Patents by Inventor Lei Feng
Lei Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12359485Abstract: Embodiments of this application provide a damping assembly, a rotating mechanism, and a foldable terminal. The damping assembly has a simple structure and occupies a relatively small space, which is conductive to a lightening and thinning design of a foldable terminal. The damping assembly includes a damping section and a shaft sleeve sleeved onto the damping part, where the damping section includes a first damping part and a second damping part, and the shaft sleeve includes a first shaft sleeve part and a second shaft sleeve part an interference amount between the first shaft sleeve part and the first damping part is a first interference amount; an interference amount between the second shaft sleeve part and the second damping part is a second interference amount, and the second interference amount is less than the first interference amount.Type: GrantFiled: September 5, 2022Date of Patent: July 15, 2025Assignee: HONOR DEVICE CO., LTD.Inventors: Yameng Wei, Lei Feng, Wenxing Yao, Wei Zhang
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Publication number: 20250197978Abstract: Provided is a production process of an S355J2 hot rolled H-beam for a Ce-containing beam-column member, relating to the production of hot-rolled H-beams. The production process can ensure the performance of the hot-rolled H-beam with multiple classes from one steel grade, and achieve low cost, stability, uniformity, consistency, and narrow composition control of various elements. In the S355J2 hot-rolled H-beam for a Ce-containing beam-column member, a hot-rolled H-beam is prepared from the following compositions by mass fraction: 0.18%-0.20% of C, 0.25%-0.30% of Si, 1.22%-1.27% of Mn, less than or equal to 0.025% of P, less than or equal to 0.025% of S, 0.008%-0.011% of Nb, 0.008%-0.012% of V, 0.004%-0.008% of N, 0.0015%-0.0055% of Ce, less than or equal to 0.015% of Al, and the rest of Fe and inevitable impurities.Type: ApplicationFiled: March 5, 2025Publication date: June 19, 2025Inventors: Fei Huang, Yanqing Feng, Haiyan Wang, Guochen Wu, Lei Xing, Lei Feng, Jing Lei
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Patent number: 12328407Abstract: A cover body structure, a back cover, and an electronic device are provided, related to the field of electronic device technologies. The cover body structure includes a glass cover plate, a first ink layer, a first glue layer, and a plastic edge portion. The first ink layer is disposed at least on an edge of the glass cover plate. The first glue layer is disposed on the first ink layer on the edge of the glass cover plate. The plastic edge portion is disposed on the first glue layer on the edge of the glass cover plate. The first glue layer is a glue layer viscous at least at an injection molding temperature of the plastic edge portion, and the first ink layer is an ink layer that is able to withstand the injection molding temperature of the plastic edge portion.Type: GrantFiled: August 30, 2021Date of Patent: June 10, 2025Assignee: HONOR DEVICE CO., LTD.Inventors: Yang Liu, Lei Feng, Wei Zhang, Wenxing Yao
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Patent number: 12300576Abstract: A cyclic cooling embedded packaging substrate and a manufacturing method thereof are disclosed. The packaging substrate includes a dielectric material body, a chip, a first metal face, a second metal face and a first trace. The dielectric material body is provided with a packaging cavity, the chip is packaged in the packaging cavity, the first metal face is embedded in the dielectric material body, covers and is connected to a heat dissipation face of the chip. The second metal face is embedded in the dielectric material body, connected to a surface of the first metal face, and is provided with a first cooling channel pattern for forming a cooling channel. The first trace is arranged on a surface of the dielectric material body or embedded therein, and is connected with a corresponding terminal on an active face of the chip through a first conductive structure.Type: GrantFiled: May 22, 2022Date of Patent: May 13, 2025Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.Inventors: Xianming Chen, Yejie Hong, Benxia Huang, Lei Feng
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Publication number: 20250149461Abstract: A multi-device graded embedding package substrate includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer includes a first conductive copper pillar layer and a first device cavity. The second dielectric layer includes a first wiring layer located in a lower surface of the second dielectric layer, a second conductive copper pillar layer and a heat dissipation copper block layer provided on the first wiring layer. The third dielectric layer includes a second wiring layer, a third conductive copper pillar layer provided on the second wiring layer. A first device is attached to the bottom of the first device cavity, and a terminal of the first device is in conductive connection with the second wiring layer. A second device is attached to the bottom of a second device cavity penetrating through the first, second and third dielectric layers.Type: ApplicationFiled: January 7, 2025Publication date: May 8, 2025Inventors: XIANMING CHEN, LEI FENG, BENXIA HUANG, YEJIE HONG
