Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: Disclosed are a backlight module and a curved display device. The backlight module includes a backplane and a backlight. The backplane includes a backplane body and two arc fixing components. The backplane body is provided with two opposite arc sides and each arc fixing component is correspondingly detachably installed at each arc side to restrict a curvature of the backplane body. A mounting groove is formed by the cooperative enclosure of two arc fixing components and an inner surface of the backplane body. The backlight is provided into the mounting groove.

Abstract: A display apparatus and a display method are provided. The display apparatus includes a display panel, a display film assembly, a privacy film assembly, and a light source. The display film assembly includes a first light guide plate and an optical film. The optical privacy film assembly includes a second light guide plate and a privacy film. The privacy film is configured to adjust divergent lights exiting the second light guide plate into privacy lights at a preset angle. The light source is configured to emit incident lights to be selectively irradiated to the first light guide plate or the second light guide plate, so that the display apparatus is able to switch between a normal display mode and a privacy display mode.

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The present invention relates to an in vitro immune synapse system and a method of in vitro evaluating immune response using the same. The in vitro immune synapse system includes antigen-presenting cells (APCs) and at least one cell type of several specific T cell subtypes isolated from peripheral blood mononuclear cells (PBMCs), all of which is from a same individual of pigs. When a test sample is co-cultured in the in vitro immune synapse system for a given period, it can be determined that the test sample is immunogenic, immunostimulatory or not according to the immunization-related changes of these cells, thereby potentially replacing some kinds of animal experimentation.

Abstract: A preservation method of fresh tremella fuciformis suitable for cold-chain circulation includes pretreatment of fresh tremella fuciformis: selecting fresh tremella fuciformis with no mildew, no rot, no disease and insect pests, and water content?90% to enter subsequent cold-chain circulation; precooling: precooling the pretreated fresh tremella fuciformis put in a cold store at 1° C.-3° C., or performing vacuum precooling on the pretreated fresh tremella fuciformis; packaging, wherein a temperature of a packaging operation room of the fresh tremella fuciformis is less than or equal to 18° C., and time of the fresh tremella fuciformis from entering the packaging operation room to the completion of packaging does not exceed 1 h; storage: storing the packaged fresh tremella fuciformis immediately, controlling a storage temperature to 1° C.-3° C., and performing cold-chain transportation within 24 h; and cold-chain transportation: performing transportation by a refrigerated vehicle or by adding ice packs.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: An extreme ultra violet (EUV) lithography apparatus includes a light source that generates an EUV light beam, a scanner that receives the light from a junction with the light source and directs the light to a reticle stage, and a debris catcher disposed on a EUV beam path between the light source and the scanner. The debris catcher includes a network membrane including a plurality of nano-fibers.

Abstract: A bonding wafer structure includes a support substrate, a bonding layer, and a silicon carbide (SiC) layer. The bonding layer is formed on a surface of the support substrate, and the SiC layer is bonded onto the bonding layer, in which a carbon surface of the SiC layer is in direct contact with the bonding layer. The SiC layer has a basal plane dislocation (BPD) of 1,000 ea/cm2 to 20,000 ea/cm2, a total thickness variation (TTV) greater than that of the support substrate, and a diameter equal to or less than that of the support substrate. The bonding wafer structure has a TTV of less than 10 ?m, a bow of less than 30 ?m, and a warp of less than 60 ?m.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A method of manufacturing a semiconductor package includes depositing a first dielectric layer over a carrier substrate. A first metallization pattern is formed over the first dielectric layer. The first metallization pattern has a first opening exposing the first dielectric layer. A second dielectric layer is deposited over the first metallization pattern, forming a dielectric slot through the first metallization pattern by filling the first opening. A second metallization pattern and a third dielectric layer are formed over the second dielectric layer. A through via is formed over the third dielectric layer, so that the dielectric slot is laterally under the through via.

Abstract: A single-ended output circulator includes a three-core optical fiber head having first, second, and third optical fiber cores; a walk-off crystal having a first surface facing towards the second end of the three-core optical fiber head tube and a second surface facing away from the second end of the three-core optical fiber head tube; a plurality of half-wave plates each having a first surface coupled to the second surface of the walk-off crystal and a second surface facing away from the second surface of the walk-off crystal; a collimating lens having a first end and a second end; a reflection mirror configured to reflect light beams from the collimating lens; an optical prism between the collimating lens and the reflection mirror and configured to transmit a light beam along a propagation direction according to a polarization direction of the light beam; and a polarization rotator.

Abstract: A microwave separated field reconstructed device includes: a microwave field reconstructed cavity, a first short circuit plane, a third waveguide flange and coupling windows, wherein connection ports are provided on four ends of the microwave field reconstructed cavity; the microwave field reconstructed cavity is provided with a first waveguide flange, and a second waveguide flange is provided one end of the microwave field reconstructed cavity perpendicular to the first waveguide flange; the first short circuit plane is connected to one end of the first waveguide flange away from the microwave field reconstructed cavity; a second short circuit plane is connected to one end of the second waveguide flange away from the microwave field reconstructed cavity. The input ports are distributed at two ends of the microwave field reconstructed cavity to introduce electric and magnetic fields.

Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: An angle-adjustable supporting mechanism that includes a knob-type locking mechanism and a rotatable holder is provided. The knob-type locking mechanism has a base, a knob, and a latch member. The base has a receiving space and a supporting portion. The knob is rotatably received in the receiving space. The latch member is movably received in the supporting portion in a linear direction. The latch member has a bolt, a first stressed part, and a second stressed part. The bolt is disposed at one side of the first stressed part. The first stressed part is disposed between the bolt and the second stressed part. When the knob is rotated in different directions, the bolt of the latch member is drove to lock or release.