Patents by Inventor Lei Feng
Lei Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250080963Abstract: A method of transmitting a block of data to node devices in a network is disclose. The network comprises a plurality of operatively interconnected node devices, each node device supports both long range communication and short range communication. The method comprises the steps of: receiving, by at least one node device selected for receiving the block of data, at least a part of the block of data via long range communication: receiving, by other node devices via long range communication, an indication to receive the at least part of the block of data via short range communication: transmitting, by the at least one selected node device, the at least part of the block of data to other node devices via short range communication; and receiving, by one of the other node devices, the at least part of the block of data via short range communication.Type: ApplicationFiled: January 5, 2023Publication date: March 6, 2025Inventors: LEI FENG, JAYA KARTHIK
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Patent number: 12242422Abstract: A data processing system and a method of automatically initiating a process. The data processing system includes a local server and a cloud server. The cloud server includes a storage apparatus and a processor. The processor is coupled to the storage apparatus, and configured to executed a file identification-parsing device and a detection system. The local server outputs a file to the cloud server, such that the file identification-parsing device performs an identification-parsing operation to generate a file content. The cloud server stores the file content in a database. The detection system performs a detection operation on the database to generate a file change content. The detection system generates business process information according to the file change content, and outputs the business process information to a process system. The process system executes the business process information, and displays manual operation information and an execution result on a display screen.Type: GrantFiled: April 23, 2023Date of Patent: March 4, 2025Assignees: DIGIWIN CO., LTD., DATA SYSTEMS CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Patent number: 12230581Abstract: A multi-device graded embedding package substrate includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer includes a first conductive copper pillar layer and a first device cavity. The second dielectric layer includes a first wiring layer located in a lower surface of the second dielectric layer, a second conductive copper pillar layer and a heat dissipation copper block layer provided on the first wiring layer. The third dielectric layer includes a second wiring layer, a third conductive copper pillar layer provided on the second wiring layer. A first device is attached to the bottom of the first device cavity, and a terminal of the first device is in conductive connection with the second wiring layer. A second device is attached to the bottom of a second device cavity penetrating through the first, second and third dielectric layers.Type: GrantFiled: May 11, 2022Date of Patent: February 18, 2025Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.Inventors: Xianming Chen, Lei Feng, Benxia Huang, Yejie Hong
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Patent number: 12204748Abstract: A virtual keyboard setting method includes: determining an operation region and a trigger region, the operation region being a region operated in a screen for using an input method, and the trigger region being a region covered by an external entity when touching the screen; determining a display region of a virtual keyboard according to the operation region; determining an area of a virtual key in the virtual keyboard according to the trigger region; and setting the virtual keyboard according to the display region of the virtual keyboard and the area of the virtual key.Type: GrantFiled: August 16, 2023Date of Patent: January 21, 2025Assignee: BEIJING SOGOU TECHNOLOGY DEVELOPMENT CO., LTD.Inventors: Lei Feng, Jian Lu, Jin Cao, Miaoli Hu, Wei Hu, Yihang Yang, Xiaoxue Song, Haixin Li
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Patent number: 12182009Abstract: A method for locating a fault information is provided. The method includes: parsing error information of a target application to obtain version information and an error attribute of the target application; determining, based on the version information, a target mapping file corresponding to the error information; and determining a target location by utilizing the error attribute and the target mapping file, where the target location is used to determine a location of fault description content.Type: GrantFiled: November 22, 2022Date of Patent: December 31, 2024Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.Inventors: Yang Peng, Lei Feng, Zhenxing Cao, Weida Liao, Huanan Lu, Yuzhen Chen
