Patents by Inventor Lang Wu

Lang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7910040
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon fiber 1-20 wt %, modified organo clay or noble metal plated modified organo clay 0.5-10 wt %, and one or more conductive fillers selected form: carbon nanotube (CNT) 0.1-5 wt %, nickel plated carbon fiber 0.5-10 wt %, nickel plated graphite 2.5-40 wt %, and carbon black 2-30 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plate having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: March 22, 2011
    Assignee: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Hsu-Chiang Kuan, Han-Lang Wu, Hsun-Yu Su, Shu-Hang Liao, Chuan-Yu Yen, Yu-Feng Lin, Ying-Ying Cheng
  • Patent number: 7790050
    Abstract: A processing method of a polymer product is provided. This method first supplies a gas to an atmospheric pressure plasma machine to generate an ionized gas. Then, bombard the ionized gas to the surface of the polymer product to create a surface reaction. Afterwards, a dying treatment or an electroplating treatment is performed on the polymer product.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: September 7, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsiang Lin, Hsin-Ching Kao, Chi-Lang Wu
  • Publication number: 20100120592
    Abstract: A machine roller includes a core shaft having an inner hollow space and two opposite open ends communicating with the inner hollow space; and two support axles separately connected to the two open ends of the core shaft. The two support axles are connected to the core shaft by radio-frequency heating the core shaft and then extending the support axles into the inner hollow space via the two open ends. Therefore, the machine roller can reduce weight and be easily manufactured to enable decreased manufacturing cost thereof.
    Type: Application
    Filed: November 7, 2008
    Publication date: May 13, 2010
    Inventor: Yu-Lang WU
  • Publication number: 20090275453
    Abstract: A roller for various machines and apparatus includes at least one roller core having a hollow body and two opposite communicable open ends, and at least one end cap joined to at least one of the two opposite open ends of the roller core by way of friction welding. The end cap is provided on one of two opposite sides with an axially outward extended engaging section for inserting into the hollow body of the roller core, and an annular groove is provided around the engaging section. With the above arrangements, the roller can be easily produced at reduced manufacturing cost and having a reduced weight but increased structural strength.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Inventor: Yu-Lang Wu
  • Publication number: 20090124476
    Abstract: The present invention provides an improved roller structure of a business machine, having a side hole naturally formed on both distal sides of a hollow tubular roller body and provided for two sheet side covers to be coupled with the periphery of the side hole at a distal side of the roller body by friction welding, and at least one of the side covers has a ventilation hole for receiving an extended plunger to seal the cover, and a vertical protruding pivot shaft is installed at the center of another side of the two side covers (by an integral formation or a combination of separate components, such that the two pivot shafts can be extended along the direction of the shaft center of the roller body.
    Type: Application
    Filed: November 12, 2007
    Publication date: May 14, 2009
    Inventor: Yu-Lang Wu
  • Publication number: 20090108496
    Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.
    Type: Application
    Filed: March 17, 2008
    Publication date: April 30, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-hsiang Lin, Ya-Lan Chuang, Pei-Jung Tsat, Shu-Ling Yeh, Chin-Lang Wu, Cing-Jiuh Kang, Hsin-Ching Kao
  • Publication number: 20090111951
    Abstract: The disclosed is a blend including 20 to 80 parts by weight of polycarbonate, 20 to 80 parts by weight of polyarylate, and 20 to 80 parts by weight of copolymer having a formula as below: wherein R1 is a combination of at least two of ethylene, cyclohexlene dimethylene, 2-methyl propyl, and neopentyl. R2 is a combination of at least two of naphthalene, phenylene, butyl, and hexyl. n is a number of 1500 to 3000. The blend has high transparency, high thermal resistance, and high yellowing resistance under UV/climate, such that the blend is suitable to be applied in packaging material for light emitting device.
    Type: Application
    Filed: March 17, 2008
    Publication date: April 30, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-hsiang Lin, Ya-Lan Chuang, Pei-Jung Tsat, Shu-Ling Yeh, Chin-Lang Wu, Cing-Jiuh Kang, Hsin-Ching Kao
  • Publication number: 20090111966
    Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100° C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours, such that the copolymer is adapted to be applied in packaging material for light emitting devices.
