Patents by Inventor Lakshmanan Karuppiah

Lakshmanan Karuppiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070207704
    Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
    Type: Application
    Filed: April 27, 2007
    Publication date: September 6, 2007
    Inventors: ALPAY YILMAZ, LAKSHMANAN KARUPPIAH
  • Publication number: 20070181442
    Abstract: The embodiments of the invention generally relate to a method and apparatus for processing a substrate where reduced defect formation is desired. Embodiments of the invention may be beneficially practiced in chemical mechanical polishing and electrochemical mechanical polishing processes, among other processes where reduction in defect formation due to foam formation is desired. In one embodiment, a processing system for planarizing a substrate is provided that includes a platen, a pad disposed on the platen, a carrier head configured to retain the substrate against the pad while contacting an electronically conductive processing solution; and a foam removal assembly. The foam removal assembly is configured to remove foam from the electrically conductive processing solution, wherein a gap exists between a surface of the electrically conductive processing solution and a bottom edge of the foam removal assembly.
    Type: Application
    Filed: February 3, 2006
    Publication date: August 9, 2007
    Inventors: Renhe Jia, Jie Diao, You Wang, Stan Tsai, Lakshmanan Karuppiah
  • Publication number: 20070158207
    Abstract: A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 12, 2007
    Inventors: Jie Diao, Renhe Jia, You Wang, Gerald Alonzo, Stan Tsai, Lakshmanan Karuppiah
  • Publication number: 20070151867
    Abstract: An apparatus and a method with fluid flow assist elements for electrochemical mechanical processing is provided in this invention. In one embodiment, the apparatus includes a first conductive layer having an upper surface adapted to contact a substrate, a second conductive layer disposed below the first conductive layer, an isolation layer disposed between the conductive layers, and a plurality of apertures, each having a first end formed through the first conductive layer and a second end formed through the second conductive layer, wherein the second ends of at least two apertures are laterally coupled by a channel.
    Type: Application
    Filed: May 10, 2006
    Publication date: July 5, 2007
    Inventors: Yongqi Hu, Stan Tsai, Gerald Alonzo, Lakshmanan Karuppiah
  • Publication number: 20070108066
    Abstract: Methods and apparatus for voltage-mode current control. A computer implemented method includes: (a) commencing a ECMP polishing step on a conductive film of a substrate; (b) setting a current output voltage of a voltage source, the current output voltage being set in accordance with a recipe for the ECMP polishing step; (c) measuring current flow through the conductive film; (d) calculating, based on the measured current flow, a current polishing rate; (e) determining whether an adjustment to the current output voltage is needed, the determining being based on a target polishing rate; and (f) when an adjustment is determined to be needed, calculating and effecting the adjustment to the current output voltage.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 17, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Stan Tsai, Lakshmanan Karuppiah
  • Publication number: 20070095677
    Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 3, 2007
    Inventors: You Wang, Stan Tsai, Lakshmanan Karuppiah, Jie Diao, Renhe Jia, Alpay Yilmaz
  • Publication number: 20070099552
    Abstract: An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 3, 2007
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler, Manoocher Birang, Paul Butterfield, Rashid Mavliev, Stan Tsai, You Wang, Jie Diao, Renhe Jia, Lakshmanan Karuppiah, Robert Ewald
  • Patent number: 7210981
    Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: May 1, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Alpay Yilmaz, Lakshmanan Karuppiah
  • Publication number: 20060270322
    Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
    Type: Application
    Filed: November 14, 2005
    Publication date: November 30, 2006
    Inventors: Alpay Yilmaz, Lakshmanan Karuppiah
  • Publication number: 20060249394
    Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
    Type: Application
    Filed: October 14, 2005
    Publication date: November 9, 2006
    Inventors: Renhe Jia, You Wang, Zhihong Wang, Jie Diao, Daxin Mao, Stan Tsai, Lakshmanan Karuppiah, Liang-Yuh Chen
  • Publication number: 20060249395
    Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
    Type: Application
    Filed: March 27, 2006
    Publication date: November 9, 2006
    Inventors: You Wang, Junzi Zhao, Jie Diao, Renhe Jia, Stan Tsai, Lakshmanan Karuppiah, Robert Ewald
  • Publication number: 20060196778
    Abstract: Methods for polishing tungsten are provided. During ECMP, increasing the voltage to the pad is not always enough to increase the polishing rate. When polishing tungsten, simply increasing the applied voltage will, in some cases, actually decrease the removal rate. By increasing the down force pressure between the polishing pad and the substrate, the applied voltage, and the rotation speed of the substrate and the polishing pad, the tungsten removal rate will also increase.
    Type: Application
    Filed: January 27, 2006
    Publication date: September 7, 2006
    Inventors: Renhe Jia, Zhihong Wang, Yuan Tian, Huyen Tran, Daxin Mao, Stan Tsai, Lakshmanan Karuppiah, Liang-Yuh Chen
  • Publication number: 20060154569
    Abstract: Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.
    Type: Application
    Filed: January 11, 2005
    Publication date: July 13, 2006
    Inventors: Terry Doyle, Lakshmanan Karuppiah
  • Publication number: 20060073768
    Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
    Type: Application
    Filed: October 4, 2005
    Publication date: April 6, 2006
    Inventors: Rashid Mavliev, Lakshmanan Karuppiah
  • Publication number: 20040197179
    Abstract: A substrate handler is provided comprising a carriage positionable along a first axis of motion, a first substrate gripper coupled to the carriage and positionable relative to the carriage along a second axis of motion oriented substantially perpendicular to the first axis of motion, and a second substrate gripper coupled to the carriage and positionable relative to the carriage along a third axis of motion oriented substantially parallel to the second axis of motion, wherein the second gripper is independently movable relative to the first gripper.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Younes Achkire, Dan Marohl, Lakshmanan Karuppiah
  • Publication number: 20040142563
    Abstract: In a substrate processing system, a mailbox associated with at least one of a first process and a first thread is locked to prevent access to the mailbox by messages other than a first message from at least one of a second process and a second thread. The first message from the at least one of the second process and the second thread is placed in the mailbox, a message counter in incremented, and the mailbox is unlocked to allow access to the mailbox by messages other than the first message.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 22, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Pierre Fontarensky, Lakshmanan Karuppiah