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Publication number: 20240417283Abstract: A water treatment device based on micro-nano bubble technology includes the micro-nano bubble generation device and the sewage tank, the sewage tank is also installed with water surface sewage collection mechanism and water surface sewage cleaning mechanism, the water surface sewage collection mechanism includes the pushing plate and the first transmission component, the pushing plate and the sewage tank are slidingly connected, and the pushing plate is also fixedly connected to the limit connecting rod, the water surface sewage cleaning mechanism includes the cleaning sieve plate and the sewage collecting box, and the cleaning sieve plate is vertically arranged inside the sewage tank, and the sewage tank is fixedly connected with the hinged table, the hinged table is connected with the first rotating shaft and the rear wall of the sewage tank is also equipped with the second transmission component.Type: ApplicationFiled: December 7, 2023Publication date: December 19, 2024Applicants: Chongqing Academy of Eco-environmental sciences, Chongqing Institute of Green and Intelligent Technology, Chinese Academy of SciencesInventors: Li FENG, Weiling LIAO, Yong ZHANG, Lei FENG
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Patent number: 12168994Abstract: This application provides a rotating mechanism, a support apparatus, and a terminal with a foldable screen. A problem that a rotating part with a large volume affects lightening and thinning of an existing terminal with a foldable screen is resolved. A transmission assembly is in a transmission connection to a first swing arm and a second swing arm, so that the first swing arm and the second swing arm rotate between a folded position and an unfolded position. When the first swing arm and the second swing arm rotate from the folded position to the unfolded position, a connection plate moves in a direction away from the shaft cover, and when the first swing arm and the second swing arm rotate from the unfolded position to the folded position, the connection plate moves in a direction close to the shaft cover.Type: GrantFiled: April 26, 2022Date of Patent: December 17, 2024Assignee: HONOR DEVICE CO., LTD.Inventors: Lei Feng, Yameng Wei, Wei Zhang, Wenxing Yao
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Publication number: 20240409129Abstract: A head propeller of the flying vehicle compresses incoming flow at a vehicle head inside an upper duct to a lower duct through an air suction channel. A portion of airflow is compressed to the lower duct through the air suction channel under an action of a guide plate and a vehicle body propeller. A bottom propeller of the flying vehicle compresses an airflow into pressure bins of the lower duct at a lower portion through the air suction channel. A sealing state of the pressure bins of the lower duct is destroyed. High-pressure airflow inside the lower duct is jetted out from an air outlet channel to the upper duct. A tail propeller guides the airflow to the tail portion of the vehicle body. The upper duct and the lower duct are constructed inside the pipeline, so a running resistance of the flying vehicle is reduced.Type: ApplicationFiled: January 31, 2024Publication date: December 12, 2024Applicant: North University of ChinaInventors: Tiehua MA, Kun ZHANG, Yaoyan WU, Changxin CHEN, Lei FENG
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Publication number: 20240406296Abstract: This application discloses a synchronous rotation mechanism and a foldable electronic device, and relates to the field of electronic device technologies. The synchronous rotation mechanism is used in a foldable electronic device. The synchronous rotation mechanism includes torque swing arms and a sliding member. The torque swing arms on two sides of the sliding member are connected by the sliding member. The torque swing arms are rotatably connected to the sliding member by sliders and helical slots, so that when the torque swing arm on one side rotates, the slider and the helical slot synchronously drive the sliding member to slide in a direction perpendicular to rotation of the torque swing arm, and then to drive the torque swing arm on another side to rotate synchronously.Type: ApplicationFiled: April 26, 2023Publication date: December 5, 2024Applicant: Honor Device Co., Ltd.Inventors: Lei FENG, Yameng WEI, Haifei LI, Handong ZHANG
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Publication number: 20240403201Abstract: A software test method and a software test system including a storage device and a processor are provided. A plurality of modules are stored. The processor executes the modules in the storage device. An interface module accesses activated use case information of an electronic device to generate a test case file, so that the electronic device performs a test call operation on the interface module according to the test case file through a component under test (CUT). The interface module includes simulation component interfaces. Executing the test call operation includes sub-test call operations. An execution module respectively analyzes the sub-test call operations performed by the CUT sequentially calling the simulation component interfaces to generate sets of test progress information. A determination module generates and provides a test result to the electronic device according to a test configuration file and the sets of test progress information to improve test performance.Type: ApplicationFiled: July 10, 2023Publication date: December 5, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Weiwei Zhang, Lei Feng, Guoxin Sun
