Patents by Inventor Lanlan Zhong
Lanlan Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11527437Abstract: Methods and apparatus for filling features on a substrate are provided herein. In some embodiments, a method of filling features on a substrate includes: depositing a first metallic material on the substrate and within a feature disposed in the substrate in a first process chamber via a chemical vapor deposition (CVD) process at a first temperature; depositing a second metallic material on the first metallic material in a second process chamber at a second temperature and at a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second process chamber at a second bias power greater than the first bias power to form an intermix layer within the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature, causing a reflow of the second metallic material.Type: GrantFiled: September 15, 2020Date of Patent: December 13, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Lanlan Zhong, Fuhong Zhang, Gang Shen, Feng Chen, Rui Li, Xiangjin Xie, Tae Hong Ha, Xianmin Tang
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Patent number: 11492699Abstract: Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at least a portion of a life of a sputtering target disposed in the PVD chamber, wherein a substrate-to-target distance in the PVD chamber and a support-to-target distance within the PVD chamber are each controlled as a function of the life of the sputtering target.Type: GrantFiled: February 17, 2021Date of Patent: November 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Suhas Bangalore Umesh, Preetham Rao, Shirish A. Pethe, Fuhong Zhang, Kishor Kumar Kalathiparambil, Martin Lee Riker, Lanlan Zhong
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Publication number: 20220259720Abstract: Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at least a portion of a life of a sputtering target disposed in the PVD chamber, wherein a substrate-to-target distance in the PVD chamber and a support-to-target distance within the PVD chamber are each controlled as a function of the life of the sputtering target.Type: ApplicationFiled: February 17, 2021Publication date: August 18, 2022Inventors: Suhas BANGALORE UMESH, Preetham RAO, Shirish A. PETHE, Fuhong ZHANG, Kishor Kumar KALATHIPARAMBIL, Martin Lee RIKER, Lanlan ZHONG
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Patent number: 11315771Abstract: Methods and apparatus for processing a substrate are provided herein. A method, for example, includes igniting a plasma at a first pressure within a processing volume of a process chamber; depositing sputter material from a target disposed within the processing volume while decreasing the first pressure to a second pressure within a first time frame while maintaining the plasma; continuing to deposit sputter material from the target while decreasing the second pressure to a third pressure within a second time frame less than the first time frame while maintaining the plasma; and continuing to deposit sputter material from the target while maintaining the third pressure for a third time frame that is greater than or equal to the second time frame while maintaining the plasma.Type: GrantFiled: July 14, 2020Date of Patent: April 26, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Xiangjin Xie, Fuhong Zhang, Shirish A. Pethe, Martin Lee Riker, Lewis Yuan Tse Lo, Lanlan Zhong, Xianmin Tang, Paul Dennis Connors
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Patent number: 11289329Abstract: Methods and apparatus for method for filling a feature with copper. In some embodiments, the methods include: (a) depositing a first cobalt layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a bottom surface of a feature disposed in a substrate to form a first cobalt portion atop the substrate field and a second cobalt portion atop the sidewall; (b) depositing copper atop the first cobalt portion atop the substrate field; and (c) flowing the copper disposed atop the first cobalt portion atop the substrate field over the second cobalt portion and into the feature, wherein the first cobalt portion atop the substrate field reduces the mobility of copper compared to the mobility of copper over the second cobalt portion.Type: GrantFiled: January 25, 2020Date of Patent: March 29, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Rui Li, Xiangjin Xie, Fuhong Zhang, Shirish Pethe, Adolph Allen, Lanlan Zhong, Xianmin Tang
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Publication number: 20220084882Abstract: Methods and apparatus for filling features on a substrate are provided herein. In some embodiments, a method of filling features on a substrate includes: depositing a first metallic material on the substrate and within a feature disposed in the substrate in a first process chamber via a chemical vapor deposition (CVD) process at a first temperature; depositing a second metallic material on the first metallic material in a second process chamber at a second temperature and at a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second process chamber at a second bias power greater than the first bias power to form an intermix layer within the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature, causing a reflow of the second metallic material.Type: ApplicationFiled: September 15, 2020Publication date: March 17, 2022Inventors: Lanlan ZHONG, Fuhong ZHANG, Gang SHEN, Feng CHEN, Rui LI, Xiangjin XIE, Tae Hong HA, Xianmin TANG
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Publication number: 20220020578Abstract: Methods and apparatus for processing a substrate are provided herein. A method, for example, includes igniting a plasma at a first pressure within a processing volume of a process chamber; depositing sputter material from a target disposed within the processing volume while decreasing the first pressure to a second pressure within a first time frame while maintaining the plasma; continuing to deposit sputter material from the target while decreasing the second pressure to a third pressure within a second time frame less than the first time frame while maintaining the plasma; and continuing to deposit sputter material from the target while maintaining the third pressure for a third time frame that is greater than or equal to the second time frame while maintaining the plasma.Type: ApplicationFiled: July 14, 2020Publication date: January 20, 2022Inventors: Xiangjin XIE, Fuhong ZHANG, Shirish A. PETHE, Martin Lee RIKER, Lewis Yuan Tse LO, Lanlan ZHONG, Xianmin TANG, Paul Dennis CONNORS