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Patent number: 12288726Abstract: An array substrate, a display panel and methods of manufacturing the same are provided. The method of manufacturing an array substrate according to an embodiment of the present disclosure includes: forming f pixel electrodes and a conductive structure on a substrate through a patterning process, wherein the pixel electrodes arranged in a first direction are connected through the conductive structure; and forming a signal line on the substrate through a patterning process, wherein the signal line and the pixel electrodes are disposed in the same layer. By means of the array substrate according to the embodiments of the present disclosure, the problem that it is not easy to discover the point defects caused by short circuit between the signal line and pixel electrodes in the related art can be solved.Type: GrantFiled: May 27, 2021Date of Patent: April 29, 2025Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yu Ji, Guoping Qian, Lei Feng, Wanqing Chen, Lingling Zeng, Xianchun Huang, Chao Zhou, Youpeng Gan
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Publication number: 20250130309Abstract: The provided is a remote sensing observation equipment, including a base and a remote sensing observation instrument, the remote sensing observation instrument is located above the base, a lifting mechanism is arranged between the remote sensing observation instrument and the base, a sliding groove is arranged on both sides of the middle part of the base, both of the sliding grooves are slidingly assembled with sliding seats, both of the sliding seats are fixed with a first protective shell, the ends of the two first protective shells are abut against each other and located outside the remote sensing observation instrument, a fixed mechanism is arranged between the sliding seat and the sliding groove; protecting the remote sensing observation instrument through the first protective shell and the second protective shell being closed to each other, avoids the instrument being damaged by collision, and prolongs the service life of the instrument.Type: ApplicationFiled: October 16, 2024Publication date: April 24, 2025Applicants: Chongqing Academy of Ecology and Environment Sciences, Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Zhongke Yaoguang (Chongqing) Intelligent Technology Co., Ltd., Chongqing Pulus Environmental Protection Technology Development Co., Ltd.Inventors: Li FENG, Lei FENG, Weiling LIAO, Jinkun XU, Menglan GAN, Yao WANG, Jiawei PANG, Xiaohu YU, Botian ZHOU, Boxun CHEN, Jun MOU
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Patent number: 12282357Abstract: A support apparatus and a foldable electronic device are provided. The support apparatus includes a hinge assembly, a first housing, a second housing, and a first flexible sealing member. The hinge assembly includes a rotating shaft mechanism and a shaft cover, where the rotating shaft mechanism is fastened to the shaft cover. The first housing and the second housing are respectively located on two opposite sides of the hinge assembly, the first housing and the second housing are configured to rotate relative to the shaft cover through the rotating shaft mechanism, the first housing, the second housing, and the rotating shaft mechanism each have a support surface for supporting a foldable screen, and a first movement gap is present between the first housing and an outer surface of the shaft cover. The first flexible sealing member fits into and seals the first movement gap.Type: GrantFiled: April 27, 2022Date of Patent: April 22, 2025Assignee: Honor Device Co., Ltd.Inventors: Yangjie Tang, Yameng Wei, Lei Feng, Yuan Wang, Wenxing Yao
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Patent number: 12278227Abstract: A hybrid embedded packaging structure and a manufacturing method thereof are disclosed. The structure includes: a substrate with a first insulating layer, a conductive copper column, a chip-embedded cavity and a first circuit layer; a first electronic device arranged inside the chip-embedded cavity; a second electronic device arranged on a back surface of the first electronic device; a second insulating layer covering and filling the chip-embedded cavity and an upper layer of the substrate, exposing part of the first circuit layer and a back surface of part of the second electronic device or part of the first electronic device; a second circuit layer electrically connected with the conductive copper column and a terminal of the first electronic device; a conducting wire electrically connecting the first circuit layer with a terminal of the second electronic device; and a protection cover arranged on the top surface of the substrate.Type: GrantFiled: June 17, 2022Date of Patent: April 15, 2025Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.Inventors: Xianming Chen, Lei Feng, Benxia Huang, Yejie Hong
