Abstract: A method for forming a semiconductor structure includes providing a semiconductor substrate, forming a gate stack on the semiconductor substrate, and epitaxially growing a lightly-doped source/drain (LDD) region adjacent the gate stack, wherein carbon is simultaneously doped into the LDD region.

Abstract: A method for forming a semiconductor device is provided. The method includes providing a semiconductor substrate; forming a gate dielectric over the semiconductor substrate; forming a gate electrode on the gate dielectric; forming a stressor in the semiconductor substrate adjacent to an edge of the gate electrode; and tilt implanting an impurity after the step of forming the stressor. The impurity is preferably selected from the group consisting essentially of group IV elements, inert elements, and combinations thereof.

Abstract: A semiconductor device includes a gate stack over a semiconductor substrate, a lightly doped n-type source/drain (LDD) region in the semiconductor substrate and adjacent the gate stack wherein the LDD region comprises an n-type impurity, a heavily doped n-type source/drain (N+ S/D) region in the semiconductor substrate and adjacent the gate stack wherein the N+ S/D region comprises an n-type impurity, a pre-amorphized implantation (PAI) region in the semiconductor substrate wherein the PAI region comprises an end of range (EOR) region, and an interstitial blocker region in the semiconductor substrate wherein the interstitial blocker region has a depth greater than a depth of the LDD region but less than a depth of the EOR region.

Abstract: A method for treating waste gas containing inorganic acid is disclosed. The method includes the following steps: (a) forming a mixture of inorganic acidic gas and a nebulized alkaline solution wherein the nebulized alkaline solution can be produced continuously or periodically; (b) forcing the mixture to pass through an adsorbent bed; and (c) releasing the treated gas. An apparatus for treating the inorganic acid gas with the method illustrated above is also disclosed here. The method can regenerate poisoned adsorbents online, and save time, space and cost simultaneously.