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Patent number: 11222816Abstract: A method of filling structures on a substrate uses a semi-dynamic reflow process. The method may include depositing a metallic material on the substrate at a first temperature, heating the substrate to a second temperature higher than the first temperature wherein heating of the substrate causes a static reflow of the deposited metallic material on the substrate, stopping heating of the substrate, and depositing additional metallic material on the substrate causing a dynamic reflow of the deposited additional metallic material on the substrate. RF bias power may be applied during the dynamic reflow to facilitate in maintaining the temperature of the substrate.Type: GrantFiled: June 16, 2020Date of Patent: January 11, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Lanlan Zhong, Shirish A. Pethe, Fuhong Zhang, Joung Joo Lee, Kishor Kalathiparambil, Xiangjin Xie, Xianmin Tang
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Publication number: 20210391214Abstract: A method of filling structures on a substrate uses a semi-dynamic reflow process. The method may include depositing a metallic material on the substrate at a first temperature, heating the substrate to a second temperature higher than the first temperature wherein heating of the substrate causes a static reflow of the deposited metallic material on the substrate, stopping heating of the substrate, and depositing additional metallic material on the substrate causing a dynamic reflow of the deposited additional metallic material on the substrate. RF bias power may be applied during the dynamic reflow to facilitate in maintaining the temperature of the substrate.Type: ApplicationFiled: June 16, 2020Publication date: December 16, 2021Inventors: Lanlan ZHONG, Shirish A. PETHE, Fuhong ZHANG, Joung Joo LEE, Kishor KALATHIPARAMBIL, Xiangjin XIE, Xianmin TANG
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Patent number: 11152608Abstract: A silicon and tin based micro-structured material and methods are shown. In one example, the silicon and tin based micro-structured material is used as an electrode in a battery, such as a lithium ion battery.Type: GrantFiled: May 31, 2017Date of Patent: October 19, 2021Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Lorenzo Mangolini, Lanlan Zhong
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Publication number: 20200350159Abstract: Methods and apparatus for method for filling a feature with copper. In some embodiments, the methods include: (a) depositing a first cobalt layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a bottom surface of a feature disposed in a substrate to form a first cobalt portion atop the substrate field and a second cobalt portion atop the sidewall; (b) depositing copper atop the first cobalt portion atop the substrate field; and (c) flowing the copper disposed atop the first cobalt portion atop the substrate field over the second cobalt portion and into the feature, wherein the first cobalt portion atop the substrate field reduces the mobility of copper compared to the mobility of copper over the second cobalt portion.Type: ApplicationFiled: January 25, 2020Publication date: November 5, 2020Inventors: Rui LI, Xiangjin XIE, Fuhong Zhang, Shirish PETHE, Adolph ALLEN, Lanlan Zhong, Xianmin TANG
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Publication number: 20190173077Abstract: A silicon and tin based micro-structured material and methods are shown. In one example, the silicon and tin based micro-structured material is used as an electrode in a battery, such as a lithium ion battery.Type: ApplicationFiled: May 31, 2017Publication date: June 6, 2019Inventors: Lorenzo Mangolini, Lanlan Zhong
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Patent number: 10084184Abstract: A nanostructured composite material includes a substrate, a porous layer including a highly structured material, and a coating including nanoparticles. A method for forming the nanostructured composite material can include forming a porous layer on a substrate, the porous layer including a highly structured material, and applying nanoparticles to the porous layer to form the nanostructured composite material.Type: GrantFiled: April 2, 2014Date of Patent: September 25, 2018Assignee: The Regents of the University of CaliforniaInventors: Lorenzo Mangolini, Lanlan Zhong
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Publication number: 20140295269Abstract: A nanostructured composite material includes a substrate, a porous layer including a highly structured material, and a coating including nanoparticles. A method for forming the nanostructured composite material can include forming a porous layer on a substrate, the porous layer including a highly structured material, and applying nanoparticles to the porous layer to form the nanostructured composite material.Type: ApplicationFiled: April 2, 2014Publication date: October 2, 2014Applicant: The Regents of the University of CaliforniaInventors: Lorenzo Mangolini, Lanlan Zhong
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Patent number: D858468Type: GrantFiled: March 16, 2018Date of Patent: September 3, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
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Patent number: D859333Type: GrantFiled: March 16, 2018Date of Patent: September 10, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
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Patent number: D997111Type: GrantFiled: April 4, 2022Date of Patent: August 29, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Fuhong Zhang, Lanlan Zhong, Kishor Kumar Kalathiparambil
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Patent number: D998575Type: GrantFiled: April 7, 2020Date of Patent: September 12, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Fuhong Zhang, Lanlan Zhong, Kishor Kumar Kalathiparambil