Abstract: A distance measuring device is provided. The distance measuring device includes: a distance sensing unit, for sensing a distance value of a target object; a drive unit, for driving the distance sensing unit to rotate according to a rotation angle; and a compensation unit, for providing a compensation value according to the rotation angle and obtaining an actual distance according to the compensation value and the distance value.

Abstract: A computer implemented method, apparatus, and computer program product for identifying an interval for performing a maintenance task. The process retrieves scheduled maintenance data and un-scheduled in-service maintenance data for a given apparatus type. The process maps the un-scheduled in-service maintenance data to the scheduled maintenance data for the given apparatus type to form mapped maintenance data. The process performs a statistical analysis on the mapped maintenance data. The process identifies an optimal interval for performing the maintenance task based on a result of the statistical analysis to form a recommended maintenance interval.

Abstract: A system and method for RFID privacy-preserving authentication is disclosed. The method first has a reader sending a request and a first random number to a tag. The tag then generates a second random number. A plurality of hash values are then computed at the tag. Each hash value uses the first random number, the second random number and at least one part of a key of the tag as inputs. The second random number and the computed hash values are then sent to the reader. Lastly, the reader identifies a validity of the tag from the received values. The hash values are all generated in parallel and are independent to each other.

Abstract: The present invention discloses a touch detected voice-prompted 2-stage keypad. The keypad has a touching detector switch (first stage) and a contact switch (second stage). The touching signal of a finger is identified by the detector and then input to the microprocessor, a number or a function (voice) represent this keypad is output to a speaker, the user confirms that this keypad is the required one, thus press the contact switch to output a signal to the microprocessor to execute the function of this key. The touch detected voice-prompted 2-stage key may form an array of numbers and/or functions, and control by touching instead of viewing. It is convenient in the night, for a blind or weak sighted people.

Abstract: Handwritten shorthand is used and interpreted in a stylus-based interface to trigger expanded text, implement functions, and/or launch executable programs. A user may be able to select a type of shorthand entry to define, such as a text-expansion-type shorthand entry, a function-type shorthand entry, or a program-type shorthand entry. Upon receiving handwritten input, a computer may determine whether or not to interpret the handwritten input as shorthand, or whether to act upon the handwritten shorthand, depending upon the context in which it is written.

Abstract: A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area of the second substrate is larger than that of the semiconductor device. The first wires electrically connect the first and second substrates. The supporting element is disposed between the first and second substrates, and supports the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during wire bonding, and the area of the second substrate can be increased to have more devices thereon. Also, the thickness of the second substrate can be reduced, to reduce the overall thickness of the stackable semiconductor package.

Abstract: A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is exposed. The top package is inverted, and is adhered to the chip of the bottom package with the adhesive layer. The wires electrically connect a substrate of the bottom package and a substrate of the top package. The molding compound encapsulates the top package, the bottom package, the adhesive layer,and the wires, and exposes a part of a surface of the substrate of the top package. Thus, the stackable semiconductor package includes at least two chips, thereby increasing the chip density and improving the applicability.

Abstract: A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate includes an active region and several bonding pads. The bonding pads are located outside the active region. The bonding wires connect the bonding pads and the contacts. The flash-resisting ring disposed on the chip is located between the bonding pads and the active region. The flash-resisting ring surrounding the active region includes at least one buffer groove. The buffer groove surrounds the active region. The molding compound disposed on the package substrate and the chip encapsulates at least the bonding pads, the contacts and the bonding wires. The molding compound exposes the active region.

Abstract: A micro-sensing element includes a substrate, a micro-sensing structure and a covering material. The micro-sensing structure has a plurality of conductive channels disposed on the substrate. Each conductive channel includes a sensing part, a conductive wire and an electrode. The sensing part is electrically connected with the electrode through the conductive wire. The covering material covers the substrate and the conductive wires, and each of the sensing parts and each of the electrodes are exposed out of the covering material. A bio-sensing system and a manufacturing method of the micro-sensing element are also disclosed.

Abstract: A decorative sticker includes: a sheet member having opposite first and second surfaces, the first surface having first and second printed regions; an adhesive layer disposed on the second surface of the sheet member and overlapping the first and second printed regions; a non-sticky coating attached to the adhesive layer and overlapping the second printed region so as to expose a portion of said adhesive layer that corresponds to said first printed region of said sheet member; and a releasable sheet attached to the portion of the adhesive layer and the non-sticky coating.

Abstract: A chip package and a package process thereof are provided. The chip package comprises a package substrate, a chip, a plurality of spacers, an adhesive layer, and a plurality of wires. The package substrate has a carrying surface. The chip is disposed on the carrying surface. The spacers are formed between the chip and the carrying surface to maintain an interval between the chip and the package substrate. The adhesive layer is disposed between the chip and carrying surface to encapsulate the spacers. The chip is electrically connected to the package substrate via the wires.

