Abstract: A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The light emitting diodes are disposed on the circuit structure and electrically connected to the circuit structure. The encapsulation layer covers top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.

Abstract: Provided are forward osmosis processes to increase the concentration of a dilute metal salt solution, e.g., a vanadium electrolyte solution. In embodiments, such a process comprises: (a) delivering a draw solution to a draw chamber of a forward osmosis module, the draw solution comprising water and sulfuric acid at a draw acid concentration, wherein the draw solution is free of vanadium cations; and (b) delivering a feed solution to a feed chamber of the forward osmosis module, the draw and feed chambers separated by a membrane, the feed solution comprising water, vanadium cations, and sulfuric acid at a feed acid concentration that is lower than the draw acid concentration, wherein water passes across the membrane from the feed solution to the draw solution, thereby providing a concentrated vanadium electrolyte solution as a feed chamber output and a diluted acid solution as a draw chamber output.

Abstract: A semiconductor structure includes a first metal-dielectric-metal layer, a first dielectric layer, a first conductive layer, a second conductive layer, and a second dielectric layer. The first metal-dielectric-metal layer includes a plurality of first fingers, a plurality of second fingers, and a first dielectric material. The first fingers are electrically connected to a first voltage. The second fingers are electrically connected to a second voltage different from the first voltage, and the first fingers and the second fingers are arranged in parallel and staggeredly. The first dielectric material is between the first fingers and the second fingers. The first dielectric layer is over the first metal-dielectric-metal layer. The first conductive layer is over the first dielectric layer. The second conductive layer is over the first conductive layer. The second dielectric layer is between the first conductive layer and the second conductive layer.

Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.

Abstract: Provided in the present application are a power battery top cover and a power battery. The power battery top cover is used for being connected to a housing in which a cell is mounted. The power battery top cover mainly comprises a cover plate, upper plastic, a sealing ring and a pole. The cover plate is provided with a first through hole and a first groove, and the upper plastic is provided with a second through hole; the upper plastic is embedded in the first groove, and a lower surface thereof and the first groove form a ventilation portion; part of the sealing ring is embedded in the first through hole; and the pole passes through the first through hole and the second through hole and is in interference fit connection with the sealing ring and the upper plastic.

Abstract: A multi-layer stacked semiconductor device includes a first integrated circuit device and a bonding insulator layer formed upon the first integrated circuit device. The bonding insulator layer includes an insulating material layer and an etch stop layer. The semiconductor device also includes a second integrated circuit device formed over the first integrated circuit device in a stacked configuration. The semiconductor device also includes a bonding insulator layer formed between the second integrated circuit device and the insulating material layer. The insulating material layer and the bonding insulator layer are bonded adjacent to one another.

Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: The present disclosure provides a task-independent brainprint recognition method based on feature disentanglement by decorrelation. Existing methods fail to mine inherent identity information of a brain, leading to poor robustness of brainprint recognition in a scenario across tasks and difficulty of promotion thereof in practical use. The present disclosure firstly uses two branch networks to perform coarse-grained decomposition of identity information and task related information in an electroencephalogram (EEG). Secondly, in consideration of an influence of a task state on the identity information, a decorrelating method is employed such that the identity information and the task related information are independent as much as possible. Finally, a brainprint feature in the EEG is fully utilized for classification by adversarial self-supervision.

Abstract: The energy storage power device comprises an energy storage power supply and charging apparatuses; the energy storage power supply comprises a power supply body and an output portion, the output portion being in circuit connection to the power supply body to output electrical energy stored in the power supply body to the outside; the charging apparatuses are detachably connected to the output portion so as to be charged by the energy storage power supply; the charging apparatuses are used to be connected to an electrical device to supply power to the electrical device; at least one of the charging apparatuses is replaced, after being depleted of power, with at least another of the charging apparatuses from the energy storage power supply so as to supply power to the electrical device, such that power is continuously supplied to the electrical device by the charging apparatus.

Abstract: A data processing method for acoustic event includes: establishing a simulated acoustic frequency event module, a data capturing module, and a sound application decision module in a software manner, setting a simulated hardware parameter to the simulated acoustic frequency event module, inputting a sound signal to a frequency filtering module of the simulated acoustic frequency event module, and obtaining metadata from a frequency event quantizer of the simulated acoustic frequency event module, dividing each of the metadata into multiple frames according to a time interval by the data capturing module, accumulating an event number of each frame by the data capturing module, setting a label of each frame according to the event number, storing these frames, the event number and the label in a database, and training a decision model by the sound application decision module according to the database and a sound application.

