Patents by Inventor Liang Huang
Liang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071965Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Inventors: Tung-Liang Shao, Yu-Sheng Huang, Wen-Hao Cheng, Chen-Hua Yu
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Publication number: 20240070308Abstract: Embodiments of the present disclosure relate to a permission setting method and apparatus, a device, and a medium. The method includes: displaying a permission customization control, in response to a trigger operation on a permission setting object of task information, the permission setting object including a first information object and/or a second information object, the second information object being subordinate to the first information object; displaying a permission editing interface, in response to a trigger operation on the permission customization control, and receiving customization permission information via the permission editing interface; and displaying the customization permission information corresponding to the permission setting object. Therefore, a hierarchy structure based on the task information satisfies a setting need for content-based permission customization, and improves a permission management efficiency.Type: ApplicationFiled: October 24, 2023Publication date: February 29, 2024Inventors: Wenzong MA, Liang CHEN, Yingtao LIU, Wei REN, Qiushuo HUANG, Yuejiang YUAN, Hao HUANG, Jianhui WU, Yalong ZOU, Linghui ZHOU, Mengzhang WU, Yanhui ZHAO, Xinlei GUO
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Patent number: 11914937Abstract: Techniques, systems, and devices are described for providing a computational frame for estimating high-dimensional stochastic behaviors. In one exemplary aspect, a method for performing numerical estimation includes receiving a set of measurements of a stochastic behavior. The set of correlated measurements follows a non-standard probability distribution and is non-linearly correlated. Also, a non-linear relationship exists between a set of system variables that describes the stochastic behavior and a corresponding set of measurements. The method includes determining, based on the set of measurements, a numerical model of the stochastic behavior. The numerical model comprises a feature space comprising non-correlated features corresponding to the stochastic behavior. The non-correlated features have a dimensionality of M and the set of measurements has a dimensionality of N, M being smaller than N.Type: GrantFiled: February 13, 2023Date of Patent: February 27, 2024Assignees: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC, VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Xiao Chen, Can Huang, Liang Min, Charanraj Thimmisetty, Charles Tong, Yijun Xu, Lamine Mili
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Publication number: 20240035503Abstract: The present disclosure relates to a fastener for fastening a fastening attachment to a carrier. The fastener includes a support disc and an engaging mechanism. The lower side of the support disc has a support disc supporting surface. The engaging mechanism connects the fastening attachment, and the engaging mechanism is formed by extending from the support disc supporting surface. The engaging mechanism includes a rod, a head and a pair of deflectable support members. A proximal end of the rod is connected to the support disc supporting surface. The head is arranged at a distal end of the rod. The pair of deflectable support members are arranged on the rod and comprise support member supporting surfaces facing the support disc, and a pre-assembling clamping space is defined between the support member supporting surfaces and the support disc to clamp at least part of a thickness of the fastening attachment.Type: ApplicationFiled: July 21, 2023Publication date: February 1, 2024Inventors: Liang HUANG, Xing WANG
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Publication number: 20240038571Abstract: At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes a base portion that extends laterally outward from a central vacuum portion of the vacuum chuck, and a plurality of protrusions are spaced apart from the central vacuum portion and extend outward from the base portion. End surfaces of the plurality of protrusions contact a backside surface of the workpiece (e.g., a wafer on a carrier) when the workpiece is present on the vacuum chuck. The vacuum chuck may further include one or more guide portions that act as guides such that the workpiece remains properly aligned and within position when present on the vacuum chuck.Type: ApplicationFiled: July 28, 2022Publication date: February 1, 2024Inventors: Po-Yo SU, Young-Wei LIN, Yu Liang HUANG, Chia-Ching LEE, Chi-Chun PENG, Chen Liang CHANG, Kuo Hui CHANG
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Patent number: 11887928Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: GrantFiled: December 17, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Shun Chang, Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang
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Patent number: 11843245Abstract: A wireless power transfer apparatus for capacitive-inductive power transfer has a primary and a secondary device separated by the conductive member. The primary device has at least two transmitter plates configured to be capacitively coupled with the conductive member to induce a current flow and generate a magnetic field in the conductive member. The secondary device is connectable to a load and provided with a receiving coil configured to be inductively coupled with the conductive member.Type: GrantFiled: March 4, 2019Date of Patent: December 12, 2023Assignee: AUCKLAND UNISERVICES LIMITEDInventors: Aiguo Hu, Liang Huang, Wei Zhou
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Patent number: 11841829Abstract: An information handling system includes a processor configured to process a training data file to determine an optimal data compression algorithm. The processor may also perform a compression ratio analysis that includes compressing the training data file using data compression algorithms, calculating a compression ratio associated with each of the data compression algorithms, determining an optimal compression ratio from the compression ratio associated with the each data compression algorithm; and determining a desirable data compression algorithm associated with the training data file based on the optimal compression ratio.Type: GrantFiled: July 23, 2021Date of Patent: December 12, 2023Assignee: Dell Products L.P.Inventors: Xiao Na Zhang, Dong Liang Huang
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Publication number: 20230321795Abstract: A pipe plier structure includes a first body, a second body, a pivot member, and a locking member. The first body is provided with multiple first teeth, an arc line, an axis, a first vertical line, a radius, a first angle, and a second angle. The second body is provided with multiple second teeth, multiple third teeth, a second vertical line, a first connecting line, a second connecting line, a third angle, a fourth angle, a concave face, a fifth angle, a sixth angle, a seventh angle, and an eighth angle. The pivot member is assembled with the first body and the second body. The locking member is assembled with the first body and the second body. The locking member provides an elastically restoring force to the first body and the second body after the second body is extended outward relative to the first body.Type: ApplicationFiled: April 8, 2022Publication date: October 12, 2023Inventors: Yung-Sheng Lin, Shih-Liang Huang
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Patent number: 11778930Abstract: A manufacturing method of a resistive memory device includes the following steps. A first electrode is formed. A first metal oxide layer is formed on the first electrode, and the first metal oxide layer includes first metal atoms. A multilayer insulator structure is formed on the first metal oxide layer. A second metal oxide layer is formed on the multilayer insulator structure. The second metal oxide layer includes second metal atoms, the multilayer insulator structure includes third metal atoms, and each of the third metal atoms is identical to each of the second metal atoms. A second electrode is formed on the second metal oxide layer. The multilayer insulator structure is disposed between the first metal oxide layer and the second metal oxide layer in a vertical direction, and an atomic percent of the third metal atoms in the multilayer insulator structure changes in the vertical direction.Type: GrantFiled: January 17, 2022Date of Patent: October 3, 2023Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Yuheng Liu, Yunfei Fu, Chih-Chien Huang, Kuo Liang Huang, Wen Yi Tan
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Patent number: 11766709Abstract: A forming die includes a first die component with a male bead and a second die component with a female bead. The male bead and the female bead form a bead with a reverse bead geometry with the male bead having a groove and the female bead having a protrusion complimentary with the groove such that the protrusion is aligned with the groove when the male bead extends into the female bead. The male bead includes a push surface, a pair of sidewalls extending from the push surface to a main surface of the first die component, and the groove extends inwardly into the rib. And the female bead includes a stop surface and a pair of sidewalls extending from the stop surface to a main surface of the second die component, and the protrusion extends outwardly from the stop surface into the female bead.Type: GrantFiled: March 8, 2021Date of Patent: September 26, 2023Assignee: Ford Global Technologies, LLCInventors: Evangelos Liasi, Liang Huang, Feng Ren, Andrey M. Ilinich, Yuan Gan, S. George Luckey, Jr.
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Patent number: 11766712Abstract: A method of manufacturing a panel using an initial die and a series of secondary dies includes sequentially defining multi-dimensional models for the series of secondary dies. The method includes simulating a geometry of an nth pre-panel, defining a multi-dimensional model of the nth secondary die based on the simulated geometry of the nth pre-panel, simulating operation of the nth secondary die on the nth pre-panel to determine geometry of an (n+1)th pre-panel, and determining a deviation between the simulated (n+1)th pre-panel and a target pre-panel geometry. If the deviation is outside tolerance, the method includes iteratively: adjusting the multi-dimensional model of the nth secondary die, simulating operation thereof to determine an adjusted simulated geometry of the (n+1)th pre-panel, and determining a deviation between the adjusted simulated geometry of the (n+1)th pre-panel and the target (n+1)th pre-panel, until the deviation is within the tolerance limit.Type: GrantFiled: October 21, 2020Date of Patent: September 26, 2023Assignee: Ford Global Technologies, LLCInventors: Evangelos Liasi, Liang Huang, Yinong Shen, Joon Kang, Rob Vaughn Degenhardt
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Publication number: 20230288769Abstract: Disclosed herein is a solid polymer electrolyte membrane prepared by subjecting an oligomer-containing composition to a polymerization reaction. The oligomer-containing composition includes ethoxylated multifunctional acrylate monomer, polyether amine oligomer, and a lithium salt. An electrochromic device including an anode, a cathode, and the solid polymer electrolyte membrane is also disclosed. The solid polymer electrolyte membrane is disposed between the anode and the cathode.Type: ApplicationFiled: September 27, 2022Publication date: September 14, 2023Applicant: Ming Chi University of TechnologyInventors: Wen-Liang HUANG, Chun-Chen YANG
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Patent number: 11744236Abstract: Disclosed is a magnetic braking mechanism which includes a spool, a magnetic braking assembly arranged on a side of the spool, the magnetic braking assembly includes a magnet assembly for generating magnetic induction lines and a centrifugal adjusting assembly for automatically adjusting a spacing between the magnet assembly and an inner wall of the spool according to a rotation speed of the spool, so as to adjust range of the magnetic induction lines cut by the spool, thereby automatically adjusting magnitude of a braking force. The centrifugal adjusting assembly allows the magnet assembly to move close to or away from the inner wall of the spool in the radial direction, so as to control strength of the magnetic induction lines near the inner wall of the spool, thereby adjusting the magnitude of the breaking force. Further disclosed are a bait casting reel and a fishing tool.Type: GrantFiled: January 26, 2022Date of Patent: September 5, 2023Assignee: Shenzhen Bosaidong Technology Co., Ltd.Inventors: Yunting Zhang, Liang Huang
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Patent number: 11746841Abstract: The present invention relates to an anti-drag structure of automobile brake calipers, comprising a brake caliper body which is provided with a cylinder bore and a brake claw arranged along the axis of the cylinder bore in an extending mode; and a cylindrical piston bush is pressed in the cylinder bore by interference fit, a step ring groove is formed in the inner wall of the piston bush and composed of a major diameter ring groove and a minor diameter ring groove which have rectangular sections. The present invention can improve the generality of the brake caliper body through the arrangement of the piston bush and improve the standardization of production manufacturing of brake calipers, and can reduce the residual drag moment of the brake caliper and the fuel consumption with the rubber seal ring and the phenolic resin PF ring to achieve the purpose of emission reduction.Type: GrantFiled: April 23, 2021Date of Patent: September 5, 2023Assignee: CSG TRW Chassis Systems CO., LTDInventors: Liang Huang, Peng Jiang
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Patent number: 11719252Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.Type: GrantFiled: March 8, 2022Date of Patent: August 8, 2023Assignee: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
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Patent number: 11713088Abstract: A leg mechanism of a humanoid robot includes: an upper leg, a lower leg rotatably coupled to the upper leg, a knee module actuator mounted to the upper leg, a foot rotatably connected to the lower leg, a knee transmission mechanism connected to the knee module actuator and the lower leg and configured to transmit rotary motion from the knee module actuator to the lower leg, at least one ankle module actuator mounted to the upper leg, at least one ankle transmission mechanism connected to the at least one ankle module actuator and the foot and configured to transmit rotary motion from the at least one ankle module actuator to the foot.Type: GrantFiled: December 25, 2020Date of Patent: August 1, 2023Assignee: UBTECH ROBOTICS CORP LTDInventors: Liang Huang, Hongyu Ding, Jianxin Pang, Youjun Xiong
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Patent number: 11708882Abstract: A head mechanism includes a base connectable to a body of a robot, a mounting member arranged above the base, a connecting member rotatably connected to the base and the mounting member. The connecting member, together with the mounting member, is rotatable relative to the base about a first axis, and the mounting member is rotatable relative to the connecting member about a second axis. The first axis and the second axis extend in different directions. The head mechanism further includes two first actuating mechanisms fixed to the base, and the two first actuating mechanisms are configured to drive the mounting member to rotate with respect to the base.Type: GrantFiled: July 29, 2020Date of Patent: July 25, 2023Assignee: UBTECH ROBOTICS CORP LTDInventors: Liang Huang, Hongyu Ding, Jianxin Pang, Youjun Xiong
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Patent number: 11685043Abstract: A mechanical arm includes a first link connectable to a surface, a second link, a third link, a fourth link, and a fifth link that are coupled to one another in series, and an end effector connectable to the fifth link. The end effector is rotatable about an axis of rotation same as an axis of rotation of the fourth link, and rotatable about an axis of rotation orthogonal to the axis of rotation of the fourth link. The first link, the second link, the third link, the fourth link, and the fifth link are collectively structured and configured to rotate such that the end effector is actuatable to a workspace under the surface.Type: GrantFiled: June 15, 2020Date of Patent: June 27, 2023Assignee: UBTECH ROBOTICS CORP LTDInventors: Chengkun Zhang, Liang Huang, Jianbo Li, Jingchen Li, Hongyu Ding, Wenhua Fan, Won Suk You, Raymond Ma, Muhammed Rasid Pac, Huan Tan, Youjun Xiong
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Publication number: 20230197600Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: ApplicationFiled: December 17, 2021Publication date: June 22, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG