Patents by Inventor Liang Ji
Liang Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964677Abstract: The present invention relates to a platform door control apparatus based on a double 2-vote-2 architecture, including a security communication and logic processing module, a driver collection module, and a maintenance module, the security communication and logic processing module is separately connected to the driver collection module and the maintenance module, and both the security communication and logic processing module and the driver collection module are devices using the double 2-vote-2 architecture. Compared with the prior art, the present invention has the following advantages of effectively improving linkage efficiency of a signal system and a platform door system, and the like.Type: GrantFiled: March 15, 2019Date of Patent: April 23, 2024Assignee: CASCO SIGNAL CO., LTD.Inventors: Ruiyuan Ye, Xiaolin Tang, Liang Chen, Zhijun Ji, Chang Liu, Chun Yang, Xiaonan Liu, Jing Xu
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Patent number: 11952999Abstract: A plunger pump base and a plunger pump device. The plunger pump base includes a support assembly and an extension assembly. The support assembly includes a top plate, a bottom plate and a support frame, the top plate and the bottom plate are oppositely arranged at an interval, and the support frame is respectively fixed with the top plate and the bottom plate. The extension assembly includes an extension block, a first telescopic mechanism and a second telescopic mechanism. One end of the first telescopic mechanism is rotatably connected to the extension block, the other end of the first telescopic mechanism is rotatably connected to the top plate. One end of the second telescopic mechanism is rotatably connected to the extension block, and the other end of the second telescopic mechanism is rotatably connected to the bottom plate.Type: GrantFiled: June 28, 2021Date of Patent: April 9, 2024Assignee: Yantai Jereh Petroleum Equipment & Technologies Co., Ltd.Inventors: Peng Zhang, Rikui Zhang, Xiaolei Ji, Chunqiang Lan, Sheng Chang, Liang Lv, Xincheng Li, Lintao Song, Weiqiang Liu
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Patent number: 11951618Abstract: A multi-procedure integrated automatic production line for hard alloy blades under robot control is provided. The production line includes a rail-guided robot. A cutter passivation device and a blade cleaning and drying device are arranged on one side of the rail-guided robot. A blade-coating transfer table, a blade coating device, a blade boxing transfer table, a blade-tooling dismounting device and a blade boxing device are sequentially arranged on another side of the rail-guided robot. The blade-tooling dismounting device is arranged on one side of the blade boxing transfer table. The production line further includes squirrel-cage toolings for carrying the blades. The squirrel-cage tooling that are loaded with the blades can run among the cutter passivation device, the blade cleaning and drying device, the blade-coating transfer table and the blade boxing transfer table. The blades after being treated through the blade-tooling dismounting device are sent to the blade boxing device.Type: GrantFiled: August 17, 2021Date of Patent: April 9, 2024Assignees: Qingdao University of Technology, Ningbo Sanhan Alloy Material Co., Ltd.Inventors: Changhe Li, Teng Gao, Liang Luo, Lizhi Tang, Yanbin Zhang, Weixi Ji, Binhui Wan, Shuo Yin, Huajun Cao, Bingheng Lu, Xin Cui, Mingzheng Liu, Jie Xu, Huiming Luo, Haizhou Xu, Min Yang, Huaping Hong, Yuying Yang, Haogang Li, Wuxing Ma, Shuai Chen
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Patent number: 11935852Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive pad, a second insulation layer and a conductive trace. The first insulation layer is formed on the substrate and having a first through hole. The conductive pad is formed on the substrate through the first through hole. The second insulation layer has a first surface and a second through hole, wherein the second through hole extends to the conductive pad from the first surface. The conductive trace has a second surface and is connected to the conductive pad through the second through hole. The entire of the first surface is in the same level, and the entire of the second surface is in the same level.Type: GrantFiled: January 21, 2022Date of Patent: March 19, 2024Assignee: MEDIATEK INC.Inventor: Yan-Liang Ji
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Publication number: 20240076493Abstract: A composition including particular amounts of a polyetherimide or a poly(arylene ether sulfone) and an inorganic filler is described herein. Molded samples of the composition can exhibit an advantageous combination of properties, and the composition can be used in various articles. Methods of making the composition are also described.Type: ApplicationFiled: November 23, 2021Publication date: March 7, 2024Inventors: Weiyun JI, Zheng WANG, Liang SHEN, Siguang JIANG, Gabrie HOOGLAND, Hariharan RAMALINGAM
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Publication number: 20240072044Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a gate strip, a source doped region and a body doped region. The substrate has an active region. The gate strip is disposed on the substrate within the active region. The gate strip extends along a first direction. The source doped region is located in the active region and adjacent to a first side of the gate strip along the first direction. The body doped region is located in the active region and adjacent to the first side of the gate strip. The body doped region and the source doped region have opposite conductivity types. The body doped region has a first length along a second direction that is different from the first direction, wherein the first length gradually changes along the first direction.Type: ApplicationFiled: July 26, 2023Publication date: February 29, 2024Inventors: Cheng-Hua LIN, Yan-Liang JI
