Abstract: A photovoltaic device includes: a back electrode; a transparent front electrode; a p-type semiconductor layer disposed between the transparent front electrode and the back electrode and made from a first semiconductor compound including M1, M2, and A1, the p-type semiconductor layer having a M1/M2 atomic ratio; and an n-type layered structure disposed between the p-type semiconductor layer and the transparent front electrode and cooperating with the p-type semiconductor layer to form a p-n junction therebetween. The n-type layered structure includes an n-type semiconductor layer made from a second semiconductor compound including M3, M4, and A2 and having a M3/M4 atomic ratio less than the M1/M2 atomic ratio and greater than 0.1 and less than 0.9.

Abstract: A method for making a chalcopyrite-type compound includes reacting a reaction mixture in a solvent under reflux condition to form the chalcopyrite-type compound. The reaction mixture includes at least one first compound and at least one second compound. The first compound contains M1 and A. The second compound contains M2 and A. M1 is selected from Cu, Au, Ag, Na, Li and K, M2 is selected from In, Ga, Al, Ti, Zn, Cd, Sn, Mg, and combinations thereof, and A is selected from S, Se, Te, and combinations thereof.

Abstract: A method for making a chalcopyrite-type compound includes: reacting a reaction mixture in a first solvent under reflux condition to form the chalcopyrite-type compound containing M1, M2, and A, in which M1 is selected from Cu, Au, Ag, Na, Li, and K, M2 is selected from In, Ga, Al, Ti, Zn, Cd, Sn, Mg, and combinations thereof, and A is selected from S, Se, Te, and combinations thereof; filtering the reaction mixture to obtain a crude cake; mixing the crude cake with a second solvent and a powder of a post-treatment material selected from S, Se, Te, and combinations thereof; and heating the mixture under reflux condition.

Abstract: A method for making a chalcopyrite-type compound includes reacting a reaction mixture in a solvent under reflux condition to form the chalcopyrite-type compound. The reaction mixture includes at least one first compound and at least one second compound. The first compound contains M1 and A. The second compound contains M2 and A. M1 is selected from Cu, Au, Ag, Na, Li and K, M2 is selected from In, Ga, Al, Ti, Zn, Cd, Sn, Mg, and combinations thereof, and A is selected from S, Se, Te, and combinations thereof.

Abstract: A method for making a chalcopyrite-type compound includes: reacting a reaction mixture in a first solvent under reflux condition to form the chalcopyrite-type compound containing M1, M2, and A, in which M1 is selected from Cu, Au, Ag, Na, Li, and K, M2 is selected from In, Ga, Al, Ti, Zn, Cd, Sn, Mg, and combinations thereof, and A is selected from S, Se, Te, and combinations thereof; filtering the reaction mixture to obtain a crude cake; mixing the crude cake with a second solvent and a powder of a post-treatment material selected from S, Se, Te, and combinations thereof; and heating the mixture under reflux condition.

Abstract: A process for producing carboxylic acid anhydrides by the carbonylation reaction of a carboxylic acid ester, derived from an alcohol and a carboxylic acid, with carbon monoxide containing a small amount of hydrogen in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, the carboxylic acid anhydride, the carboxylic acid, and at least one ionic liquid consisting of a cation and an anion where the cation of the ionic liquid has a nitrogen-containing heterocyclic structure. The ionic liquid has at least one of the following structural forms: The reaction rate of the carbonylation reaction is increased by the use of the specified ionic liquid promoters.

Abstract: A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

Abstract: A battery cover assembly includes a battery cover (20), a housing (10), and a locking member (30). The battery cover has a receiving hole (16) defined therein. The receiving hole is located proximate one end of the battery cover. The housing has a locking groove (184) defined in one end thereof. The locking member has an operating portion (32) and a latching tab (34). The operating portion is rotatably mounted in the receiving hole of the battery cover. The latching tab extends from one side of the operating portion. The latching tab is configured so as to be releasably lockable in the locking groove of the housing.

Abstract: A card socket assembly includes a base, two latching mechanisms, and an elastic member. The base includes a mounting surface. The two latching mechanisms are oppositely fastened to the mounting surface. The two latching mechanisms and the mounting surface cooperatively enclose a card slot, used to receive a data card therein. The elastic member is disposed adjacent to the card slot and exposed within the card slot. The elastic member elastically biases the data card against the latching mechanisms.

