductive interconnects.

Abstract: This disclosure describes an implantable medical electrical lead and an ICD system utilizing the lead. The lead includes a lead body defining a proximal end and a distal portion, wherein at least a part of the distal portion of the lead body defines an undulating configuration. The lead includes a defibrillation electrode that includes a plurality of defibrillation electrode segments disposed along the undulating configuration spaced apart from one another by a distance. The lead also includes at least one electrode disposed between adjacent sections of the plurality of defibrillation sections. The at least one electrode is configured to deliver a pacing pulse to the heart and/or sense cardiac electrical activity of the heart.

Abstract: Provided here are methods of making derivatives and prodrugs of substituted morpholines or pharmaceutically acceptable salts thereof.

Abstract: Various embodiments concern a sprayer having a blower that outputs a HVLP flow of air into a hose, the hose connecting with a spray gun. A pressure sensor measures pressure of the HVLP air within the hose via a tube that branches from a fitting to which the hose connects. If the sensor indicates that the pressure level has increased above a threshold amount, indicating that the trigger of the spray gun is not being actuated, then power output to the blower is reduced (e.g., stopped). HVLP air is trapped within the hose by two valves when the trigger is not actuated. When the sensor indicates that the pressure level has decreased, corresponding to release of the trapped HVLP air into the gun for spraying by actuation of the trigger, power to the blower is increased (e.g., resumed).

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: A cable exercise machine includes a first pull cable and a second pull cable incorporated into a frame. Each of the first pull cable and the second pull cable are linked to at least one resistance mechanism. The at least one resistance mechanism includes a flywheel and a magnetic unit arranged to resist movement of the flywheel.

Abstract: Devices, systems, and techniques are disclosed for delivering electric field therapy to tissue of a subject. In one example, a technique includes removing a tumor from tissue to create a resection cavity, implanting a plurality of leads into the tissue adjacent to the resection cavity, and affixing the plurality of leads at least one of the tissue or bone. The example technique also includes tunneling proximal ends of the leads to an implantation pocket and coupling the proximal ends of the leads to an implantable medical device configured to be placed within the implantation pocket, wherein the implantable medical is configured to deliver electric field therapy via the plurality of implantable leads disposed adjacent to the resection cavity.

Abstract: Systems and methods for automatic content remediation notification are disclosed herein. The system can include memory that can contain a content library database. The system can include a first user device and one or more servers. The one or more servers can: receive a content aggregation creation request from the first user device; identify content information associated with a set of the plurality of data packets; apply a filter request to the set of the plurality of data packets; automatically provide information relating to data packets in the restricted set of data packets to the first user device; receive content aggregate information identifying a content aggregate from the first user device; evaluate the content aggregate according to the metadata associated with the data packets of the content aggregate; and output an indicator of the evaluation result to the first user device.

Abstract: A method of forming a semiconductor device can comprise providing a first shift region in which to determine a first displacement. A second shift region may be provided in which to determine a second displacement. A unique electrically conductive structure may be formed comprising traces to account for the first displacement and the second displacement. The electrically conductive structure may comprise traces comprising a first portion within the first shift region and a second portion of traces in the second shift region laterally offset from the first portion of traces. A third portion of the traces may be provided in the routing area between the first shift region and the second shift region. A unique variable metal fill may be formed within the fill area. The variable metal fill may be electrically isolated from the unique electrically conductive structure.

Abstract: Provided here are methods of making derivatives and prodrugs of substituted morpholines or pharmaceutically acceptable salts thereof.

Abstract: A method and related structure for a quad flat no-lead (QFN), dual flat no-lead (DFN) or small outline no-lead (SON) package without a leadframe. Disposing semiconductor chips face-up on a temporary carrier, disposing a first encapsulant layer around the semiconductor chip, the active layer and conductive stumps, forming a conductive layer and conductive contacts over the planar surface, disposing encapsulant over the first encapsulant layer, conductive layer and conductive contacts, forming a photoresist over the encapsulant with openings, forming conductive pads within the openings, forming a solderable metal system (SMS) or applying an organic solderability preservative (OSP) over the conductive pads, and cutting through the encapsulant around the chip to form the outline of a package.

Abstract: A fluid sprayer includes a pump and an electrostatic module configured to provide an electrostatic charge to spray fluid. The electrostatic module is electrically connected to a conductive component of the fluid sprayer, such as a fluid displacement member, fitting, cylinder, or spray tip, to charge the spray fluid via the conductive component. The fluid is electrostatically charged prior to exiting the fluid sprayer.

Abstract: A method of making a semiconductor device may include providing a large semiconductor die comprising conductive interconnects with a first encapsulant disposed over four side surfaces of the large semiconductor die, over the active surface of the large semiconductor die, and around the conductive interconnects. A first build-up interconnect structure may be formed over the large semiconductor die and over the first encapsulant. Vertical conductive interconnects may be formed over the first build-up interconnect structure and around an embedded device mount site. An embedded device comprising through silicon vias (TSVs) may be disposed over the embedded device mount site. A second encapsulant may be disposed over the build-up structure, and around at least five sides of the embedded device. A second build-up structure may be formed disposed over the planar surface and configured to be electrically coupled to the TSVs of the embedded device and the vertical conductive interconnects.

Abstract: A semiconductor device may include an embedded device comprising through silicon vias (TSVs) extending from a first surface to a second surface opposite the first surface, wherein the embedded device comprises an active device, a semiconductor die comprising an active surface formed at the first surface, an integrated passive device (IPD), or a passive device. Encapsulant may be disposed over at least five sides of the embedded device. A first electrical interconnect structure may be coupled to a first end of the TSV at the first surface of the embedded device, and a second electrical interconnect structure may be coupled to a second end of the TSV at the second surface of the embedded device. A semiconductor die (e.g. a system on chip (SoC), memory device, microprocessor, graphics processor, or analog device), may be mounted over the first electrical interconnect of the TSV.

Abstract: A handheld fluid sprayer is configured to draw spray fluid from a reservoir mounted on the fluid sprayer and eject the spray fluid through a nozzle. The reservoir is removably mounted to the fluid sprayer. A priming pathway extends through the fluid sprayer and routes air out of the reservoir to prime the pump. The priming pathway extends from the reservoir and to a side of the pump opposite the reservoir.

Abstract: A microelectronic device comprises a microelectronic device structure having a memory array region and a staircase region. The microelectronic device structure comprises a stack structure having tiers each comprising a conductive structure and an insulative structure; staircase structures confined within the staircase region and having steps comprising edges of the tiers of the stack structure within the deck and the additional deck; and semiconductive pillar structures confined within the memory array region and extending through the stack structures. The stack structure comprises a deck comprising a group of the tiers; an additional deck overlying the deck and comprising an additional group of the tiers; and an interdeck section between the deck and the additional deck and comprising a dielectric structure confined within the memory array region, and another group of the tiers within vertical boundaries of the dielectric structure and confined within the staircase region.

Abstract: A method of stabilizing a tube at a stoma of a patient includes providing a stabilizing device having a base portion and a tube holding portion that is attached at the base portion via at least two legs and that, with the base portion affixed to the patient, is spaced from the stoma of the patient. The tube holding portion has a passageway therethrough that is configured to receive the tube that passes through the stoma. The tube holding portion may be adjusted to position the tube in a free-flow orientation or a restricted-flow orientation. The tube holding portion may include a disinfecting wiping element. The stabilizing device may have pads coupled to respective legs via an elastomeric connecting element to allow for adjustment of the pads relative to the legs. The tube holding portion may include flexible tabs that deflect to enlarge an effective diameter of the passageway.