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Patent number: 12269523Abstract: The present invention relates to a TACS system supporting a fallback train control mode and a manual fault handling mode. The system supports mixed running operation of a main mode train and a degraded mode train. The main mode is a TACS mode, and the degraded mode includes a fallback mode and a device cut-off mode. The TACS system includes a central train supervision device, a station train dispatching device, a wayside resource management unit RMU, a wayside target controller OC, a data communication system DCS, and an on-board controller CC. Compared with the prior art, the present invention has the advantages of improving the functionality and practicality of the system.Type: GrantFiled: September 22, 2021Date of Patent: April 8, 2025Assignee: CASCO SIGNAL LTD.Inventors: Jianhua Jiang, Xiang Chen, Lei Feng
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Patent number: 12271236Abstract: This application provides a rotation mechanism, a supporting apparatus, and a foldable screen terminal, and relates to the field of electronic device technologies, so as to balance a lifting stroke of the lifting member and a thickness of the foldable screen terminal in an unfolded state. The rotation mechanism includes a lifting member, a shaft cover, a first swing arm, a second swing arm, a forcing structure, and a first supporting member. The lifting member includes a lamination surface. The shaft cover is located on a side that is of the lifting member and that is away from the lamination surface. The first swing arm and the second swing arm are respectively located on two opposite sides of the lifting member, and the first swing arm and the second swing arm can swing between an unfolded position and a folded position relative to the shaft cover.Type: GrantFiled: September 2, 2022Date of Patent: April 8, 2025Assignee: HONOR DEVICE CO., LTD.Inventors: Lei Feng, Yameng Wei, Haifei Li, Yangjie Tang, Yuan Wang
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Publication number: 20250110562Abstract: A vibration control method, includes: displaying an element control region including first control elements that includes one or more anchor elements and non-anchor elements; receiving a triggering operation performed on a first control element; and outputting a vibration associated with at least one acted control element based on the triggering operation acting on at least one of the first control elements, wherein, based on the at least one acted control element being an anchor element, the outputting the vibration includes outputting an anchor vibration; and the method further includes determining output information corresponding to the at least one acted control element based on the anchor vibration, and wherein, based on the at least one acted control element being a non-anchor element, the method further includes determining the output information based on the anchor vibration, a layout of the element control region, and an operation track of the triggering operation.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Applicant: Tencent Technology (Shenzhen ) Company LimitedInventors: Shili XU, Lina Gao, Siliang Liu, Kai Hong, Xun Sun, Yitao Zhao, Lei Feng
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Publication number: 20250085957Abstract: A version updating system and a version updating method are provided. The version updating system includes a cloud server configured to execute a version updating tool, a version matching component, and a heterogeneous system management module that communicates with a heterogeneous system and a sub-business system. When the cloud server receives a version updating request for a cloud application, the version updating tool executes and prompts the version matching component to obtain version information of the heterogeneous system through the heterogeneous system management module. When the version information fails to meet version requirements, the version matching component records that the version information does not meet the version requirements and transmits a version updating notification to the sub-business system.Type: ApplicationFiled: February 15, 2024Publication date: March 13, 2025Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Publication number: 20250077846Abstract: The present application at least describes a method including a step of receiving, at a convolutional neural network (CNN), data over a network from a source. The CNN may include one or more blocks. Each block may include plural layers. The method may include a step of causing, via the CNN in a first layer of the first block, a representation of the received data as a first matrix having M rows and N columns. The M rows and N columns may be greater than or equal to 1. The method may also include a step of processing, via the CNN at the first layer of the first block, the first matrix via a predetermined kernel matrix. The kernel matrix may include M-X rows and N-Y columns. X and Y may be greater than or equal to 1. The method may also include a step of rendering, via the CNN based on the processed first matrix, a second matrix having M-2 rows and N-2 columns.Type: ApplicationFiled: September 5, 2023Publication date: March 6, 2025Inventors: Xianliang Zha, Yunqing Chen, Harikrishna Madadi Reddy, Lei Feng, Chien Cheng Liu, Raghuvardhan Moola
