Abstract: A method of forming a semiconductor device having a capacitor array includes forming a top electrode plate of the capacitor array in an active region and a periphery region of a substrate; depositing a first oxide layer above the top electrode plate in the active region and the periphery region; removing the top electrode plate in the periphery region; forming a nitride film on the first oxide layer in the active region and in the periphery region; depositing a second oxide layer on the nitride film in the active region and the periphery region; and polishing the second oxide layer to expose the nitride film in the active region.

Abstract: Devices and systems for droplet generation and methods for generating droplets are described. In an embodiment, the devices and systems include a capillary configured to eject a droplet, such as in response to a voltage applied to an end of the capillary. In an embodiment, the devices and systems include a moveable stage configured to carry a multi-well plate and move the stage relative to the capillary such that the ejected droplet is selectively received by a well of the multi-well plate carried by the moveable stage.

Abstract: Provided is a wide angle application high reflective mirror having a reflection band partially overlapping in a wavelength range of 800-4000 nm. The mirror comprises a film system in which a plurality of high refractive index film layers and a plurality of low refractive index film layers that are alternately stacked, and the material of the high refractive index film layer is one of SiH, SiOxHy, or SiOxNy, or a mixture thereof. The highly reflective mirror can achieve a reflectance greater than 99% with an incident angle ranging from 0 to 60 degrees over a large angle range.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.

Abstract: An auxiliary support device for a rolling-cut shear, including: a lower cutting table; a plurality of first hydraulic support cylinders, a plurality of support plates, a plurality of second hydraulic support cylinders shorter than the first hydraulic support cylinders, a slide plate, and a plurality of horizontal hydraulic cylinders. The lower cutting table includes a first front end including a first mounting groove, and a second mounting groove, and an inner plate. The bottom wall of the second mounting groove includes a plurality of first bolt holes and a plurality of first recesses. The inner plate is embedded in the second mounting groove through a plurality of bolts passing through the plurality of first bolt holes. The inner plate includes a plurality of second bolt holes and a plurality of second recesses. The plurality of support plates lean against the inner plate.

Abstract: A power device threshold voltage measurement circuit and its operation method thereof are provided. The measurement circuit includes a switch component, a device under test, a common source capacitor and a decoupling capacitor. The switch component and the device under test forms a half bridge circuit and the common source capacitor is in series connected at the source of the device under test. The device under test is connected as a lower switch of the half bridge circuit and the decoupling capacitor is connected between the device under test and the common source capacitor. By applying an OFF-state stress mode and a measurement mode successively afterwards, a threshold voltage of the device under test is obtained. And the present invention is beneficial to achieving in shorter pulse width, faster measuring speed and inexpensive measuring equipment, and can thus be widely applied to group III-N based power devices.

Abstract: Disclosed are a bonding system and a bonding method. In one embodiment, the bonding system includes a chamber, first and second electrostatic chucks, a visible light sensor module and a nonvisible light module. The chamber is configured to provide a vacuum state. The first electrostatic chuck is configured to hold a first substrate having a first alignment mark in the chamber, wherein the first electrostatic chuck has a first window. The second electrostatic chuck is configured to hold a second substrate having a second alignment mark in the chamber, wherein the second electrostatic chuck has a second window. The visible light sensor module is configured to capture images of the first and the second alignment marks. The nonvisible light module is configured to capture a combined image of the first and second alignment marks via the first and second windows overlapping each other in the vacuum state.

Abstract: The present disclosure provides a method and a system for image generation. The method may include: obtaining an initial image, the initial image being an image generated by a generator and including a specified target; determining, in the initial image, a partial image of the specified target; generating a fusion image including the specified target by performing an image fusion based on a background image and the partial image of the specified target; and generating a target sample image based on the fusion image.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: The application discloses a device and method for beamforming. The beamforming method comprises: sending a null data packet announcement (NDPA) frame from a beamformer to a pseudo user and a target user to indicate the target user to prepare for channel estimation; sending a null data packet (NDP) from the beamformer to the target user and performing channel estimation by the target user based on the NDP to determine channel state information; sending a beamforming report poll (BRP) trigger frame from the beamformer to the target user to trigger the target user to feed back channel state information; and sending from the target user a beamforming report to the beamformer, wherein the beamforming report including the channel state information.