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Publication number: 20240394307Abstract: A data construction system and a data construction method. The data construction system includes a construction process management unit and a data construction unit. The data construction unit is configured to receive an initiation construction request. The data construction unit obtains corresponding construction rule data from the construction process management unit according to the initiation construction request, and sends an obtaining source data request to the construction process management unit. The construction process management unit receives the obtaining source data request, and calculates a new access location according to a source data identification number and access location information in the obtaining source data request. The construction process management unit obtains corresponding source data according to the new access location, and updates the access location information according to the new access location.Type: ApplicationFiled: August 2, 2023Publication date: November 28, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Patent number: 12148676Abstract: Disclosed is an embedded chip package, comprising at least one chip and a frame surrounding the at least one chip, the chip having a terminal face and a back face separated by a height of the chip, the frame having a height equal to or larger than the height of the chip, wherein the gap between the chip and the frame is fully filled with a photosensitive polymer dielectric, the terminal face of the chip being coplanar with the frame, a first wiring layer being formed on the terminal face of the chip and a second wiring layer being formed on the back face of the chip. Moreover, a method for manufacturing an embedded chip package is disclosed.Type: GrantFiled: November 14, 2023Date of Patent: November 19, 2024Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.Inventors: Xianming Chen, Jindong Feng, Benxia Huang, Lei Feng, Wenshi Wang
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Publication number: 20240378525Abstract: A business execution system and business execution method are provided. The business execution system includes memory and processor. The processor executes a detection module and an execution module in the memory. The detection module periodically creates a first task according to a detection and execution rule in the memory, and obtains an action number of the first task. The action number corresponds to a business indicator. The execution module obtains invocation chain information in the detection and execution rule according to the action number, and executes the first task on an electronic device based on the invocation chain information to generate a first execution result. The detection module determines whether the detection module creates a second task according to the detection and execution rule and the first execution result, so that the execution module executes the second task to generate a second execution result, and configures various service arrangements accordingly.Type: ApplicationFiled: June 15, 2023Publication date: November 14, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Publication number: 20240379504Abstract: A side-exposed embedded trace substrate includes a dielectric layer, a first wiring layer and a first wiring layer embedded in the dielectric layer. An outer surface of the first wiring layer is not higher than a surface of the dielectric layer, and the first wiring layer includes a pad having a groove to increase a side-exposed area of the pad. The contact area between the substrate and the solder during package welding is increased so that the welding reliability is enhanced, the problem of poor welding or poor reliability caused by trace embedding may be avoided, and poor filling of the packaging material due to insufficient gap between the device and the pad during packaging may be prevented.Type: ApplicationFiled: May 6, 2024Publication date: November 14, 2024Inventors: XIANMING CHEN, LEI FENG, LINA JIANG, JUN GAO, BENXIA HUANG, WENJIAN LIN
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Patent number: 12130786Abstract: A structured data analysis system and a method for structured data analysis are provided. The structured data analysis system includes a memory and a processor. The processor obtains input data from an electronic device and converts the same into tree structure data to form nodes. The processor selects a first and a second node among the nodes. The first and the second nodes respectively correspond to a first and a second collection among the collections in the input data. The processor generates missing judgment result by judging whether the first node is missing according to a first amount of the first collection and a second amount of elements included in the second collection. The processor judges that whether the processor generates output data to the server based on original field data according to the missing judgment result to enable the server to operate correctly according to the completed output data.Type: GrantFiled: April 25, 2023Date of Patent: October 29, 2024Assignees: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Jun Zhang, Lei Feng, Guoxin Sun