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Publication number: 20250078204Abstract: The present application describes systems, methods, devices, and computer program products for convolutional neural networks (CNN) applicable for image processing, image scaling, and computer vision-oriented operations. Various embodiments for image scaling may receive image data corresponding to a first resolution. The image data may have a channel size and a data size. A CNN may be applied to process the image data according to a set of kernels. A first kernel set and a second kernel set may be independently applied to the image data to generate a first output set and a second output set. An interleaved set may be generated from the first output set and the second output set. An output image having a second data size may be generated from the output sets.Type: ApplicationFiled: September 5, 2023Publication date: March 6, 2025Inventors: Xianliang Zha, Lei Feng, Chien Cheng Liu, Harikrishna Madadi Reddy, Raghuvardhan Moola, Yunqing Chen
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Publication number: 20250080963Abstract: A method of transmitting a block of data to node devices in a network is disclose. The network comprises a plurality of operatively interconnected node devices, each node device supports both long range communication and short range communication. The method comprises the steps of: receiving, by at least one node device selected for receiving the block of data, at least a part of the block of data via long range communication: receiving, by other node devices via long range communication, an indication to receive the at least part of the block of data via short range communication: transmitting, by the at least one selected node device, the at least part of the block of data to other node devices via short range communication; and receiving, by one of the other node devices, the at least part of the block of data via short range communication.Type: ApplicationFiled: January 5, 2023Publication date: March 6, 2025Inventors: LEI FENG, JAYA KARTHIK
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Patent number: 12242422Abstract: A data processing system and a method of automatically initiating a process. The data processing system includes a local server and a cloud server. The cloud server includes a storage apparatus and a processor. The processor is coupled to the storage apparatus, and configured to executed a file identification-parsing device and a detection system. The local server outputs a file to the cloud server, such that the file identification-parsing device performs an identification-parsing operation to generate a file content. The cloud server stores the file content in a database. The detection system performs a detection operation on the database to generate a file change content. The detection system generates business process information according to the file change content, and outputs the business process information to a process system. The process system executes the business process information, and displays manual operation information and an execution result on a display screen.Type: GrantFiled: April 23, 2023Date of Patent: March 4, 2025Assignees: DIGIWIN CO., LTD., DATA SYSTEMS CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Patent number: 12230581Abstract: A multi-device graded embedding package substrate includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer includes a first conductive copper pillar layer and a first device cavity. The second dielectric layer includes a first wiring layer located in a lower surface of the second dielectric layer, a second conductive copper pillar layer and a heat dissipation copper block layer provided on the first wiring layer. The third dielectric layer includes a second wiring layer, a third conductive copper pillar layer provided on the second wiring layer. A first device is attached to the bottom of the first device cavity, and a terminal of the first device is in conductive connection with the second wiring layer. A second device is attached to the bottom of a second device cavity penetrating through the first, second and third dielectric layers.Type: GrantFiled: May 11, 2022Date of Patent: February 18, 2025Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.Inventors: Xianming Chen, Lei Feng, Benxia Huang, Yejie Hong
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Patent number: 12204748Abstract: A virtual keyboard setting method includes: determining an operation region and a trigger region, the operation region being a region operated in a screen for using an input method, and the trigger region being a region covered by an external entity when touching the screen; determining a display region of a virtual keyboard according to the operation region; determining an area of a virtual key in the virtual keyboard according to the trigger region; and setting the virtual keyboard according to the display region of the virtual keyboard and the area of the virtual key.Type: GrantFiled: August 16, 2023Date of Patent: January 21, 2025Assignee: BEIJING SOGOU TECHNOLOGY DEVELOPMENT CO., LTD.Inventors: Lei Feng, Jian Lu, Jin Cao, Miaoli Hu, Wei Hu, Yihang Yang, Xiaoxue Song, Haixin Li
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Patent number: D1077551Type: GrantFiled: March 8, 2023Date of Patent: June 3, 2025Inventor: Lei Feng