Patents by Inventor Liang Wang

Liang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10671679
    Abstract: Method, system, and programs for providing content recommendation are disclosed. A first set of candidate content items may be generated based on a user profile, and a second set of candidate items may be generated based on the likelihood that the user will click a corresponding candidate content item in the second set. The candidate content items in the first and second sets may be ranked together using a learning model and presented to the user as content recommendations based on their rankings. The likelihood that the user will click a given candidate content item in the second set may be estimated based on similarities between the given content item and content items related to the given content item. Such a similarity may be computed based on activities performed by users who have viewed both the given content item and a related content item.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: June 2, 2020
    Assignee: Oath Inc.
    Inventors: Chunming Wang, Jian Xu, Liang Wang, Yu Zou, Hao Zheng
  • Publication number: 20200167554
    Abstract: This application provides a gesture recognition method, and relates to the field of man-machine interaction technologies. The method includes: extracting M images from a first video segment in a video stream; performing gesture recognition on the M images by using a deep learning algorithm, to obtain a gesture recognition result corresponding to the first video segment; and performing result combination on gesture recognition results of N consecutive video segments including the first video segment, to obtain a combined gesture recognition result. In the foregoing recognition process, a gesture in the video stream does not need to be segmented or tracked, but phase actions are recognized by using a deep learning algorithm with a relatively fast calculation speed, and then the phase actions are combined, so as to improve a gesture recognition speed, and reduce a gesture recognition delay.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Liang WANG, Songcen XU, Chuanjian LIU, Jun HE
  • Patent number: 10666676
    Abstract: Targeted email attacks are detected using feature combinations of known abnormal emails, interflow shapes formed by an email with other emails, or both. An email received in an endpoint computer system is scanned to identify abnormal features indicative of a targeted email attack and the abnormal features of the email are checked against abnormal feature combinations. The email can also be scanned to identify an interflow shape formed by the email with other emails and the interflow shape is checked against interflow shapes of known targeted email attacks.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 26, 2020
    Assignee: Trend Micro Incorporated
    Inventors: Ching-Cheng Hsu, Hsun-Jen Hsu, I-Ting Lien, Cheng-Han Lin, Ching-Ming Lin, Yin-Liang Wang, Cheng-Han Wu
  • Publication number: 20200155978
    Abstract: A water purifying filter cartridge structure includes: a filter cartridge main body and a filter cartridge bottom seat. The filter cartridge main body includes: a filter barrel, a filter barrel cover, a filter body, a filter chamber, and a back flow check component. The filter barrel cover is disposed on a top portion of the filter barrel. The filter body is adapted to remove impurities from water. The filter chamber is disposed in the filter barrel, and the back flow check component is disposed in the filter barrel. The back flow check component includes a first back flow check piece, a second back flow check piece, and a third back flow check piece. The first back flow check piece and the second back flow check piece are adapted to prevent back flow at the water input end.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 21, 2020
    Inventors: FENG-SHUN ZHAN, DE-LIANG WANG, JIAN-YONG YAN
  • Patent number: 10657244
    Abstract: Embodiments of the present disclosure disclose an identity authentication method performed at a computing device, the method including: obtaining a sequence of finger gestures on a touchpad of the computing device from a user, wherein each finger gesture has an associated pressure type on the touchpad; generating a corresponding character string according to the sequence of finger gestures; comparing the character string with a verification code of a user account associated with an application program; in accordance with a determination that the character string matches the verification code, granting the user access to the user account associated with the application program; and in accordance with a determination that the character string does not match the verification code, denying the user access to the user account associated with the application program.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: May 19, 2020
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Xia Yang, Luyi Lin, Yunyun Hao, Yifeng Li, Shaoyu Zhang, Liang Wang, Jiwei Guo
  • Patent number: 10658313
    Abstract: Representative implementations of techniques and devices are used to remedy or mitigate the effects of damaged interconnect pads of bonded substrates. A recess of predetermined size and shape is formed in the surface of a second substrate of the bonded substrates, at a location that is aligned with the damaged interconnect pad on the first substrate. The recess encloses the damage or surface variance of the pad, when the first and second substrates are bonded.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 19, 2020
    Assignee: Invensas Bonding Technologies, Inc.
    Inventors: Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi
  • Patent number: 10647700
    Abstract: An inhibitor of a wild type and Y641F mutant of human histone methyltransferase EZH2 is provided herein. Particularly, the inhibitor is a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. The inhibitor can be used to treat a cancer or precancerous condition related to EZH2 activity.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: May 12, 2020
    Assignee: TARAPEUTICS SCIENCE INC.
    Inventors: Qingsong Liu, Jing Liu, Fengchao Lv, Chen Hu, Wen Liang Wang, Ao Li Wang, Zi Ping Qi, Xiao Fei Liang, Wen Chao Wang, Tao Ren, Bei Lei Wang, Li Wang
  • Publication number: 20200140267
    Abstract: Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
    Type: Application
    Filed: November 8, 2019
    Publication date: May 7, 2020
    Inventors: Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
  • Publication number: 20200140268
    Abstract: Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
    Type: Application
    Filed: November 8, 2019
    Publication date: May 7, 2020
    Inventors: Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
  • Publication number: 20200144217
    Abstract: A bonded structure can include a first element having a first interface feature and a second element having a second interface feature. The first interface feature can be bonded to the second interface feature to define an interface structure. A conductive trace can be disposed in or on the second element. A bond pad can be provided at an upper surface of the first element and in electrical communication with the conductive trace. An integrated device can be coupled to or formed with the first element or the second element.
