Abstract: A radio information broadcasting and receiving system consisting of three major parts: an FM transmitter station with subcarrier multiplexing capability, an FM receiver apparatus with subcarrier demodulation capability, and a computer connected in combination with the receiver apparatus. The FM transmitter station includes sources of main programming signals first digital data signals and second digital data signals. The first and second digital data signals are modulated by subcarrier 1 and subcarrier 2 frequencies respectively and are mixed with the main program signal and then transmitted. The transmitted signals are received by a receiver apparatus including an FM receiver circuit and an FM demodulator circuit for receiving the broadcast signal and demodulating it. The demodulated main program audio frequency signal is applied through a filter/deemphasis circuit and amplifier to speaker to provide an audio output.

Abstract: The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to be essentially vertical with respect to the keyboard and when it is desired to provide graphic information entry, the display can be turned over so as to serve as a writing surface when the hinged frame is positioned over the keyboard. The conversion from keyboard to graphic stylus input is accomplished by rotating the display on the pivot mountings and then closing the frame over the keyboard with the display surface up and in the proper orientation.

Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures.

Abstract: A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks.

Abstract: A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures. A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region.

Abstract: Heat dissipation structures formed from folded sheet metal are described. The structure permits close thermal contact to a heat generating surface by permitting independent movement of fins or fin assemblies. The fin assemblies are spring biased towards the heat generating surface by a spring means which is disposed between the tops of the fin assemblies and a cover which forms a duct surrounding the fin assemblies for holding the fin assemblies together and for permitting a fluid, such as air, to be channeled over the fin assemblies. The cover has grips for gripping onto the side portions of the heat generating surface. Furthermore, the cover has means for gripping onto the spring bias means for fixedly attaching it thereto. Furthermore, the fin assemblies have means for engaging with the bias means for holding the fin assemblies in fixed special relation with the spring bias means.

Abstract: In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.

Abstract: In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.

Abstract: An integrated circuit chip package is described wherein the chip has an active face including a plurality of input and output pads. The chip is mounted face down on a pluralilty of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board. A convective heat sink is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden acceleration. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points which are physically connected to the underlying circuit board via resilient connecting means.

Abstract: A TAB package is described which includes a flexible dielectric film with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads, which leads extend into the aperture and connect to a semiconductor chip. Thermally conductive body means is provided which has a well formed therein, the well defined by a lip comprising the outer rim of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means and the flexible dielectric film is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.