    Type: Application
    Filed: March 17, 2008
    Publication date: April 30, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-hsiang Lin, Ya-Lan Chuang, Pei-Jung Tsat, Shu-Ling Yeh, Chin-Lang Wu, Cing-Jiuh Kang, Hsin-Ching Kao
  • Publication number: 20080193822
    Abstract: The present invention discloses a polymer blend of sulfonated polymer such as poly(ether ether ketone) and poly(amide imide) for use as an proton-conducting membrane. The poly(amide imide) is prepared by conducing a ring-opening and condensation reactions of diisocyanate and 1,2,4-benzenetricarboxylic anhydride (TMA). The polymer blend has a reduced methanol uptake and methanol permeability while maintaining good proton conductivity, and thus is suitable for use as a proton-conducting membrane of a fuel cell. The present invention also discloses a process for preparing the poly(amide imide).
    Type: Application
    Filed: January 22, 2008
    Publication date: August 14, 2008
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Han-Lang Wu, Tzong-Ming Lee, Yu-Feng Lin, Chia-Hsun Lee
  • Publication number: 20080061033
    Abstract: A processing method of a polymer product is provided. This method first supplies a gas to an atmospheric pressure plasma machine to generate an ionized gas. Then, bombard the ionized gas to the surface of the polymer product to create a surface reaction. Afterwards, a dying treatment or an electroplating treatment is performed on the polymer product.
    Type: Application
    Filed: December 27, 2006
    Publication date: March 13, 2008
    Inventors: Chih-Hsiang Lin, Hsin-Ching Kao, Chi-Lang Wu
  • Publication number: 20070164947
    Abstract: A method for driving a panel includes measuring common electrode voltage characteristics of the panel in the X and Y direction of the panel, and modifying driving voltages of the pixel units based on the corresponding measured common electrode voltage characteristics. The pixel units on different locations of the panel can thus be provided with a best symmetric center during the positive and negative driving periods.
    Type: Application
    Filed: June 8, 2006
    Publication date: July 19, 2007
    Inventors: Yu-Wen Lin, Kun-Lang Wu, Chung-Lung Li, Cho-Shien Lin
  • Publication number: 20060267235
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon fiber 1-20 wt %, modified organo clay or noble metal plated modified organo clay 0.5-10 wt %, and one or more conductive fillers selected form: carbon nanotube (CNT) 0.1-5 wt %, nickel plated carbon fiber 0.5-10 wt %, nickel plated graphite 2.5-40 wt %, and carbon black 2-30 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plate having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: July 7, 2005
    Publication date: November 30, 2006
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Ma, Hsu-Chiang Kuan, Han-Lang Wu, Hsun-Yu Su, Shu-Hang Liao, Chuan-Yu Yen, Yu-Feng Lin, Ying-Ying Cheng
  • Patent number: 7067896
    Abstract: Within an option selection device structure and a method for fabrication thereof there is formed a terminal metal layer and an option selection device at a co-planar level over a microelectronic substrate. The option selection device is passivated with: (1) a terminal metal passivation layer having an etch stop layer within its thickness; and (2) a bond pad passivation layer. There is simultaneously also formed through the bond pad passivation layer: (1) a via which accesses a bond pad formed contacting the terminal metal layer; and (2) an aperture over the option selection device which stops at the etch stop layer.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: June 27, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Juei-Kuo Wu, Yi-Lang Wu, Lin-June Wu, Dian-Hau Chen
  • Patent number: 6808589
    Abstract: A wafer transfer robot for a wafer processing system, such as a wet bench system, and a method for utilizing the robot. The wafer transfer robot can be constructed by a robot arm that is equipped with a plurality of wafer blades each adapted for picking-up and carrying one of a plurality of wafers. The plurality of wafer blades each has a predetermined thickness, a top surface, a bottom surface and a predetermined spacing from adjacent wafer blades. A plurality of sensors, such as optical sensors, capacitance sensors or magnetic sensors, with at least one mounted on the bottom side of one of the plurality of wafer blades for sensing the presence of metal on a wafer carried on an adjacent wafer blade immediately below the one of the plurality of wafer blades.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: October 26, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd
