Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: Systems, methods, and devices for voltage identification using a pulse-width modulation signal are provided. Such an integrated circuit device may include an input/output (I/O) interface and voltage identification (VID) circuitry. The VID circuitry may be coupled to the input/output interface. The voltage identification circuitry may generate a voltage identification signal that is output on the input/output interface. The voltage identification signal may include a pulsed signal having a particular duty cycle that corresponds to a specified voltage level to enable a voltage regulator that receives the voltage identification signal to provide an input voltage to the integrated circuit device at the specified voltage level.

Abstract: Systems or methods of the present disclosure may provide high-bandwidth, low-latency connectivity for inter-die and/or intra-die communication of a modularized integrated circuit system. Such an integrated circuit system may include a first die of fabric circuitry sector(s), a second die of modular periphery intellectual property (IP), a passive silicon interposer coupling the first die to the second die, and a modular interface that includes a network-on-chip (NOC). The modular interface may provide high-bandwidth, low-latency communication between the first die and the second, between the fabric circuitry sector(s), and between the first die and a third die.

Abstract: A circuit system includes an interposer that has a first clock network and first and second integrated circuit dies that are mounted on the interposer. The first integrated circuit die includes a phase detector circuit, an adjustable delay circuit that generates a second clock signal in response to a first clock signal received from the first clock network, and a second clock network that generates a third clock signal in response to the second clock signal. The second integrated circuit die comprises a third clock network that generates a fourth clock signal in response to the first clock signal received from the first clock network. The phase detector circuit controls a delay provided by the adjustable delay circuit to the second clock signal based on a phase comparison between phases of the third and fourth clock signals.

Abstract: Systems or methods of the present disclosure may facilitate meeting connectivity demands between the dies of the modularized integrated circuits. Such an integrated circuit system may include a first die of programmable fabric circuitry that is communicatively coupled to a second die of modular periphery intellectual property (IP) tile via a modular interface. The modular interface may enable communication between a first microbump of the first die and a second microbump of the second die using a time-division multiplexing (TDM) technique. The modular interface may also enable communication between the first microbump and the second microbump using a wire-to-wire connection that does not comprise the TDM technique.

Abstract: A method includes detecting an open in a first IO element of a first bank of IOs and not in a second bank of IOs. The first and second banks of IOs are in a channel of a first die. The method includes shifting a first connection between the first IO element and a first core fabric of the first die to second connection between a second IO element and the first core fabric. The second IO element is in the first bank of IOs. The method includes shifting a third connection between a third IO element and a second core fabric of a second die to fourth connection between a fourth IO element and the second core fabric. The third and fourth IO elements are in a third bank of IOs of the second die. The method includes not shifting connections in the second and fourth banks of IOs.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

Abstract: An integrated circuit includes a circuit block, a storage circuit that stores a static power gating control signal, a logic gate circuit that receives a dynamic power gating control signal and the static power gating control signal from the storage circuit, and a transistor coupled between the circuit block and a supply node at a supply voltage. A conductive state of the transistor is determined by an output signal of the logic gate circuit. The transistor is turned off to provide power gating to the circuit block in response to a change in the output signal of the logic gate circuit that is caused by the static power gating control signal or by the dynamic power gating control signal.

Abstract: An IC, operable at a first clock phase, includes first and second IOs and a PLL. The PLL includes a control circuit, an input to receive a first clock signal, an output to output a second clock signal, and a first detector to generate a first phase difference signal from the first and second clock signals. The IC includes a second phase detector that is coupled to the PLL's output to receive the second clock signal and is coupled to the first IO to receive a third clock single from a second IC, which is operable at a second clock phase. The second detector generates a second phase difference signal from the second and third clock signals. If the PLL uses the second phase difference signal to generate the second clock signal, then the second clock signal is synchronized with the third clock signal for synchronous data transfer.

Abstract: An integrated circuit includes a control circuit, a first-in first-out circuit, and a serializer circuit. The control circuit generates parallel pulse-width modulation data in first parallel pulse-width modulation signals. The first-in first-out circuit stores the parallel pulse-width modulation data indicated by the first parallel pulse-width modulation signals. The first-in first-out circuit outputs the stored parallel pulse-width modulation data in second parallel pulse-width modulation signals. The serializer circuit converts the parallel pulse-width modulation data indicated by the second parallel pulse-width modulation signals to serial pulse-width modulation data in a serial pulse-width modulation signal.

Abstract: An integrated circuit includes a circuit block, a storage circuit that stores a static power gating control signal, a logic gate circuit that receives a dynamic power gating control signal and the static power gating control signal from the storage circuit, and a transistor coupled between the circuit block and a supply node at a supply voltage. A conductive state of the transistor is determined by an output signal of the logic gate circuit. The transistor is turned off to provide power gating to the circuit block in response to a change in the output signal of the logic gate circuit that is caused by the static power gating control signal or by the dynamic power gating control signal.

Abstract: An integrated circuit includes a control circuit, a first-in first-out circuit, and a serializer circuit. The control circuit generates parallel pulse-width modulation data in first parallel pulse-width modulation signals. The first-in first-out circuit stores the parallel pulse-width modulation data indicated by the first parallel pulse-width modulation signals. The first-in first-out circuit outputs the stored parallel pulse-width modulation data in second parallel pulse-width modulation signals. The serializer circuit converts the parallel pulse-width modulation data indicated by the second parallel pulse-width modulation signals to serial pulse-width modulation data in a serial pulse-width modulation signal.

Abstract: Systems, methods, and devices for voltage identification using a pulse-width modulation signal are provided. Such an integrated circuit device may include an input/output (I/O) interface and voltage identification (VID) circuitry. The VID circuitry may be coupled to the input/output interface. The voltage identification circuitry may generate a voltage identification signal that is output on the input/output interface. The voltage identification signal may include a pulsed signal having a particular duty cycle that corresponds to a specified voltage level to enable a voltage regulator that receives the voltage identification signal to provide an input voltage to the integrated circuit device at the specified voltage level.

Abstract: An example of a controller circuit may include a policy module to generate a power reduction policy output based on a processor power state input. The power reduction policy output may also be generated based on a graphics render engine idleness input. The circuit can also include a clock masking cell to apply a clock masking configuration to a graphics render clock trunk based on the power reduction policy output.

Abstract: An example of a controller circuit may include a policy module to generate a power reduction policy output based on a processor power state input. The power reduction policy output may also be generated based on a graphics render engine idleness input. The circuit can also include a clock masking cell to apply a clock masking configuration to a graphics render clock trunk based on the power reduction policy output.