Abstract: The invention relates to the technical field of bamboo products machining, in particular to a bamboo straw machining method, comprising: connecting two or more bamboo pieces to form a bamboo strip, continuously winding the bamboo strip according to a preset helical angle to form a cylinder, and cutting the cylinder according to a preset interval to form straws. Compared with traditional methods, the method has the following advantages: bamboo pieces are continuously connected to obtain a bamboo strip for continuous production, then the continuous bamboo strip is continuously wound to obtain a cylinder which is good in mechanical property, stable in structure and uniform in appearance, and finally, the cylinder is cut at equal intervals to continuously produce bamboo straws that are highly consistent in specification and performance; and the working efficiency is improved by over 20% on the whole. Labor and equipment costs are greatly reduced.

Abstract: Embodiments of this application provide a foldable electronic device, including: a shaft cap, a body, a first cam component, and a second cam component. The first cam component and the second cam component come into pressure contact. The first cam component is configured to be rotatable around a central shaft of the first cam component. The second cam component is configured to be slidable along a direction of the central shaft. A contact surface of the first cam component and the second cam component includes a locking section, an angle between a normal direction of the locking section and the central shaft is less than or equal to a preset value, and a resultant force of a cam driving member in a rotation direction of the cam driving member is o, so that the body is not automatically unfolded or folded, thereby implementing the freestop characteristic.

Abstract: Disclosed are a heat dissipation-electromagnetic shielding embedded packaging structure, a manufacturing method thereof, and a substrate. The heat dissipation-electromagnetic shielding embedded packaging structure includes: a dielectric layer including an upper surface and a lower surface, wherein at least one hollow cavity unit is disposed inside the dielectric layer; an insulating layer disposed in the hollow cavity unit, wherein the hollow cavity unit is partially filled with the insulating layer; an electronic element, wherein one end is embedded in the insulating layer, the other end is exposed in the hollow cavity unit, and the electronic element includes terminals; a through hole penetrating through the upper surface and the lower surface of the dielectric layer and communicating with the terminals; and a metal layer covering the six surfaces of the dielectric layer and the interior of the through hole to form a shielding layer and circuit layer respectively.

Abstract: A structured data analysis system and a method for structured data analysis are provided. The structured data analysis system includes a memory and a processor. The processor obtains input data from an electronic device and converts the same into tree structure data to form nodes. The processor selects a first and a second node among the nodes. The first and the second nodes respectively correspond to a first and a second collection among the collections in the input data. The processor generates missing judgment result by judging whether the first node is missing according to a first amount of the first collection and a second amount of elements included in the second collection. The processor judges that whether the processor generates output data to the server based on original field data according to the missing judgment result to enable the server to operate correctly according to the completed output data.

Abstract: Disclosed is a branched polymer resin comprising repeating units of —(—OCH2-CO—)— or —(—CO—CH2O—)—, which is produced by ring-opening polymerization in the presence of structure regulators and optionally end-capping agents. The branched polymer resin exhibits a lower melt viscosity and a higher heat-stable temperature and suitable for melt processing.

Abstract: A hinge assembly is provided. The first swing arm includes a first hinge connecting part and a first rotating part. The first swing arm is rotatable relative to the base around a first axis between the first hinge connecting part and the first rotating part. The second swing arm includes a second hinge connecting part and a second rotating part. The second swing arm is rotatable relative to the base around a second axis between the second hinge connecting part and the second rotating part. The second axis is parallel to the first axis. The slider includes a first fastening part, a second fastening part, and an extension part. The extension part is located in the guide groove. The first fastening part is movably connected to the first hinge connecting part. The second fastening part is movably connected to the second hinge connecting part.

Abstract: This application provides a hinge assembly and a foldable electronic device. The hinge assembly includes a pivot mechanism and an elastic mechanism disposed on the pivot mechanism. One of the elastic mechanism and a rotation mechanism is fixed to the pivot mechanism, and the other of the elastic mechanism and the rotation mechanism is rotatably connected to the pivot mechanism. One of the elastic mechanism and the rotation mechanism is provided with a plurality of protrusions, and the other of the elastic mechanism and the rotation mechanism is provided with a plurality of grooves that match the plurality of protrusions. When the rotation mechanism rotates to a preset location, at least one of the plurality of protrusions is received by at least one of the plurality of grooves, and remaining protrusions in the plurality of protrusions are interposed between the elastic mechanism and the rotation mechanism.

