Patents by Inventor Liang Huang
Liang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240086625Abstract: An information processing method and apparatus, a terminal, and a storage medium. The information processing method comprises: determining first content in response to a first operation event of a first control in a first document (S11); and adding the first content to the first document on the basis of content information and type information of the first content (S12). The type information comprises first type information and/or second type information, the second type information having an association with the first type information. In the described method, first content can be added to a first document according to content information and type information of the first content, so as to distinguish different ways of adding the first content.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Inventors: Lu ZHANG, Wenzong MA, Xinlei GUO, Xiaolin FANG, Hao HUANG, Liang CHEN, Lanjin ZHOU, Linghui ZHOU, Yingtao LIU, Dirun HUANG, Xuebing ZENG, Zejian LIN, Yingjie YOU, Yunzhao TONG, Yuxiang CHEN, Jiawei CHEN
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Publication number: 20240088195Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Yu WEI, Yen-Liang LIN, Kuo-Cheng LEE, Hsun-Ying HUANG, Hsin-Chi CHEN
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Publication number: 20240087890Abstract: A method includes depositing a photoresist layer over a target layer, the photoresist layer comprising an organometallic material; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation; developing the exposed photoresist layer to form a photoresist pattern; forming a spacer on a sidewall of the photoresist pattern; removing the photoresist pattern; after removing the photoresist pattern, patterning the target layer through the spacer.Type: ApplicationFiled: August 26, 2022Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Lien HUANG, Chih-Cheng LIU, Tze-Liang LEE
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Publication number: 20240086590Abstract: An adaptive grid generating method includes obtaining a first three-dimensional grid of a target structure; importing the first three-dimensional grid into a computer-aided engineering software to obtain a first two-dimensional planar grid; importing the first two-dimensional planar grid into a grid cleaning software to obtain a second two-dimensional planar grid; and importing the second two-dimensional planar grid into the computer-aided engineering software to obtain a second three-dimensional grid.Type: ApplicationFiled: June 12, 2023Publication date: March 14, 2024Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Hsueh-Liang Chen, Chen-Chou Huang, I-Chang Wang, Tzung-Shian Hung
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Patent number: 11926982Abstract: An assembled subway station and a construction method thereof are provided. The assembled subway station includes a plurality of components combined in a ring shape, comprising a bottom plate component, two bottom corner components, two side wall components, a middle plate component, two top corner components, and a top plate component. Connection surfaces of each component are each provided with a concave-convex structure being matched with another concave-convex structure on a relevant connection surface of an adjacent component. Butt joint positions of two adjacent components are filled with sealing structures. The embedded grooves of two adjacent components are oppositely arranged, and connecting members for exerting opposite fastening forces on the two adjacent components are installed in the oppositely arranged embedded grooves.Type: GrantFiled: January 17, 2022Date of Patent: March 12, 2024Assignee: Guangzhou Metro Design & Research Institute Co., Ltd.Inventors: Xianli Ding, Bao Xiang, Xingzhong Nong, Juyang Wu, Haiou Shi, Feiqi Ou, Zihui Zan, Ran Wang, Shengya He, Xiao Li, Chunjie Liu, Liang Ye, Qian Zhou, Hengyi Li, Wenqi Zhang, Yiheng Ren, He Huang
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Publication number: 20240078274Abstract: A technique for providing search results may include determining a first entity type, a second entity type, and a relationship type based on a compositional query. The technique may also include identifying nodes of a knowledge graph corresponding to entity references of the first entity type and entity references of the second entity type. The technique may also include determining from the knowledge graph an attribute value corresponding to the relationship type for each entity reference of the first entity type and for each entity reference of the second entity type. The technique may also include comparing the attribute value of each entity reference of the first entity type with the attribute value of each entity reference of the second entity type. The technique may also include determining one or more resultant entity references from the entity references of the first entity type based on the comparing.Type: ApplicationFiled: September 18, 2023Publication date: March 7, 2024Inventors: Jinyu Lou, Ying Chai, Chen Ding, Lijie Chen, Liang Hu, Kejia Liu, Weibin Pan, Yanlai Huang, David Francois Huynh
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Publication number: 20240077392Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.Type: ApplicationFiled: April 11, 2023Publication date: March 7, 2024Inventors: Kuo-Liang YEH, Ya-Ju CHANG, Jung-Kuei PENG, Sheng-Tang CHANG, Min-Wen WENG, Wen-Ting HUANG