    Type: Application
    Filed: December 20, 2019
    Publication date: May 7, 2020
    Inventors: Paul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. DeLaCruz, Arkalgud R. Sitaram
  • Patent number: 10635490
    Abstract: An aspect includes optimizing an application workflow. The optimizing includes characterizing the application workflow by determining at least one baseline metric related to an operational control knob of an embedded system processor. The application workflow performs a real-time computational task encountered by at least one mobile embedded system of a wirelessly connected cluster of systems supported by a server system. The optimizing of the application workflow further includes performing an optimization operation on the at least one baseline metric of the application workflow while satisfying at least one runtime constraint. An annotated workflow that is the result of performing the optimization operation is output.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ramon Bertran Monfort, Pradip Bose, Alper Buyuktosunoglu, Chen-Yong Cher, Hans M. Jacobson, William J. Song, Karthik V. Swaminathan, Augusto J. Vega, Liang Wang
  • Publication number: 20200126945
    Abstract: A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Liang Wang, Rajesh Katkar, Javier A. DeLaCruz, Arkalgud R. Sitaram
  • Publication number: 20200126861
    Abstract: A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Inventors: Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram
  • Patent number: 10629577
    Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 21, 2020
    Assignee: Invensas Corporation
    Inventors: Min Tao, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh
  • Publication number: 20200115875
    Abstract: A method for an ex-situ carbonization and solidification of silt soil using an active magnesium oxide, pertaining to the field of civil and hydraulic engineering. The method includes the steps of silt pretreatment, homomixing of solidifying agents, silt granulation, carbonization by carbon dioxide, exhaust gas/waste liquid collection, and resource utilization. In the method, the supply amount of the solidifying agent is adjusted through the actual measurement of the moisture content, and the granule size and carbon dioxide pressure are adjusted according to the soil properties. Therefore, a full mixing of the silt with the solidifying agents and a rapid carbonization of the magnesium oxide solidified silt granules can be achieved. Moreover, the dust and carbon dioxide can be absorbed during the operation, thereby avoiding secondary pollution. The silt carbonized granules can be used as filling materials for roadbeds, airport runways, engineering backfills, etc.
    Type: Application
    Filed: December 26, 2017
    Publication date: April 16, 2020
    Applicant: SOUTHEAST UNIVERSITY
    Inventors: Songyu LIU, Guanghua CAI, Liang WANG, Chuan QIN
  • Publication number: 20200118973
    Abstract: Apparatuses and methods are described. This apparatus includes a bridge die having first contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted wafer has a wafer surface including a layer surface of the molding layer and the die surface. A redistribution layer on the wafer surface includes electrically conductive and dielectric layers to provide conductive routing and conductors. The conductors extend away from the die surface and are respectively coupled to the first contacts at bottom ends thereof. At least second and third IC dies respectively having second contacts on corresponding die surfaces thereof are interconnected to the bridge die and the redistribution layer. A first portion of the second contacts are interconnected to top ends of the conductors opposite the bottom ends thereof in part for alignment of the at least second and third IC dies to the bridge die.
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Applicant: Invensas Corporation
    Inventors: Liang Wang, Rajesh Katkar
  • Patent number: 10623710
    Abstract: HD color video using monochromatic CMOS image sensors integrated in a 3D package is provided. An example 3DIC package for color video includes a beam splitter to partition received light of an image stream into multiple light outputs. Multiple monochromatic CMOS image sensors are each coupled to one of the multiple light outputs to sense a monochromatic image stream at a respective component wavelength of the received light. Each monochromatic CMOS image sensor is specially constructed, doped, controlled, and tuned to its respective wavelength of light. A parallel processing integrator or interposer chip heterogeneously combines the respective monochromatic image streams into a full-spectrum color video stream, including parallel processing of an infrared or ultraviolet stream. The parallel processing of the monochromatic image streams provides reconstruction to HD or 4K HD color video at low light levels.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: April 14, 2020
    Assignee: Invensas Corporation
    Inventors: Hong Shen, Liang Wang, Guilian Gao, Arkalgud R. Sitaram
  • Publication number: 20200112962
    Abstract: The disclosure provides a user selection method for non-orthogonal multiple access (NOMA) systems and a base station thereof. The method includes: (1) initializing the cluster-partition parameter i to be 2; (2) dividing N user devices into i clusters; (3) selecting a reference device from each of the i clusters to form a reference cluster; (4) performing a power allocation algorithm for the reference cluster to calculate a power allocation factor for each of the reference devices; (5) determining whether each of the reference devices with the calculated power allocation factors meets a set of constraints: if all of the reference devices meet the set of constraints, increasing the value of i by 1 and then going back to step (2); if any one of the reference devices does not meet the set of constraints and i is not equal to 2, performing NOMA transmission for the reference cluster.
    Type: Application
    Filed: October 7, 2019
    Publication date: April 9, 2020
    Applicant: National Tsing Hua University
    Inventors: Chin-Liang Wang, Po-En Wu
  • Patent number: 10614324
    Abstract: The disclosure discloses a method and apparatus for identifying a static obstacle. An embodiment of the method includes: determining, based on determining information corresponding to a historical laser point cloud sequence of an obstacle, a detected laser point cloud of the obstacle in a current laser point cloud frame belonging to the historical laser point cloud sequence of the obstacle, whether a given obstacle is a static obstacle. The determining information includes: a similarity between a historical motion characteristic of the given obstacle and a noise type motion characteristic, a matching degree between an appearance characteristic of the detected laser point cloud of the obstacle and an appearance characteristic of the historical laser point cloud of the obstacle, and an overlap ratio between the detected laser point cloud of the obstacle and the historical laser point cloud of the obstacle.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 7, 2020
    Assignee: Baidu Online Network Technology (Beijing) Co., Ltd.
    Inventors: Ye Zhang, Jun Wang, Xiaohui Li, Liang Wang
  • Patent number: D882708
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 28, 2020
    Inventor: Liang Wang