Abstract: A data processing system and a method of automatically initiating a process. The data processing system includes a local server and a cloud server. The cloud server includes a storage apparatus and a processor. The processor is coupled to the storage apparatus, and configured to executed a file identification-parsing device and a detection system. The local server outputs a file to the cloud server, such that the file identification-parsing device performs an identification-parsing operation to generate a file content. The cloud server stores the file content in a database. The detection system performs a detection operation on the database to generate a file change content. The detection system generates business process information according to the file change content, and outputs the business process information to a process system. The process system executes the business process information, and displays manual operation information and an execution result on a display screen.

Abstract: This application relates to a method for presenting roading conditions. The method includes presenting an initial navigation screen, and displaying a target navigation route on the initial navigation screen; and presenting a target navigation screen in response to a navigation trigger event, and displaying a gradual transitioning road surface corresponding to a current road section in the target navigation route, the gradual transitioning road surface indicating the current road section changing from a first road condition to a second road condition, the gradual transitioning road surface comprising a first road condition texture corresponding to the first road condition, a second road condition texture corresponding to the second road condition, and a gradual transitioning road texture gradually transitioning from the first road condition texture to the second road condition texture, and a road condition transition range corresponding to the gradual transitioning road texture.

Abstract: A support apparatus and a foldable electronic device are provided. The support apparatus includes a hinge assembly, a first housing, a second housing, and a first flexible sealing member. The hinge assembly includes a rotating shaft mechanism and a shaft cover, where the rotating shaft mechanism is fastened to the shaft cover. The first housing and the second housing are respectively located on two opposite sides of the hinge assembly, the first housing and the second housing are configured to rotate relative to the shaft cover through the rotating shaft mechanism, the first housing, the second housing, and the rotating shaft mechanism each have a support surface for supporting a foldable screen, and a first movement gap is present between the first housing and an outer surface of the shaft cover. The first flexible sealing member fits into and seals the first movement gap.

Abstract: In a method of manufacturing a connector, a first copper pillar layer and a sacrificial copper pillar layer are formed on a temporary bearing plate coated with copper, an etch stop layer is applied on the sacrificial copper pillar layer and electroplated to form a second copper pillar layer, insulating materials is laminated to form a first dielectric layer, a first circuit layer is formed on the first dielectric layer, a second copper pillar layer and a sacrificial copper pillar layer are extended on the first circuit layer, and a sacrificial copper layer is formed on the first circuit layer, insulating material is laminated on the first circuit layer to form a second dielectric layer, the temporary bearing plate is removed, a second and third circuit layers are simultaneously formed on the first and second dielectric layers, and the sacrificial copper layer and the sacrificial copper pillar layer are etched.

Abstract: A method for manufacturing an embedded package structure having an air resonant cavity according to an embodiment includes manufacturing a first substrate including a first insulating layer, a chip embedded in the insulating layer, and a wiring layer on a terminal face of the chip of the first substrate, wherein the wiring layer is provided thereon with an opening revealing the terminal face of the chip; manufacturing a second substrate which comprises a second insulating layer; locally applying a first adhesive layer on the wiring layer such that the opening revealing the terminal face of the chip is not covered; and applying a second adhesive layer on the second substrate; and attaching and curing the first adhesive layer of the first substrate and the second adhesive layer of the second substrate to obtain an embedded package structure having an air resonant cavity on the terminal face of the chip.

Abstract: This application provides a damping mechanism. An elastic member, where the elastic member includes a first pin and a second pin; a first fixing member, where the first fixing member is rotatably connected to the second pin in a first direction; and a first swinging member, where the first swinging member includes a first fixing portion and a first moving portion connected to the first fixing portion, and the first fixing portion is rotatably connected to the first fixing member in the first direction; the first moving portion is rotatably connected to the first pin in the first direction; and when rotation is performed between the first fixing member and the first swinging member, an elastic force generated by the elastic member acts on a center of rotation in which the first moving portion is rotatably connected to the first pin, forming an unfolding force or a closing force.