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Patent number: 11883092Abstract: The present invention provides a catheter apparatus with a carrier comprising right-handed wire helixes and left-handed wire helixes that are plainly or bi-axially woven into a tubular structure. A therapeutic assembly wraps around one of the wire helixes to stabilize an associated interstice of the tubular structure. The regular shape of the carrier may be quickly recovered after the carrier is seriously bent or distorted in an intravascular treatment.Type: GrantFiled: December 12, 2018Date of Patent: January 30, 2024Assignee: Shanghai Golden Leaf Medtech Co., Ltd.Inventors: Yonghua Dong, Meijun Shen, Liang Ji
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Patent number: 11854924Abstract: A semiconductor device includes a semiconductor die having an active surface, an opposite surface, a vertical sidewall extending between the active surface and the opposite surface, and input/output (I/O) connections disposed on the active surface. A redistribution layer (RDL) is disposed on the active surface of the semiconductor die. A plurality of first connecting elements is disposed on the RDL. A molding compound encapsulates the opposite surface and the vertical sidewall of the semiconductor die. The molding compound also covers the RDL and surrounds the plurality of first connecting elements. An interconnect substrate is mounted on the plurality of first connecting elements and on the molding compound.Type: GrantFiled: October 27, 2021Date of Patent: December 26, 2023Assignee: MEDIATEK INC.Inventors: Tien-Chang Chang, Yan-Liang Ji
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Patent number: 11840676Abstract: A lubricant composition with improved stability and tolerance for water hardness comprises a synthetic wax emulsion; an amine derivative; an emulsifier; and a sequestrant. The synthetic wax emulsion may include poly(ethyleneoxide)-based or poly(propyleneoxide)-based wax emulsions. The amine derivative may include alkyl C12-C14 oxy propyl diamine. The lubricant composition can be used for lubricating the passage of a container along a conveyor. The method includes applying the lubricant composition to at least a part of the container or the conveyor in an application cycle, where the application cycle includes a first period of time of dispensing the lubricant composition and a second period of time of not dispensing the lubricant composition.Type: GrantFiled: August 17, 2022Date of Patent: December 12, 2023Assignee: ECOLAB USA INC.Inventors: Wei Ke, Liang Ji, Yubao Liu
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Publication number: 20230261483Abstract: A power supplying system for supplying power in an electronic device includes a plurality of rechargeable batteries coupled to a functional block of the electronic device. The rechargeable batteries at least include a first battery and a second batter. In a normal mode, the first battery and the second battery are connected in parallel between a system voltage supplying node and a ground node, and in a charging mode, the first battery and the second battery are connected in serial between a charge input node and the ground node.Type: ApplicationFiled: January 12, 2023Publication date: August 17, 2023Applicant: MEDIATEK INC.Inventor: Yan-Liang Ji
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Publication number: 20230260976Abstract: A semiconductor device includes a semiconductor component and a silicon-based passive component. The silicon-based passive component is stacked on the semiconductor component in a thickness direction of the semiconductor component.Type: ApplicationFiled: January 10, 2023Publication date: August 17, 2023Inventor: Yan-Liang JI
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Publication number: 20230261484Abstract: A power supplying system for supplying power in an electronic device includes rechargeable batteries coupled to a functional block of the electronic device. The rechargeable batteries include a first battery and a second battery. In a normal mode, the first battery and the second battery are connected in parallel between a system voltage supplying node and a ground node, in a first state of a charging mode, the first battery and the second battery are connected in serial between a charge input node and the ground node with a first terminal of the second battery being connected to the system voltage supplying node, and in a second state of the charging mode, the first battery and the second battery are connected in serial between the charge input node and the ground node with a first terminal of the first battery being connected to the system voltage supplying node.Type: ApplicationFiled: January 12, 2023Publication date: August 17, 2023Applicant: MEDIATEK INC.Inventor: Yan-Liang Ji
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Patent number: 11705514Abstract: A MOS transistor structure is provided. The MOS transistor structure includes a semiconductor substrate having an active area including a first edge and a second edge opposite thereto. A gate layer is disposed on the active area of the semiconductor substrate and has a first edge extending across the first and second edges of the active area. A source region having a first conductivity type is in the active area at a side of the first edge of the gate layer and between the first and second edges of the active area. First and second heavily doped regions of a second conductivity type are in the active area adjacent to the first and second edges thereof, respectively, and spaced apart from each other by the source region.Type: GrantFiled: April 26, 2016Date of Patent: July 18, 2023Assignee: MediaTek Inc.Inventors: Cheng Hua Lin, Yan-Liang Ji