Abstract: The present application relates to the technical field of power batteries, and specifically discloses a power battery cover and a power battery. The power battery cover includes a copper-aluminum composite terminal, a top cover, a seal, an upper plastic insulator and a lower plastic insulator. The copper-aluminum composite terminal is disposed to pass through the top cover, the upper plastic insulator and the lower plastic insulator. The copper-aluminum composite terminal includes a copper base body part and an aluminum base body part connected to each other, and a composite connection surface is formed between the aluminum base body part and the copper base body part, and sealed and wrapped by the seal.

Abstract: An ammonia fuel cell system capable of rapid adsorption-and-desorption switching by ammonia self-evaporation includes an ammonia decomposition reactor; an ammonia tank; a first heat exchanger; a fuel tank; a first blower; a second heat exchanger; an adsorption column device; a fuel cell; a gas circulation system; and an exhaust gas combustion system, wherein an outlet of the ammonia tank connects with an ammonia gas inlet of the ammonia decomposition reactor, wherein a decomposition gas outlet of the ammonia decomposition reactor, through the first heat exchanger, connects with an adsorption inlet of the adsorption column device, wherein a product produced by decomposition of ammonia gas in the ammonia decomposition reactor preheats a raw ammonia gas via the first heat exchanger, wherein the fuel tank connects with the ammonia decomposition reactor for feeding a fuel gas to the ammonia decomposition reactor.

Abstract: The present application provides a thin film transistor substrate and an electronic device. The thin film transistor substrate includes: a substrate; a boss including an undercut structure, the undercut structure is located on a side wall of the boss; a filler located in the undercut structure; and an active layer located on the boss and the substrate, the active layer includes a channel, and the channel covers the undercut structure and the filler.

Abstract: A semiconductor device includes a first transistor comprising a first gate region, and a second transistor comprising a second gate region. The second transistor is stacked on the first transistor in a staggered configuration. A dielectric bonding layer is between the first transistor and the second transistor, and a gate cut portion is along a side of the first gate region and a side of the second gate region. A gate contact is connected to at least one of the first gate region and the second gate region.

Abstract: Present disclosure provides a method including: forming a semiconductor stack having at least one SiGe layer; forming a plurality of fins from the semiconductor stack by a first etching operation, each of the plurality of fins comprising a first portion and a second portion over the first portion, the first portion being separated from the second portion by a SiGe portion; forming a poly gate stripe orthogonally over the plurality of fins; forming a recess on each of the plurality of fins abutting the poly gate; recessing the SiGe portion by a second etching operation through the recess; forming a first spacer and a second spacer to surround the SiGe portion; and removing the SiGe portion.

Abstract: A main object of the present disclosure is to provide an all solid state battery in which the reversibility of the deposition and dissolution reaction of a metal Li can be improved while inhibiting an occurrence of short circuit. The above object is achieved by providing an all solid state battery utilizing a deposition and dissolution reaction of a metal Li as an anode reaction, the all solid state battery comprising: an anode current collector, a porous layer comprising a resin, a solid electrolyte layer, a cathode active material layer, and a cathode current collector, in this order; wherein an electric resistance of the porous layer is 1 ? or more and 690 ? or less; and a thickness of the porous layer is 14 ?m or less.

Abstract: A motor controller having a pulse width modulation generating mechanism is provided. A triangular wave signal generator circuit generates a triangular wave signal. A comparator compares the triangular wave signal with an input control signal to determine a pulse width modulation signal. A signal detector circuit detects a duty cycle of each of a plurality of pulse waves of the pulse width modulation signal. A control converter circuit converts the duty cycle of each of the plurality of pulse waves of the pulse width modulation signal as an arithmetic value into a control value, according to a preset ratio. A driver circuit drives a motor to rotate according to the control value from the control converter circuit.

Abstract: An electrical connector including at least one locking member movably engageable with at least one locking feature provided on a second electrical connector, at least one latch rotatably movable between a locked position for preventing movement of the at least one locking member and an unlocked position for allowing movement of the at least one locking member and a sensor for sensing a voltage level on the electrical connector, wherein when the voltage level is sensed to be above a defined level, the at least one latch is moved to the locked position and when the voltage level is sensed to be below the defined level the at least one latch is moved to the unlocked position.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a receiving device may receive an indication of at least one factor associated with an antenna array thinning operation at a transmitting device. Accordingly, the receiving device may adjust at least one reception parameter at the receiving device based at least in part on the at least one factor. Similarly, a transmitting device may transmit an indication of at least one factor associated with antenna array thinning operation. Accordingly, the transmitting device may perform the antenna array thinning operation based at least in part on the at least one factor. Numerous other aspects are described.

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.