    Inventors: Yu-Sheng Su, Chiang-Jen Peng, Pin-Chia Su, Wen-Lang Wu
  • Publication number: 20040089916
    Abstract: Within an option selection device structure and a method for fabrication thereof there is formed a terminal metal layer and an option selection device at a co-planar level over a microelectronic substrate. The option selection device is passivated with: (1) a terminal metal passivation layer having an etch stop layer within its thickness; and (2) a bond pad passivation layer. There is simultaneously also formed through the bond pad passivation layer: (1) a via which accesses a bond pad formed contacting the terminal metal layer; and (2) an aperture over the option selection device which stops at the etch stop layer.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Juei-Kuo Wu, Yi-Lang Wu, Lin-June Wu, Dian-Hau Chen
  • Publication number: 20030230384
    Abstract: A wafer transfer robot for a wafer processing system, such as a wet bench system, and a method for utilizing the robot. The wafer transfer robot can be constructed by a robot arm that is equipped with a plurality of wafer blades each adapted for picking-up and carrying one of a plurality of wafers. The plurality of wafer blades each has a predetermined thickness, a top surface, a bottom surface and a predetermined spacing from adjacent wafer blades. A plurality of sensors, such as optical sensors, capacitance sensors or magnetic sensors, with at least one mounted on the bottom side of one of the plurality of wafer blades for sensing the presence of metal on a wafer carried on an adjacent wafer blade immediately below the one of the plurality of wafer blades.
    Type: Application
    Filed: June 14, 2002
    Publication date: December 18, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Sheng Su, Chiang-Jen Peng, Pin-Chia Su, Wen-Lang Wu
  • Patent number: 6498212
    Abstract: A polyester composition with improved hydrolytic stability is prepared by heating a molten mixture of: (A) a polyester resin; and (B) 0.05-10 wt %, based on the weight of the polyester resin, of a polymeric end-capping agent having an epoxy or amino functional group.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Ching Kao, Lee-Hua Chen, Chi-Lang Wu, Jinn-Jong Wong, Szu-Yuan Chan, Sheng-Te Yang
  • Patent number: 6376624
    Abstract: Compositions based on high viscosity, high molecular weight polyesters are prepared by heating a molten mixture of: (A) a prepolymer of a polyester resin; and (B) 0.05-10 wt %, based one the weight of the polyester prepolymer, of a multifunctional polymeric chain extender having functional groups selected from the group consisting of epoxy and isocyanate.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: April 23, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Ching Kao, Lee-Hua Chen, Chi-Lang Wu, Jinn-Jong Wong, Szu-Yuan Chan, Sheng-Te Yang
  • Patent number: 6341703
    Abstract: A container for holding substrates such as a wafer cassette for holding semiconductor wafers is provided. The container is equipped with dividers on the interior sidewalls of the container which are of different lengths or different colors such that an operator when inserting a substrate into the container can easily identify the corresponding pairs of dividers to avoid the cross-slot misplacement of and the subsequent damage to the substrate.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: January 29, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventor: Yi-Lang Wu
  • Patent number: 6239200
    Abstract: A composition suitable for use as a starting material for preparing a high molecular weight polyester through melt polymerization and solid state polymerization is disclosed. The composition comprises (a) a dicarboxylic acid or diester; (b) a glycol; (c) 0.1-5 mol %, relative to said component (a), of a multifunctional acid and/or a multifunctional alcohol; and (d) 0.05-5 wt %, based on the weight of the polyester, of a hindered phenolic aromatic phosphate. A process for preparing a high molecular weight polyester utilizing the above composition is also disclosed.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: May 29, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Ching Kao, Lee-Hua Chen, Chi-Lang Wu, Jinn-Jong Wong, Szu-Yuan Chan, Sheng-Te Yang