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Patent number: 11923201Abstract: Semiconductor device structures having metal gate structures with tunable work function values are provided. In one example, a first gate structure and a second gate structure formed on a substrate, wherein the first gate structure includes a first work function metal having a first material, and the second gate structure includes a second work function metal having a second material, the first material being different from the second material, wherein the first gate structure further includes a gate dielectric layer, a self-protective layer having metal phosphate, and the first work function metal on the self-protective layer.Type: GrantFiled: February 26, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ju-Li Huang, Ying-Liang Chuang, Ming-Hsi Yeh, Kuo-Bin Huang
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Patent number: 11920313Abstract: The present invention relates to an aqueduct leakage repairing method, a formwork is provided within an aqueduct body; a reinforcing layer is formed by using the formwork through casting at inner sides of the aqueduct body; the formwork comprises side formwork plates, bottom formwork plates, and axillary angle formwork plates; the side formwork plates are arranged at inner vertical walls of the aqueduct body, the bottom formwork plates are arranged on a bottom of the aqueduct body, the bottom formwork plates are connected with the side formwork plates through the axillary angle formwork plates; and the axillary angle formwork plates are each provided with a plurality of ribs. The aqueduct leakage repairing method effectively reinforces penetration damage of the aqueduct, and the construction process is simple since the formwork is free from dismantling after construction.Type: GrantFiled: September 24, 2019Date of Patent: March 5, 2024Assignee: GUANGDONG RESEARCH INSTITUTE OF WATER RESOURCES AND HYDROPOWERInventors: Zhaoheng Li, Liang Xie, Jinlin Huang, Lihua Wang, Junlu Zhang
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Patent number: 11921099Abstract: A method for quantitatively analyzing the reservoir formation of an ultra-deep evaporite-dolomite paragenesis system is performed as follows. A typical drilling core containing the evaporite-dolomite paragenesis system and a field section are observed. The logging data is subjected to single-factor analysis to determine the planar distribution regularity of the ultra-deep evaporite and the dolomite, and the analysis of sedimentary combination pattern and development evolution regularity is performed. The diagenetic system is determined, and the reservoir formation of the evaporite-dolomite paragenesis system is analyzed. Based on the above technical solutions, the property, the evolution path and the reservoir formation of sedimentation-diagenesis fluids in the evaporite-dolomite paragenesis system can be clarified.Type: GrantFiled: July 31, 2023Date of Patent: March 5, 2024Assignee: SOUTHWEST PETROLEUM UNIVERSITYInventors: Fei Huo, Xingzhi Wang, Huaguo Wen, Huiwen Huang, Yunbo Ruan, Liang Li
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Patent number: 11923428Abstract: A semiconductor device includes a fin structure disposed over a substrate. The semiconductor device includes a first interfacial layer straddling the fin structure. The semiconductor device includes a gate dielectric layer extending along sidewalls of the fin structure. The semiconductor device includes a second interfacial layer overlaying a top surface of the fin structure. The semiconductor device includes a gate structure straddling the fin structure. The first interfacial layer and the gate dielectric layer are disposed between the sidewalls of the fin structure and the gate structure.Type: GrantFiled: April 20, 2023Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chi Pan, Ying-Liang Chuang, Ming-Hsi Yeh, Kuo-Bin Huang
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Publication number: 20240072497Abstract: A network jack has a connector, a housing and a plurality of magnetic circuit elements. The connector has a first end, a second end, and at least four walls. The four walls extend from the first end to the second end in a first direction and are disposed about a bar. The bar has conductive contacts thereon and is spaced apart from the four walls. The housing has sides extending in the first direction from a top edge to a bottom panel. The housing includes an interior defined between the top edge and the bottom panel, the top edge operably coupled adjacent the second end of the connector. The plurality of leads extend from the bottom panel. The magnetic circuit elements are disposed in the interior of the housing and operably coupled to the plurality of leads and at least a first of the conductive contacts on the bar.Type: ApplicationFiled: October 2, 2020Publication date: February 29, 2024Inventors: Weijia Kong, Yukun Liao, Liang Huang, Buddy Woods
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Publication number: 20240074041Abstract: A circuit board includes a substrate and a metallic layer. A first area and at least one second area are defined on a portion of the substrate, the second area is located outside the first area. The metallic layer includes first test lines disposed on the first area and second test lines disposed on the second area. A first test pad of each of the first test lines has a first width, and a second test pad of each of the second test lines has a second width. The second width is greater than the first width such that probes of an electrical testing tool can contact the first and second test pads on the circuit board correctly during electrical testing.Type: ApplicationFiled: August 16, 2023Publication date: February 29, 2024Inventors: Gwo-Shyan Sheu, Kuo-Liang Huang, Hsin-Hao Huang, Pei-Wen Wang, Yu-Chen Ma
