Patents by Inventor Leonard Hayden

Leonard Hayden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060267610
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Application
    Filed: June 9, 2006
    Publication date: November 30, 2006
    Inventors: Ron Peters, Leonard Hayden, Jeffrey Hawkins, R. Dougherty
  • Publication number: 20060214677
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 28, 2006
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Patent number: 7075320
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: July 11, 2006
    Assignee: Cascade Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Patent number: 7046023
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: May 16, 2006
    Assignee: Cascade Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Publication number: 20050151548
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: March 9, 2005
    Publication date: July 14, 2005
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Publication number: 20050062489
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Application
    Filed: November 3, 2004
    Publication date: March 24, 2005
    Inventors: Ron Peters, Leonard Hayden, Jeffrey Hawkins, R. Dougherty
  • Publication number: 20050024069
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: August 26, 2004
    Publication date: February 3, 2005
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Patent number: 6842024
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: January 11, 2005
    Assignee: Cascade Microtech, Inc.
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
  • Publication number: 20040232927
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 25, 2004
    Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
  • Patent number: 6815963
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: November 9, 2004
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
  • Patent number: 6806724
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: October 19, 2004
    Assignee: Cascaded Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Publication number: 20040095156
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: November 12, 2003
    Publication date: May 20, 2004
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Publication number: 20040090238
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Patent number: 6724205
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: April 20, 2004
    Assignee: Cascade Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Publication number: 20040027144
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Application
    Filed: July 8, 2003
    Publication date: February 12, 2004
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
  • Publication number: 20040004491
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: May 23, 2003
    Publication date: January 8, 2004
    Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
  • Patent number: 6639415
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: October 28, 2003
    Assignee: Cascade Microtech, Inc.
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
  • Publication number: 20030184404
    Abstract: A probe assembly including a probe, a waveguide to transmission path transition, and a bias tee detachably connected to the probe.
    Type: Application
    Filed: October 29, 2002
    Publication date: October 2, 2003
    Inventors: Mike Andrews, Leonard Hayden, John Martin
  • Publication number: 20030038622
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Application
    Filed: October 17, 2002
    Publication date: February 27, 2003
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
  • Patent number: 6489789
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: December 3, 2002
    Assignee: Cascade Microtech, Inc.
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty