Abstract: A semiconductor structure includes a glass substrate and a device structure. The glass substrate includes a glass layer, a heat dissipation layer and a silicon nitride layer stacked from bottom to top. The device structure includes at least one semiconductor device integrated in a device layer situated over the silicon nitride layer of the glass substrate. Or, the glass substrate includes a glass layer and a silicon nitride layer stacked from bottom to top. The device structure includes at least one semiconductor device integrated in a device layer, and a heat dissipation layer is stacked on the device layer, wherein the heat dissipation layer is bonded with the silicon nitride layer of the glass substrate. The present invention also provides a method of wafer bonding for manufacturing said semiconductor structure.

Abstract: Various embodiments include a graphical programming method comprising: in a first interface, displaying a programming flowchart matching a target task, with at least two function blocks, and using the first interface to configure the function blocks and an execution logic between the function blocks; determining a first and a second function block from the programming flowchart, wherein the first function block is used for obtaining two pieces of information to be processed, and the second function block is used for obtaining information processing results corresponding to the first information; and configuring a control between the first function block and the second function block, used for determining a current information processing result according to the first information currently detected from the first function block and transmitting the current processing result to the second function block.

Abstract: Various embodiments include a method for automatic programming. The method may include: receiving a user's request to create a first global parameter of a specific type by detecting the user's dragging a control corresponding to the specific type from a first user interface and dropping the control on a second user interface; displaying a first popup window for editing the first global parameter on the second user interface; receiving the user's editing operations on the first global parameter in the first popup window; creating the first global parameter according to the user's editing operations; and displaying a new added first card of the first global parameter in a list of global parameters on a third user interface.

Abstract: Disclosed herein are processes for synthesizing 2-hydroxy-6-((2-(1-isopropyl-1H-pyrazol-5-yl)-pyridin-3-yl)methoxy)benzaldehyde (also referred to herein as Compound (I)) and intermediates used in such processes. Compound (I) binds to hemoglobin and increases its oxygen affinity and hence can be useful for the treatment of diseases such as sickle cell disease.

Abstract: A nail drive method applied in an electric nail gun, in which a rotary actuator is driven to generate forward rotational kinetic energy for nailing. The rotary actuator has paired wire bundles and magnetic lines arranged in circumferential directions. The nail drive method comprises boosting a pre-loaded voltage of a battery to generate a peak voltage, and storing the electric charge generated by the peak voltage, and then releasing the peak voltage and its electric charge to the rotary actuator through a nailing signal, so that the wire bundles can generate a current to interact with the magnetic lines to generate a tangential force, so that the magnetic lines can drive the rotor to rotate for a specific angle, and the rotary actuator can directly generate a forward rotational kinetic energy for nailing. Thus, the energy conversion structure installed in the conventional electric nail gun can be omitted.

Abstract: A semiconductor structure includes a glass substrate and a device wafer. The glass substrate includes a glass layer, a heat dissipation layer and a silicon nitride layer stacked from bottom to top. The device wafer includes at least one semiconductor device integrated in a device layer situated over the silicon nitride layer of the glass substrate. Or, the glass substrate includes a glass layer and a silicon nitride layer stacked from bottom to top. The device wafer includes at least one semiconductor device integrated in a device layer, and a heat dissipation layer is stacked on the device layer, wherein the heat dissipation layer is bonded with the silicon nitride layer of the glass substrate. The present invention also provides a method of wafer bonding for manufacturing said semiconductor structure.

Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.

Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.

Abstract: A nail drive device of electric nail gun includes a nailing rod and a rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator includes a stator and a rotor surrounding it, between the stator and the rotor, even groups of electro-magnetic mutual action components are configured in pairs, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by the specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified.

Abstract: An air-path structure of pneumatic a nail gun, formed inside a gun body containing high-pressure air, comprises a main air chamber, a firing valve air chamber and a time-delayed air chamber that continuously releases the high-pressure air to the atmosphere. The gun body is configured with a trigger valve and a slider valve. The inside of the trigger valve is formed with a safety-on air chamber and a safety-off air chamber. The trigger valve controls the high-pressure air inside the firing valve air chamber to be discharged to the atmosphere. The slider valve controls the high-pressure air inside the main air chamber flowing toward the firing valve air chamber, the time-delayed air chamber and the safety-off air chamber. Specifically, the safety-on air chamber is constantly communicated with the main air chamber and constantly contains high-pressure air, and the slider valve can control the high-pressure air inside the safety-off air chamber flowing into the time-delayed air chamber.

Abstract: Various embodiments of the teachings herein include a method for controlling a robot with a tool carried along a path with preset positions and preset directions at a plurality of points. The method may include: at a plurality of points, controlling the robot according to a preset angle of each joint of a plurality of joints; obtaining an actual position and an actual direction of the tool at the points while the robot carries the tool along the path according to the preset angles; determining an actual movement parameter of the robot at a point based on the actual positions and the actual directions; determining an adjusted angle of each joint at each point based on the actual movement parameter so the positions and the directions are consistent with the preset positions and the preset directions at the plurality of points; and controlling the robot to move the tool along the path according to the adjusted angles.

Abstract: A telescopic slide rail support pulley structure includes a first rail provided with multiple mounting holes and a first rolling carriage, a second rail include notch, a positioning hole and a second rolling carriage, a support pulley assembly provided with an upper roller, a lower roller, a support holder and a connecting portion, and a third rail. The connecting portion of the support pulley assembly is mounted to the notch of the second rail. The support pulley assembly also has an upper roller groove and a lower roller groove. The upper roller is arranged in the upper roller groove. The lower roller is arranged in the lower roller groove. The third rail is connected to the second rail through the second rolling carriage. The second rail is connected to the first rail through the first rolling carriage.

Abstract: An ultrasonic ranging device includes an ultrasonic transmitter, an ultrasonic transmitting/receiving circuit, and a controller. The ultrasonic transmitter includes transmitting channels arranged in a ring. Each of the transmitting channels transmits a first ultrasonic wave. The first ultrasonic wave is reflected by a target object, the reflection of the first ultrasonic wave is defined as a second ultrasonic wave. Each of the transmitting channels receives the second ultrasonic wave. The ultrasonic transmitting/receiving channel controls the ultrasonic transmitter to transmit the first ultrasonic wave or receive the second ultrasonic wave by switching between working modes. The controller obtains a distance to the target object according to a transmitting time of the first ultrasonic wave and a receiving time of the second ultrasonic wave.

Abstract: Disclosed herein are processes for synthesizing 2-hydroxy-6-((2-(1-isopropyl-1H-pyrazol-5-yl)-pyridin-3-yl)methoxy)benzaldehyde (also referred to herein as Compound (I)) and intermediates used in such processes. Compound (I) binds to hemoglobin and increases its oxygen affinity and hence can be useful for the treatment of diseases such as sickle cell disease.