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Publication number: 20240070308Abstract: Embodiments of the present disclosure relate to a permission setting method and apparatus, a device, and a medium. The method includes: displaying a permission customization control, in response to a trigger operation on a permission setting object of task information, the permission setting object including a first information object and/or a second information object, the second information object being subordinate to the first information object; displaying a permission editing interface, in response to a trigger operation on the permission customization control, and receiving customization permission information via the permission editing interface; and displaying the customization permission information corresponding to the permission setting object. Therefore, a hierarchy structure based on the task information satisfies a setting need for content-based permission customization, and improves a permission management efficiency.Type: ApplicationFiled: October 24, 2023Publication date: February 29, 2024Inventors: Wenzong MA, Liang CHEN, Yingtao LIU, Wei REN, Qiushuo HUANG, Yuejiang YUAN, Hao HUANG, Jianhui WU, Yalong ZOU, Linghui ZHOU, Mengzhang WU, Yanhui ZHAO, Xinlei GUO
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Publication number: 20240071965Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Inventors: Tung-Liang Shao, Yu-Sheng Huang, Wen-Hao Cheng, Chen-Hua Yu
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Patent number: 11914937Abstract: Techniques, systems, and devices are described for providing a computational frame for estimating high-dimensional stochastic behaviors. In one exemplary aspect, a method for performing numerical estimation includes receiving a set of measurements of a stochastic behavior. The set of correlated measurements follows a non-standard probability distribution and is non-linearly correlated. Also, a non-linear relationship exists between a set of system variables that describes the stochastic behavior and a corresponding set of measurements. The method includes determining, based on the set of measurements, a numerical model of the stochastic behavior. The numerical model comprises a feature space comprising non-correlated features corresponding to the stochastic behavior. The non-correlated features have a dimensionality of M and the set of measurements has a dimensionality of N, M being smaller than N.Type: GrantFiled: February 13, 2023Date of Patent: February 27, 2024Assignees: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC, VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Xiao Chen, Can Huang, Liang Min, Charanraj Thimmisetty, Charles Tong, Yijun Xu, Lamine Mili
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Publication number: 20240035503Abstract: The present disclosure relates to a fastener for fastening a fastening attachment to a carrier. The fastener includes a support disc and an engaging mechanism. The lower side of the support disc has a support disc supporting surface. The engaging mechanism connects the fastening attachment, and the engaging mechanism is formed by extending from the support disc supporting surface. The engaging mechanism includes a rod, a head and a pair of deflectable support members. A proximal end of the rod is connected to the support disc supporting surface. The head is arranged at a distal end of the rod. The pair of deflectable support members are arranged on the rod and comprise support member supporting surfaces facing the support disc, and a pre-assembling clamping space is defined between the support member supporting surfaces and the support disc to clamp at least part of a thickness of the fastening attachment.Type: ApplicationFiled: July 21, 2023Publication date: February 1, 2024Inventors: Liang HUANG, Xing WANG
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Publication number: 20240038571Abstract: At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes a base portion that extends laterally outward from a central vacuum portion of the vacuum chuck, and a plurality of protrusions are spaced apart from the central vacuum portion and extend outward from the base portion. End surfaces of the plurality of protrusions contact a backside surface of the workpiece (e.g., a wafer on a carrier) when the workpiece is present on the vacuum chuck. The vacuum chuck may further include one or more guide portions that act as guides such that the workpiece remains properly aligned and within position when present on the vacuum chuck.Type: ApplicationFiled: July 28, 2022Publication date: February 1, 2024Inventors: Po-Yo SU, Young-Wei LIN, Yu Liang HUANG, Chia-Ching LEE, Chi-Chun PENG, Chen Liang CHANG, Kuo Hui CHANG
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Patent number: 11887928Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: GrantFiled: December 17, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Shun Chang, Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang
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Patent number: 11843245Abstract: A wireless power transfer apparatus for capacitive-inductive power transfer has a primary and a secondary device separated by the conductive member. The primary device has at least two transmitter plates configured to be capacitively coupled with the conductive member to induce a current flow and generate a magnetic field in the conductive member. The secondary device is connectable to a load and provided with a receiving coil configured to be inductively coupled with the conductive member.Type: GrantFiled: March 4, 2019Date of Patent: December 12, 2023Assignee: AUCKLAND UNISERVICES LIMITEDInventors: Aiguo Hu, Liang Huang, Wei Zhou