Patents by Inventor Liang Hou
Liang Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12266701Abstract: A high electron mobility transistor includes a substrate, a mesa structure disposed on the substrate, a passivation layer disposed on the mesa structure, and at least a contact structure disposed in the passivation layer and the mesa structure. The mesa structure includes a channel layer, a barrier layer on the channel layer, two opposite first edges extending along a first direction, and two opposite second edges extending along a second direction. The contact structure includes a body portion and a plurality of protruding portions. The body portion penetrates through the passivation layer. The protruding portions penetrate through the barrier layer and a portion of the channel layer. In a top view, the body portion overlaps the two opposite first edges of the mesa structure without overlapping the two opposite second edges of the mesa structure.Type: GrantFiled: May 18, 2023Date of Patent: April 1, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Tung Yeh, Chun-Liang Hou, Wen-Jung Liao, Chun-Ming Chang, Yi-Shan Hsu, Ruey-Chyr Lee
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Publication number: 20250079601Abstract: A battery pack assembly configured to be coupled to a battery housing for an electrified vehicle includes a battery case and an air column assembly. The battery case has a bottom surface, a forward wall, a rearward wall, a first sidewall and a second sidewall. The air column assembly is supported within the battery case and includes a first, second and third plurality of air columns. The first plurality of air columns are positioned along the bottom surface of the battery case. The second plurality of air columns are positioned outboard of the first plurality of air columns. The third plurality of air columns are positioned outboard of the second plurality of air columns and engage the forward wall, rearward wall, first sidewall and second sidewall of the battery case in an installed position. The battery case assembly mitigates impact damage to the battery housing in the installed position.Type: ApplicationFiled: August 28, 2023Publication date: March 6, 2025Inventors: Huiyang Yu, Cuicui Zhang, Jingjing Zhao, Gang Wang, Liang Hou, Caizhen Sun
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Publication number: 20250041218Abstract: The present invention provides a method of preventing or treating CNS diseases. The method comprises the step of administering to a subject in need thereof an effective amount of (i) a polymer-flavonoid conjugate, (ii) a flavonoid oligomer, or (iii) micelles having an outer shell comprising one or more polymer-flavonoid conjugates and optionally an inner shell comprising one or more flavonoid oligomer and a drug encapsulated within the shells. The present method brings therapeutic effective materials through blood-brain barrier to treat CNS diseases. The present method is effective to treat CNS diseases such as brain tumors, stroke, neurodegenerative diseases.Type: ApplicationFiled: October 17, 2024Publication date: February 6, 2025Inventors: Chun-Ting Cheng, Yuan-Chung Tsai, Pauline Ying Lau, Kuo-Liang Hou
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Patent number: 12206000Abstract: A method for forming a high electron mobility transistor is disclosed. A mesa structure having a channel layer and a barrier layer is formed on a substrate. The mesa structure has two first edges extending along a first direction and two second edges extending along a second direction. A passivation layer is formed on the substrate and the mesa structure. A first opening and a plurality of second openings connected to a bottom surface of the first opening are formed and through the passivation layer, the barrier layer and a portion of the channel layer. In a top view, the first opening exposes the two first edges of the mesa structure without exposing the two second edges of the mesa structure. A metal layer is formed in the first opening and the second openings thereby forming a contact structure.Type: GrantFiled: January 18, 2024Date of Patent: January 21, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Tung Yeh, Chun-Liang Hou, Wen-Jung Liao, Chun-Ming Chang, Yi-Shan Hsu, Ruey-Chyr Lee
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Publication number: 20250015173Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a barrier layer on the buffer layer; forming a hard mask on the barrier layer; performing an implantation process through the hard mask to form a doped region in the barrier layer and the buffer layer; removing the hard mask and the barrier layer to form a first trench; forming a gate dielectric layer on the hard mask and into the first trench; forming a gate electrode on the gate dielectric layer; and forming a source electrode and a drain electrode adjacent to two sides of the gate electrode.Type: ApplicationFiled: September 17, 2024Publication date: January 9, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Shin-Chuan Huang, Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Wen-Jung Liao, Chun-Liang Hou
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Patent number: 12125903Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a barrier layer on the buffer layer; forming a hard mask on the barrier layer; performing an implantation process through the hard mask to form a doped region in the barrier layer and the buffer layer; removing the hard mask and the barrier layer to form a first trench; forming a gate dielectric layer on the hard mask and into the first trench; forming a gate electrode on the gate dielectric layer; and forming a source electrode and a drain electrode adjacent to two sides of the gate electrode.Type: GrantFiled: September 21, 2023Date of Patent: October 22, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Shin-Chuan Huang, Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Wen-Jung Liao, Chun-Liang Hou
