Patents by Inventor Lakshmanan Karuppiah

Lakshmanan Karuppiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7520968
    Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: April 21, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Lakshmanan Karuppiah
  • Patent number: 7504018
    Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: March 17, 2009
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Stan D. Tsai, Lakshmanan Karuppiah, Jie Diao, Renhe Jia, Alpay Yilmaz
  • Publication number: 20090033942
    Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
    Type: Application
    Filed: October 16, 2008
    Publication date: February 5, 2009
    Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
  • Publication number: 20090036026
    Abstract: A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
    Type: Application
    Filed: August 4, 2008
    Publication date: February 5, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah
  • Patent number: 7444198
    Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: October 28, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
  • Publication number: 20080243433
    Abstract: A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 2, 2008
    Inventors: Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey, Ingemar Carlsson, Lakshmanan Karuppiah, Harry Q. Lee
  • Publication number: 20080239308
    Abstract: A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 2, 2008
    Inventors: Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey, Ingemar Carlsson, Lakshmanan Karuppiah, Harry Q. Lee
  • Patent number: 7422982
    Abstract: A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: September 9, 2008
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Jie Diao, Stan D. Tsai, Lakshmanan Karuppiah
  • Patent number: 7409260
    Abstract: A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: August 5, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah
  • Publication number: 20080146121
    Abstract: A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 19, 2008
    Inventors: Omer Ozgun, Alpay Yilmaz, Antoine P. Manens, Lakshmanan Karuppiah
  • Publication number: 20080146120
    Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
    Type: Application
    Filed: December 15, 2006
    Publication date: June 19, 2008
    Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
  • Publication number: 20080138988
    Abstract: During polishing of a substrate, polysilicon can be removed from a surface of the substrate. Detecting an endpoint during polishing of polysilicon can include polishing the substrate having a polysilicon residue on an area of oxide area and optically detecting clearance of the polysilicon residue.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 12, 2008
    Inventors: Jeffrey Drue David, Jun Qian, Garrett Sin, Daxin Mao, Chris Heung-Gyun Lee, Sivakumar Dhandapani, Boguslaw A. Swedek, Dominic J. Benvegnu, Lakshmanan Karuppiah
  • Patent number: 7344432
    Abstract: An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: March 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid A. Mavliev, Stan D. Tsai, You Wang, Jie Diao, Renhe Jia, Lakshmanan Karuppiah, Robert Ewald
  • Publication number: 20080035474
    Abstract: Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material.
    Type: Application
    Filed: October 23, 2007
    Publication date: February 14, 2008
    Inventors: You Wang, Jie DIAO, Stan TSAI, Lakshmanan Karuppiah
  • Publication number: 20080020682
    Abstract: A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
    Type: Application
    Filed: July 21, 2006
    Publication date: January 24, 2008
    Inventors: Renhe Jia, Jie Diao, You Wang, Stan Tsai, Jim Atkinson, Lakshmanan Karuppiah, Liang-Yuh Chen
  • Publication number: 20080014845
    Abstract: A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 17, 2008
    Inventors: Alpay Yilmaz, Omer Ozgun, Gerald Alonzo, Lakshmanan Karuppiah, Shou-Sung Chang, Antoine P. Manens, Clinton Sakata
  • Publication number: 20080014709
    Abstract: A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
    Type: Application
    Filed: July 7, 2006
    Publication date: January 17, 2008
    Inventors: You Wang, Jie Diao, Stan D. Tsai, Lakshmanan Karuppiah
  • Publication number: 20070254485
    Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
    Type: Application
    Filed: April 16, 2007
    Publication date: November 1, 2007
    Inventors: Daxin Mao, You Wang, Junzi Zhao, Stan D. Tsai, Renhe Jia, Jie Diao, Yongqi Hu, Lakshmanan Karuppiah
  • Publication number: 20070235344
    Abstract: A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 ?/min and greater can be achieved.
    Type: Application
    Filed: April 6, 2006
    Publication date: October 11, 2007
    Inventors: Renhe Jia, You Wang, Gerald Alonzo, Yongqi Hu, Zhihong Wang, Jie Diao, Stan D Tsai, Alpay Yilmaz, Lakshmanan Karuppiah, Liang-Yuh Chen
  • Publication number: 20070224915
    Abstract: A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
    Type: Application
    Filed: May 15, 2007
    Publication date: September 27, 2007
    Inventors: Jeffrey David, Dominic Benvegnu, Harry Lee, Boguslaw Swedek, Lakshmanan Karuppiah