Abstract: A process for producing carboxylic acid anhydrides by the carbonylation reaction of a carboxylic acid ester, derived from an alcohol and a carboxylic acid, with carbon monoxide containing a small amount of hydrogen in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, the carboxylic acid anhydride, the carboxylic acid, and at least one ionic liquid consisting of a cation and an anion where the cation of the ionic liquid has a nitrogen-containing heterocyclic structure. The ionic liquid has at least one of the following structural forms: The reaction rate of the carbonylation reaction is increased by the use of the specified ionic liquid promoters.

Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

Abstract: A card socket assembly includes a base, two latching mechanisms, and an elastic member. The base includes a mounting surface. The two latching mechanisms are oppositely fastened to the mounting surface. The two latching mechanisms and the mounting surface cooperatively enclose a card slot, used to receive a data card therein. The elastic member is disposed adjacent to the card slot and exposed within the card slot. The elastic member elastically biases the data card against the latching mechanisms.

Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Abstract: A hinge assembly (200) includes a button (3), a retaining member (4), a fixing seat (5), a control member (6), a first spring (7), a follower (10), a cam (30), a second spring (9) and a shaft (20). The button has at least one pushing portion (31). The control member has at least one receiving groove (61), and the pushing portion is received in each receiving groove. Each pushing portion resists the control member. The first spring provides an elastic force to the control member. The cam includes a cam hole having an inner screw thread (342). The second spring provides an elastic force to make the cam and the follower resist each other. The shaft defines an outer screw thread (233). The outer screw thread engages with the inner screw thread of the cam.

Abstract: A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

Abstract: A screw cap for covering a head of a screw in a screw hole (20) of a housing (2) of a portable electronic device. The screw hole includes a wide upper portion (202) and a narrow lower portion (204). The screw cap includes a main body (12) and an elastic ring (14). The main body includes a wide head (122) and an adjoining narrow cylindrical body (124). An upper first groove (1242) and a lower second groove (1243) are defined in the cylindrical body. The first groove is deeper than the second groove. When the elastic ring is engaged in the second groove, the screw cap can be interferentially engaged in the screw hole. When the screw cap is pushed so that the elastic ring is engaged in the first groove, the screw cap can be easily removed from the screw hole.

Abstract: The present invention relates to a process for producing carboxylic acid anhydrides, in which a carboxylic acid ester, derived from an alcohol and a carboxylic acid, and carbon monoxide containing a small amount of hydrogen are used as raw materials and subjected to a carbonylation reaction in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, at least one organic promoter, the carboxylic acid anhydride and the carboxylic acid, wherein the organic promoter is selected from at least one of the following structural forms (I), (II) and (III). According to the process of the present invention, the reaction rate of the carbonylation reaction is increased by the use of the specified organic promoters.

Abstract: The present invention relates to a process for producing carboxylic acid anhydrides, in which a carboxylic acid ester, derived from an alcohol and a carboxylic acid, and carbon monoxide containing a small amount of hydrogen are used as raw materials and subjected to a carbonylation reaction in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, at least one organic promoter, the carboxylic acid anhydride and the carboxylic acid, wherein the organic promoter is selected from at least one of the following structural forms (I), (II) and (III). According to the process of the present invention, the reaction rate of the carbonylation reaction is increased by the use of the specified organic promoters.

Abstract: A hinge mechanism (20) includes a mounting member (12), at least one retractable elastic shaft (14) and a rotating member (18). The retractable elastic shaft has two opposite ends. The mounting member is located at one end of the retractable elastic shaft and defines at least one first hollow (125). The rotating member is located at the other end of the retractable elastic shaft and defines at least one second hollow (187). The first and second hollows respectively receive two ends of the retractable elastic shaft. The mounting member is rotatable relative to the rotating member to drive the retractable elastic shaft to move between a first position where the retractable elastic shaft is slantwise to an axis of the rotating member and a second position where the retractable elastic shaft is parallel to the axis of the rotating member. The hinge mechanism is easy to be manufactured.