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Publication number: 20240322008Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer, forming a second barrier layer on the first barrier layer, forming a first hard mask on the second barrier layer, removing the first hard mask and the second barrier layer to form a recess; and forming a p-type semiconductor layer in the recess.Type: ApplicationFiled: June 3, 2024Publication date: September 26, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou, Chih-Tung Yeh
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Patent number: 12074537Abstract: This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.Type: GrantFiled: April 11, 2023Date of Patent: August 27, 2024Assignee: TENSOR TECH CO., LTD.Inventors: Shang Jung Lee, Po-Hsun Yen, Yung-Cheng Chang, Sung-Liang Hou
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Publication number: 20240282273Abstract: A control method of display device including obtaining an image displayed by a display device by a computing controller; dividing the image into a plurality of sub-regions by the computing controller; computing a color weight data of each of the plurality of sub-regions by the computing controller; generating a color data for at least one of the plurality of light-emitting components corresponding to each of the plurality of sub-regions based on the color weight data of each of the plurality of sub-regions by the computing controller; transferring the color data for each of the plurality of light-emitting components to the light controller by the computing controller; and controlling each of the plurality of light-emitting components to emit corresponding color of light based on the color data by the light controller.Type: ApplicationFiled: January 23, 2024Publication date: August 22, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chun-Te YEH, Chung-Wen CHEN, Chia-Liang HOU
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Publication number: 20240282272Abstract: A display device and control method thereof. The display device includes a housing, a display assembly, and a plurality of light-emitting components. The housing has a front surface, an outer peripheral surface and a mounting opening. The outer peripheral surface is connected to the front surface. The mounting opening is located on the front surface and surrounded by the outer peripheral surface. The display assembly is disposed in the mounting opening and exposed to outside. The plurality of light-emitting components are fixed to the housing. A light emitted from the plurality of light-emitting components is partially emitted along a normal direction of the outer peripheral surface, and is partially emitted along a normal direction of the front surface.Type: ApplicationFiled: March 30, 2023Publication date: August 22, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chun-Te YEH, Chung-Wen CHEN, Chia-Liang HOU
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Publication number: 20240234539Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: ApplicationFiled: December 25, 2023Publication date: July 11, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Publication number: 20240235420Abstract: This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.Type: ApplicationFiled: April 11, 2023Publication date: July 11, 2024Applicant: TENSOR TECH CO., LTDInventors: Shang Jung LEE, Po-Hsun YEN, Yung-Cheng CHANG, Sung-Liang HOU
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Patent number: 12027604Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a second barrier layer on the first barrier layer; forming a first hard mask on the second barrier layer; removing the first hard mask and the second barrier layer to form a recess; and forming a p-type semiconductor layer in the recess.Type: GrantFiled: June 28, 2023Date of Patent: July 2, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou, Chih-Tung Yeh
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Publication number: 20240162313Abstract: A method for forming a high electron mobility transistor is disclosed. A mesa structure having a channel layer and a barrier layer is formed on a substrate. The mesa structure has two first edges extending along a first direction and two second edges extending along a second direction. A passivation layer is formed on the substrate and the mesa structure. A first opening and a plurality of second openings connected to a bottom surface of the first opening are formed and through the passivation layer, the barrier layer and a portion of the channel layer. In a top view, the first opening exposes the two first edges of the mesa structure without exposing the two second edges of the mesa structure. A metal layer is formed in the first opening and the second openings thereby forming a contact structure.Type: ApplicationFiled: January 18, 2024Publication date: May 16, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chih-Tung Yeh, Chun-Liang Hou, Wen-Jung Liao, Chun-Ming Chang, Yi-Shan Hsu, Ruey-Chyr Lee
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Publication number: 20240136423Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: ApplicationFiled: December 25, 2023Publication date: April 25, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Publication number: 20240136946Abstract: This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.Type: ApplicationFiled: April 10, 2023Publication date: April 25, 2024Applicant: TENSOR TECH CO., LTDInventors: Shang Jung LEE, Po-Hsun YEN, Yung-Cheng CHANG, Sung-Liang HOU
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Publication number: 20240128353Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Patent number: 11935947Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.Type: GrantFiled: October 8, 2019Date of Patent: March 19, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Shin-Chuan Huang, Wen-Jung Liao, Chun-Liang Hou
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Patent number: 11894441Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: GrantFiled: May 16, 2022Date of Patent: February 6, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Patent number: D1043389Type: GrantFiled: October 12, 2022Date of Patent: September 24, 2024Inventor: Liang Hou