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Publication number: 20240354174Abstract: A data construction system and a data construction method are provided. The data construction system includes a memory and a processor. The memory stores a data automatic construction component. The processor executes the data automatic construction component to obtain a call request instruction and a data source from a computer device. The data automatic construction component determines input metadata and an API to be called in a business system according to the call request instruction and the data source, and the data automatic construction component reads a server according to the API and the input metadata to obtain a mapping rule and a metadata set. The data automatic construction component uses the data source to construct an input parameter according to the mapping rule and the metadata set, and outputs the input parameter to the API, so that the API responds corresponding business data to the computer device.Type: ApplicationFiled: July 11, 2023Publication date: October 24, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Lei Feng, Guoxin Sun
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Publication number: 20240348688Abstract: A method of configuring a network comprising a plurality of node devices and a method of transmitting a message in such as network are disclosed. Each node device comprises a long range communication interface and a short range communication interface, the method comprises the steps of: commissioning all of the plurality of node devices to form a single flat network sharing same network credentials and communication resources; dividing the plurality of node devices into a plurality of groups; selecting one or more node devices from each group as delegating node devices for delegating messages from other node devices by way of their long range communication interface(s); and activating the long range communication interfaces of the delegating node devices. When a message is received by a node device in such a network, it first determines whether the message is a time-critical message. The message is transmitted immediately if the message is time-critical.Type: ApplicationFiled: July 20, 2022Publication date: October 17, 2024Inventors: LEI FENG, JAYA VALATHUR KARTHIK, CHANGJIE WANG
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Publication number: 20240312879Abstract: A manufacturing method for a metal frame chip embedded packaging substrate includes preparing a metal plate, forming a metal frame surrounding a cavity by penetrating the metal plate, and selectively partially etching a first surface of the metal frame to form a first groove on the metal frame, embedding a chip in the cavity so that a patterned side of the chip faces the first surface, and laminating a dielectric layer on a second surface of the metal frame opposite the first surface, the dielectric layer covering a back side of the chip and filling the first groove, forming a blind hole and a window on the dielectric layer, and forming a first wiring layer on the first surface and a second wiring layer on the second surface, the first wiring layer being connected to a terminal of the chip.Type: ApplicationFiled: March 13, 2024Publication date: September 19, 2024Inventors: XIANMING CHEN, LEI FENG, JINDONG FENG, BENXIA HUANG, JIANGJIANG ZHAO, GAO HUANG, ZHIJUN ZHANG
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Publication number: 20240302870Abstract: This application provides a foldable assembly and an electronic device. The foldable assembly includes a first main swing arm, a first torsion swing arm, a first shaft, and a damping assembly. The first main swing arm is provided with a first sliding groove. The first sliding groove includes a first acceleration segment and a first gentle speed segment connected to each other. An absolute value of a slope of the first acceleration segment is greater than an absolute value of a slope of the first gentle speed segment. The first torsion swing arm includes a first end and a second end. The first shaft passes through the first end and the first sliding groove, and connects the first torsion swing arm and the first main swing arm. The damping assembly is rotatably connected to the second end.Type: ApplicationFiled: December 29, 2022Publication date: September 12, 2024Inventors: Lei Feng, Yameng Wei, Wenxing Yao, Wei Zhang
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Publication number: 20240302868Abstract: This application provides a rotation mechanism, a supporting apparatus, and a foldable screen terminal, and relates to the field of electronic device technologies, so as to balance a lifting stroke of the lifting member and a thickness of the foldable screen terminal in an unfolded state. The rotation mechanism includes a lifting member, a shaft cover, a first swing arm, a second swing arm, a forcing structure, and a first supporting member. The lifting member includes a lamination surface. The shaft cover is located on a side that is of the lifting member and that is away from the lamination surface. The first swing arm and the second swing arm are respectively located on two opposite sides of the lifting member, and the first swing arm and the second swing arm can swing between an unfolded position and a folded position relative to the shaft cover.Type: ApplicationFiled: September 2, 2022Publication date: September 12, 2024Inventors: Lei FENG, Yameng WEI, Haifei LI, Yangjie TANG, Yuan WANG