Abstract: A Voice over Internet Protocol (VOIP) system cooperates with a phone and an access point storing default connecting information. The VOIP system includes a transmitting module, a receiving module, a decoding module and a comparing module. The transmitting module is disposed in the phone and transmits numeral information. The receiving module is disposed in the access point and receives the numeral information. The decoding module is disposed in the access point and is electrically connected with the receiving module for converting the numeral information into character information. The comparing module is disposed in the access point and is electrically connected with the decoding module for comparing the character information and the default connecting information so as to determine whether the access point proceeds to connect with the phone or not.

Abstract: The present invention relates to a stackable semiconductor package, comprising a first substrate, a chip, a second substrate, a plurality of second wires, a plurality of supporting elements and a molding compound. The chip is disposed on and electrically connected to the first substrate. The second substrate is disposed above the chip, and the area of the second substrate is larger than that of the chip. The second substrate is electrically connected to the first substrate by the second wires. The supporting elements are disposed between the first substrate and the second substrate, and are used for supporting the second substrate. The molding compound encapsulates the first surface of the first substrate, the chip, the second wires, the supporting elements and part of the second substrate, and exposes a surface of the second substrate. The overhang portion of the second substrate will not shake or sway during wire bonding process.

Abstract: The present invention relates to a stackable semiconductor package, comprising a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is exposed. The top package is inverted, and is adhered to the chip of the bottom package with the adhesive layer. The wires electrically connect a substrate of the bottom package and a substrate of the top package. The molding compound encapsulates the top package, the bottom package, the adhesive layer, and the wires, and exposes a part of a surface of the substrate of the top package. Thus, the stackable semiconductor package includes at least two chips, thereby increasing the chip density and improving the applicability.

Abstract: The present invention relates to a stackable semiconductor package including a first substrate, a chip, a low modules film, a second substrate, a plurality of first wires, and a first molding compound. The chip is disposed on the first substrate. The low modules film is disposed on the chip. The second substrate is disposed on the low modules film. The area of the low modules film is adjusted according to the area of the second substrate, so as to support the second substrate. The first wires electrically connect the first substrate and the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during a wire bonding process, and the area of the second substrate can be increased to receive more devices disposed thereon. In addition, the thickness of the second substrate can be reduced, so as to reduce the overall thickness of the stackable semiconductor package.

Abstract: The present invention relates to a stackable semiconductor package comprising a first substrate, a semiconductor device, a second substrate, a plurality of first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area of the second substrate is larger than that of the semiconductor device. The first wires electrically connect the first substrate and the second substrate. The supporting element is disposed between the first substrate and the second substrate, and is used to support the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during a wire bonding process, and the area of the second substrate can be increased to receive more devices disposed thereon.

Abstract: The present invention relates to a stackable semiconductor package, comprising a first substrate, a chip, a second substrate, a plurality of second wires, a plurality of supporting elements and a molding compound. The chip is disposed on and electrically connected to the first substrate. The second substrate is disposed above the chip, and the area of the second substrate is larger than that of the chip. The second substrate is electrically connected to the first substrate by the second wires. The supporting elements are disposed between the first substrate and the second substrate, and are used for supporting the second substrate. The molding compound encapsulates the first surface of the first substrate, the chip, the second wires, the supporting elements and part of the second substrate, and exposes a surface of the second substrate. The overhang portion of the second substrate will not shake or sway during wire bonding process.

Abstract: A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate includes an active region and several bonding pads. The bonding pads are located outside the active region. The bonding wires connect the bonding pads and the contacts. The flash-resisting ring disposed on the chip is located between the bonding pads and the active region. The flash-resisting ring surrounding the active region includes at least one buffer groove. The buffer groove surrounds the active region. The molding compound disposed on the package substrate and the chip encapsulates at least the bonding pads, the contacts and the bonding wires. The molding compound exposes the active region.

Abstract: A chip package structure including a chip, a carrier, a plurality of bonding wires and a molding compound is provided. The chip has an active surface, a back surface opposite to the active surface, a plurality of side surfaces, and a plurality of flash-preventing surfaces located between the active surface and the side surfaces. The carrier is connected to the back surface of the chip to carry the chip. The chip is electrically connected to the carrier via the bonding wires. The molding compound is disposed on the carrier and encapsulates the bonding wires, a portion of the active surface, the side surfaces, and at least a portion of the flash-preventing surfaces. The flash-preventing surfaces prevent excess molding compound from contaminating the active surface of the chip.

Abstract: A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is disposed on the active surface. The metal dam bar separates the sensing region and the bonding pad to prevent contamination of the sensing region by the mold flash. Preferably, a step is formed on the periphery of the active surface of the semiconductor chip, such that the semiconductor chip includes a T-shaped profile. Additionally, the metal dam bar is extended to the step to form an enclosed ring thereby effectively defining an exposed molding region that contains the sensing region.