Abstract: The present application relates to a polymer and a composition thereof, and specifically provides a thermosensitive polymer represented by formula (I-2) and a preparation method therefor, and a pharmaceutical composition containing same, the polymer having a star-shaped multi-arm structure, and comprising an aromatic core and a biodegradable AB-type amphiphilic copolymer. The polymer can enhance the solubility and stability of a drug or a bioactive agent and control the release of the drug or the bioactive agent. The definition of each group in formula (I-2) is the same as in the description.

Abstract: A display panel and a drive method therefor, where when a gate electrode drive circuit (100) scans pixels line-by-line, a drive chip (300) controls a clock signal end to input a clock control signal (CK) into the gate electrode drive circuit (100), which causes a gate electrode scan signal (G(n)) to be output by the gate electrode drive circuit (100), and a data signal (Vd) output by a data signal end is controlled to be written to a corresponding row of pixel circuits (200). Where an active level period of the clock control signal (CK) falls within an active level period of the data signal (Vd), and a start time for the active level period of the data signal (Vd) is at least 1-2 ?s earlier than a start time for the active level period of the clock control signal (CK).

Abstract: This application provides a rotating mechanism, a support apparatus, and a terminal with a foldable screen. A problem that a rotating part with a large volume affects lightening and thinning of an existing terminal with a foldable screen is resolved. A transmission assembly is in a transmission connection to a first swing arm and a second swing arm, so that the first swing arm and the second swing arm rotate between a folded position and an unfolded position. When the first swing arm and the second swing arm rotate from the folded position to the unfolded position, a connection plate moves in a direction away from the shaft cover, and when the first swing arm and the second swing arm rotate from the unfolded position to the folded position, the connection plate moves in a direction close to the shaft cover.

Abstract: A business data processing system including a storage device and a processor and a method for automatically capturing data are provided. The storage device is used to store a timing module and a data detection module. The processor is coupled to the storage device and is used to execute the timing module and the data detection module. The timing module outputs a detection command to the data detection module at a preset time, so that the data detection module executes a detection operation. The data detection module calculates a time window according to a previous detection operation, captures detection data from a database in the time window, judges whether the detection data has deduplicated data according to the detection data and recorded data, initiates the deduplicated data to an external business process system, obtains corresponding data initiation information from the external business process system, and updates the recorded data.

Abstract: A method (50) of and an arrangement for communicating, by a server, with a target node device in a network of operatively interconnected node devices, wherein each node device of the network comprises a first communication interface for direct wireless communication with the server, and a second communication interface for inter-node device communication. The server determines (51) a current communication status of a target node device based on a last received uplink message of the target node device, prior to initiating message exchange with the target node device. The server then may communicate directly (52) with the target node device via the first communication interface, or via at least one other or delegate node device of the network selected by the server (53).

Abstract: A circuit prearranged heat dissipation embedded packaging structure according to an embodiment of the present disclosure includes at least one chip and a support frame surrounding the at least one chip. The support frame may include a via pillar passing through the support frame in the height direction, a first wiring layer on a first surface of the support frame, and a heat dissipation layer on the back face of the chip. The first wiring layer is flush with or higher than the first surface, the first wiring layer is in conductive connection with the heat dissipation layer, a gap between the chip and the frame is completely filled with the dielectric material, a second wiring layer is formed on a terminal face of the chip, and the second wiring layer is in conductive connection with the first wiring layer through the via pillar.

Abstract: A display substrate includes a plurality of pixel units arranged to form a plurality of pixel columns extending along a first direction, the display substrate further includes a plurality of groups of power source signal lines and pixel driving circuits located on the substrate, each group of power source signal lines includes a plurality of secondary signal lines, the pixel driving circuits of the pixel units in each pixel column are connected to different secondary signal lines in a same group of power source signal lines, each secondary signal line extends along the first direction from a starting end of the power source signal lines, extension lengths of the secondary signal lines in the same group of power source signal lines are different, and resistance values per unit length of different secondary signal lines along the first direction decrease as total lengths of the secondary signal lines increase.