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Publication number: 20230092907Abstract: A lubricant composition with improved stability and tolerance for water hardness comprises a synthetic wax emulsion; an amine derivative; an emulsifier; and a sequestrant. The synthetic wax emulsion may include poly(ethyleneoxide)-based or poly(propyleneoxide)-based wax emulsions. The amine derivative may include alkyl C12-C14 oxy propyl diamine. The lubricant composition can be used for lubricating the passage of a container along a conveyor. The method includes applying the lubricant composition to at least a part of the container or the conveyor in an application cycle, where the application cycle includes a first period of time of dispensing the lubricant composition and a second period of time of not dispensing the lubricant composition.Type: ApplicationFiled: August 17, 2022Publication date: March 23, 2023Inventors: Wei Ke, Liang Ji, Yubao Liu
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Publication number: 20220384608Abstract: A semiconductor device includes a semiconductor substrate having a well region and a gate structure formed over the well region of the semiconductor substrate. The semiconductor device also includes a gate spacer structure having a first spacer portion and a second spacer portion on opposite sidewalls of the gate structure. The semiconductor device also includes a source region and a drain region formed in the semiconductor substrate. The source region and a drain region are separated from the gate structure. The source region is adjacent to the first spacer portion of the gate spacer structure, and the drain region is adjacent to the second spacer portion of the gate spacer structure. The bottom width of the second spacer portion is greater than the bottom width of the first spacer portion.Type: ApplicationFiled: May 3, 2022Publication date: December 1, 2022Inventors: Cheng-Hua LIN, Yan-Liang JI, Ching-Han JAN
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Publication number: 20220328435Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive via and a conductive trace. The substrate includes a conductive component. The first insulation layer is formed on the substrate and having a first through hole exposing the conductive component. The conductive via is formed within the first through hole. The conductive trace is directly connected to the conductive via which is located directly above the first through hole.Type: ApplicationFiled: March 7, 2022Publication date: October 13, 2022Inventor: Yan-Liang JI
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Publication number: 20220328433Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive pad, a second insulation layer and a conductive trace. The first insulation layer is formed on the substrate and having a first through hole. The conductive pad is formed on the substrate through the first through hole. The second insulation layer has a first surface and a second through hole, wherein the second through hole extends to the conductive pad from the first surface. The conductive trace has a second surface and is connected to the conductive pad through the second through hole. The entire of the first surface is in the same level, and the entire of the second surface is in the same level.Type: ApplicationFiled: January 21, 2022Publication date: October 13, 2022Inventor: Yan-Liang JI
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Patent number: 11447712Abstract: A lubricant composition with improved stability and tolerance for water hardness comprises a synthetic wax emulsion; an amine derivative; an emulsifier; and a sequestrant. The synthetic wax emulsion may include poly(ethyleneoxide)-based or poly(propyleneoxide)-based wax emulsions. The amine derivative may include alkyl C12-C14 oxy propyl diamine. The lubricant composition can be used for lubricating the passage of a container along a conveyor. The method includes applying the lubricant composition to at least a part of the container or the conveyor in an application cycle, where the application cycle includes a first period of time of dispensing the lubricant composition and a second period of time of not dispensing the lubricant composition.Type: GrantFiled: January 20, 2021Date of Patent: September 20, 2022Assignee: ECOLAB USA INC.Inventors: Wei Ke, Liang Ji, Yubao Liu
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Publication number: 20220238712Abstract: A semiconductor device includes a semiconductor substrate having a well region and a gate structure formed over the well region of the semiconductor substrate. The gate structure has a first sidewall and a second sidewall. The second sidewall is opposite the first sidewall. The semiconductor device also includes a gate spacer structure having two asymmetrical portions. One of the asymmetrical portions is formed on the first sidewall of the gate structure, and the other asymmetrical portion is formed on the second sidewall of the gate structure. The semiconductor device includes a source region and a drain region formed in the semiconductor substrate and aligned with the outer edges of the asymmetrical portions of the gate spacer structure. In some embodiments, the lateral distance between the drain region and the gate structure is greater than the lateral distance between the source region and the gate structure.Type: ApplicationFiled: December 23, 2021Publication date: July 28, 2022Inventors: Cheng-Hua LIN, Yan-Liang JI, Ching-Han JAN
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Publication number: 20220181228Abstract: A semiconductor device includes a semiconductor die having an active surface, an opposite surface, a vertical sidewall extending between the active surface and the opposite surface, and input/output (I/O) connections disposed on the active surface. A redistribution layer (RDL) is disposed on the active surface of the semiconductor die. A plurality of first connecting elements is disposed on the RDL. A molding compound encapsulates the opposite surface and the vertical sidewall of the semiconductor die. The molding compound also covers the RDL and surrounds the plurality of first connecting elements. An interconnect substrate is mounted on the plurality of first connecting elements and on the molding compound.Type: ApplicationFiled: October 27, 2021Publication date: June 9, 2022Applicant: MEDIATEK INC.Inventors: Tien-Chang Chang, Yan-Liang Ji