Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

Abstract: The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: The disclosure concerns method of making an interconnect substrate that may comprise providing a core. The core may comprise a composite core, which may comprise a PCB, a laminate core with build-up layers, or molded core. A first patterned frontside conductive layer may be formed over a front side of the core. A first frontside molded dielectric layer may be disposed over the front side of the core and over the first patterned frontside conductive layer. One or more other dielectric layers (such as polyimide) may be disposed before (and under) the first frontside molded dielectric layer. The core may be flipped such that a back side of the core is presented or configured for processing. A first patterned frontside conductive layer may be formed over the back side of the core.

Abstract: Devices, systems, and techniques are disclosed for planning, updating, and delivering electric field therapy. In one example, a system comprises processing circuitry configured to receive a request to deliver alternating electric field (AEF) therapy and determine therapy parameter values that define the AEF therapy, wherein the AEF therapy comprises delivery of a first electric field and a second electric field. The processing circuitry may also be configured to control an implantable medical device to deliver the first electric field from a first electrode combination of implanted electrodes and control the implantable medical device to deliver, alternating with the first electric field, the second electric field from a second electrode combination of implanted electrodes different than the first electrode combination.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electrical or semiconductor package may comprise an embedded component comprising embedded vertical interconnects (EVIs) extending through a base substrate material from a first surface to a second surface opposite the first surface. An encapsulant may be disposed around and contact four side surfaces of the embedded component. A first electrical interconnect structure comprising a conductive stud may be coupled to a first end of the EVI at the first surface of the embedded component. The encapsulant may contact at least a portion of the side of the conductive stud. A second electrical interconnect structure comprising a portion of a conductive RDL layer may be coupled to a second end of the EVI at the second surface of the embedded component. A component may be coupled to, and mounted over, the first electrical interconnect of the vertical interconnect.

Abstract: A power tool attachment is configured to connect to a power tool at a static interface and a dynamic interface. The static interface statically fixes the power tool and power tool attachment together. The dynamic interface provides rotational motion generated by the power tool to the power tool attachment. The rotational motion is provided to a drive of the power tool attachment that converts the rotational motion to a linear reciprocating output.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: Non-human animals, expressing humanized CD3 proteins are provided. Non-human animals, e.g., rodents, genetically modified to comprise in their genome humanized CD3 proteins are also provided. Additionally, provided are methods and compositions of making such non-human animals, as well as methods of using said non-human animals.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: A tube dampener (12) for a fluid sprayer (10) is disposed downstream of the pump (18) to receive spray fluid output by the pump. The tube dampener includes a rigid body (24) and a flexible tube (26) disposed within the rigid body. The flexible tube is resilient to smooth pressure fluctuations in the spray fluid output by the pump, providing consistent pressure at a spray nozzle (28) downstream of the tube dampener (12).

Abstract: The disclosure concerns method of making a molded substrate, comprising providing a carrier; forming a first conductive layer and first vertical conductive contacts over the carrier; disposing a first layer of encapsulant over the first conductive layer and first vertical conductive contacts; planarizing the first vertical conductive contacts and the first layer of encapsulant to form a first planar surface; forming a second conductive layer and second vertical conductive contacts over the first layer of encapsulant and configured to be electrically coupled with the first conductive layer and first vertical conductive contacts; disposing a second layer of encapsulant over the second conductive layer and second vertical conductive contacts; planarizing the second vertical conductive contacts and the second layer of encapsulant to form a second planar surface; and forming first conductive bumps over the second planar surface, opposite the carrier.

Abstract: A semiconductor device may include an embedded device comprising through silicon vias (TSVs) extending from a first surface to a second surface opposite the first surface, wherein the embedded device comprises an active device, a semiconductor die comprising an active surface formed at the first surface, an integrated passive device (IPD), or a passive device. Encapsulant may be disposed over at least five sides of the embedded device. A first electrical interconnect structure may be coupled to a first end of the TSV at the first surface of the embedded device, and a second electrical interconnect structure may be coupled to a second end of the TSV at the second surface of the embedded device. A semiconductor die (e.g. a system on chip (SoC), memory device, microprocessor, graphics processor, or analog device), may be mounted over the first electrical interconnect of the TSV.

Abstract: A method of making a semiconductor assembly may include providing a semiconductor component disposed within a first encapsulant, the encapsulant being disposed around and contacting at least four side surfaces of the semiconductor component and disposed over frontside of the semiconductor component. A first layered structure may be formed as a build-up interconnect structure over the encapsulant and over the semiconductor component. The first layered structure may comprise a first conductive layer formed over the first encapsulant, a first dielectric formed over the first conductive layer, and a second encapsulant disposed over first conductive layer and over first dielectric. An upper surface of the second encapsulant may be planarized to create a flat surface on which to form additional structures, such as a second layered structure or a package interconnect.

Abstract: A method may comprise: receiving, via a controller and through a camera, visual data corresponding to a row of latch assemblies in a cargo handling system; and determining, via the controller, whether each latch assembly in the row of latch assemblies is in a properly securing state.

Abstract: A method of forming a semiconductor device can comprise providing a first shift region in which to determine a first displacement. A second shift region may be provided in which to determine a second displacement. A unique electrically conductive structure may be formed comprising traces to account for the first displacement and the second displacement. The electrically conductive structure may comprise traces comprising a first portion within the first shift region and a second portion of traces in the second shift region laterally offset from the first portion of traces. A third portion of the traces may be provided in the routing area between the first shift region and the second shift region. A unique variable metal fill may be formed within the fill area. The variable metal fill may be electrically isolated from the unique electrically conductive structure.

Abstract: A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.