Abstract: This disclosure relates to an X-ray reflectometry apparatus and a method for measuring a three-dimensional nanostructure on a flat substrate. The X-ray reflectometry apparatus comprises an X-ray source, an X-ray reflector, a 2-dimensional X-ray detector, and a two-axis moving device. The X-ray source is for emitting X-ray. The X-ray reflector is configured for reflecting the X-ray onto a sample surface. The 2-dimensional X-ray detector is configured to collect a reflecting X-ray signal from the sample surface. The two-axis moving device is configured to control two-axis directions of the 2-dimensional X-ray detector to move on at least one of x-axis and z-axis with a formula concerning an incident angle of the X-ray with respect to the sample surface for collecting the reflecting X-ray signal.

Abstract: The present invention relates to a golf accessory placement structure, which includes a bracket transversely pivoted to one side of a body of a golf bag cart, and a placement rack longitudinally pivoted to the bracket. When the golf accessory placement structure is used, the placement rack is matched with the bracket to produce horizontal and vertical angle changes, so as to improve the convenience of picking and placing the golf accessories on the placement rack. When the placement structure is not used, the bracket and the placement rack can be rotated and folded to a state parallel to the body to reduce the occupied space. The placement rack is a metal material that can be attracted by magnets, and at least one accessory assembly hole is provided thereon, so as to facilitate golf accessories to be placed on the placement rack by means of adsorption, hanging or tying.

Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.

Abstract: An optical lens includes an aspheric-shaped shell formed of an optical material, an optical plate connected to the aspheric-shaped shell, and a viscous fluid fluidically sealed in a cavity between the aspheric-shaped shell and the optical plate.

Abstract: A wafer bonding apparatus is provided. The wafer bonding apparatus includes a first wafer chuck, a second wafer chuck, and a plurality of bonding pins. The first wafer chuck is configured to hold a first wafer. The second wafer chuck is configured to hold a second wafer. The bonding pins are accommodated in the first wafer chuck and configured to be movable through the first wafer chuck to apply pressure to bend the first wafer, thereby causing bonding contact of the first wafer and the second wafer.

Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes: a data storage unit in a first dielectric layer; a word line disposed over the data storage unit; an array of conductive pads disposed over the word line; a hard mask layer disposed over the array of conductive pads; and a second dielectric layer laterally surrounding the hard mask layer and the array of conductive pads, the second dielectric layer is leveled with the hard mask layer.

Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes: a data storage unit in a first dielectric layer; a word line disposed over the data storage unit; an array of conductive pads disposed over the word line; a hard mask layer disposed over the array of conductive pads; and a second dielectric layer laterally surrounding the hard mask layer and the array of conductive pads, the second dielectric layer is leveled with the hard mask layer.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a MIM dual capacitor structure with an increased capacitance per unit area in a semiconductor structure. Without using additional mask layers, a second parallel plate capacitor can be formed over a first parallel plate capacitor, and both capacitors share a common capacitor plate. The two parallel plate capacitors can be connected in parallel to increase the capacitance per unit area.

Abstract: The present disclosure provides a laser etching system for electrode layer patterning, which can perform electrode layer patterning on the conductive layer of a first surface of the substrate of a double-sided structure touch panel by means of employing a laser beam without damaging the conductive layer on the second surface of the substrate. The system comprises a laser emitter for generating and emitting laser beams, and a laser etching platform for supporting and fixing the touch panel substrate, with the first surface facing the laser beam and the second surface adhering to the laser etching platform. The laser etching system further comprises optical elements, which ensure that the ratio of the spot size of the laser beam irradiated on the second surface to that irradiated on the first surface is not less than 1.2.

Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.