Abstract: A highly reflective gain type photovoltaic packaging adhesive film and usage are provided. The packaging adhesive film is composed of an packaging layer and a reflecting layer, wherein the packaging layer has a thickness of 200 to 500 ?m, and is made by mixing a first primary resin, a modified auxiliary, an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and melting and coat casting the same at 60° C. to 200° C. to form a film; and the reflecting layer has a thickness of 5 to 200 ?m and is made by mixing a second primary resin, an auxiliary resin, a first filler, a second filler, modified auxiliary, a diluent and an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and coating the same on the surface of the packaging layer and curing the same at 30° C. to 150° C.

Abstract: The accurate determination of the state-of-charge (SOC) of batteries is an important element of battery management. One method to determine SOC is to measure the voltage of the cell and exploiting the correlation between voltage and SOC. For electrodes with sloped charge/discharge profiles, this is a good method. However, for batteries with lithium iron phosphate (LFP) cathodes the charge/discharge profile is flat. Now, by using the materials and methods disclosed herein, an amount of cathode active material that has a sloped charge/discharge profile is mixed with LFP in a cathode, which results in a charge/discharge profile with enough slope that the SOC of the battery can be determined by measuring the voltage alone.

Abstract: A method of segmenting an object from an image includes receiving an input image including an object; generating an output image corresponding to the object from the input image using an image model; and extracting an object image from the output image.

Abstract: A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.

Abstract: Embodiments of the present application relate to a method, apparatus, and system for matching users in connection with a Location-Based Service.

Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

Abstract: In various embodiments, a group photograph system coordinates and creates a group photograph of participants of a video conferencing session. Using inputs from the participants, the group photograph system captures images of individual participants and selectively assembles a group photograph based on the rating of each individual participant. In one embodiment, the group photograph system sends a countdown signal to a first participant and a second participant wherein the first participant and the second participant are part of a group photograph within a video conferencing session wherein the countdown signal represents an amount of time before a first participant image is captured of the first participant. In another embodiment, the group photography system captures the first participant image and a second participant image of the first participant and the second participant, respectively and creates a first group photograph which includes the first participant image and the second participant image.

Abstract: The present invention provides a method for the treatment or prophylaxis of bacterial infections by administering to a subject in need thereof an effective amount of a compound of formula.

Abstract: In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, one or more conductive features (120E.A, 120E.B, or both) are provided above the substrate that wrap around the conductive vias' protrusions (114?) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.

Abstract: A bonded structure can include a first element having a first interface feature and a second element having a second interface feature. The first interface feature can be bonded to the second interface feature to define an interface structure. A conductive trace can be disposed in or on the second element. A bond pad can be provided at an upper surface of the first element and in electrical communication with the conductive trace. An integrated device can be coupled to or formed with the first element or the second element.

Abstract: The present application relates to a metal oxide and synthesis of a lithium ion battery. Specifically, the present application selects a cobalt oxide compound, which uses Co3O4 as a main body, as a precursor of lithium cobalt oxide, and anion doping is performed in particles of Co3O4 to obtain a doped precursor for lithium cobalt oxide. The general formula of the precursor can be expressed as Co3(O1-yMy)4, where about 0<y<about 0.2, and wherein the anion M comprises at least one of F, P, S, Cl, N, As, Se, Br, Te, I or At. The lithium ion battery with a cathode made of lithium cobalt oxide material prepared by using the precursor presents good cycle stability in a high voltage charge-discharge environment.

Abstract: Systems and methods for providing 3D wafer assembly with known-good-dies are provided. An example method compiles an index of dies on a semiconductor wafer and removes the defective dies to provide a wafer with dies that are all operational. Defective dies on multiple wafers may be removed in parallel, and resulting wafers with all good dies stacked in 3D wafer assembly. In an implementation, the spaces left by removed defective dies may be filled at least in part with operational dies or with a fill material. Defective dies may be replaced either before or after wafer-to-wafer assembly to eliminate production of defective stacked devices, or the spaces may be left empty. A bottom device wafer may also have its defective dies removed or replaced, resulting in wafer-to-wafer assembly that provides 3D stacks with no defective dies.

Abstract: Disclosed is a data processing method, comprising: acquiring space information of audio acquisition devices of an acquisition device, an acquisition space corresponding to the acquisition device being formed into a geometry, the spatial orientation deployed by video acquisition devices of the acquisition device covering the entire geometry, and the setting orientation of each video acquisition device being correspondingly provided with N audio acquisition devices, wherein N is a positive integer; regarding the N audio acquisition devices provided corresponding to the setting orientation of each video acquisition device, encoding audio data acquired by the N audio acquisition devices according to the space information of the audio acquisition devices, to form M pieces of audio data, the M pieces of audio data carrying space information of audios. Embodiments of the present invention further provide an acquisition device, a data processing device, and a storage medium.

Abstract: Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

Abstract: An inhibitor of a wild type and Y641 F mutant of human histone methyltransferase EZH2 is provided herein. Particularly, the inhibitor is a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. The inhibitor can be used to treat a cancer or precancerous condition related to EZH2 activity.

Abstract: Apparatus and method relating generally to an LED display is disclosed. In such an apparatus, a driver die has a plurality of driver circuits. A plurality of light-emitting diodes, each having a thickness of 10 microns or less and discrete with respect to one another, are respectively interconnected to the plurality of driver circuits. The plurality of light-emitting diodes includes a first portion for a first color, a second portion for a second color, and a third portion for a third color respectively obtained from a first, a second, and a third optical wafer. The first, the second, and the third color are different from one another.

Abstract: The present teaching generally relates to detecting abnormal user activity associated with an entity. In a non-limiting embodiment, baseline distribution data representing a baseline distribution characterizing normal user activities for an entity may be obtained. Information related to online user activities with respect to the entity may be received, distribution data representation a dynamic distribution may be determined based, at least in part, on the information. One or more measures characterizing a difference between the baseline distribution and the dynamic distribution may be computed, and in real-time it may be assessed whether the information indicates abnormal user activity. If the first information indicates abnormal user activity, then output data including the distribution data and the one or more measures may be generated.

Abstract: In a multi-chip module (MCM), a “super” chip (110N) is attached to multiple “plain” chips (110F? “super” and “plain” chips can be any chips). The super chip is positioned above the wiring board (WB) but below at least some of plain chips (110F). The plain chips overlap the super chip. Further, the plain chips' low speed IOs can be connected to the WB by long direct connections such as bond wires (e.g. BVAs) or solder stacks; such connections can be placed side by side with the super chip. Such connections can be long, so the super chip is not required to be thin. Also, if through-substrate vias (TSVs) are omitted, the manufacturing yield is high and the manufacturing cost is low. Other structures are provided that combine the short and long direct connections to obtain desired physical and electrical properties.

Abstract: Systems and methods are provided that address the need to frequently calibrate analyte sensors, according to implementation. In more detail, systems and methods provide a preconnected analyte sensor system that physically combines an analyte sensor to measurement electronics during the manufacturing phase of the sensor and in some cases in subsequent life phases of the sensor, so as to allow an improved recognition of sensor environment over time to improve subsequent calibration of the sensor.

Abstract: An analyte sensor system may include a first communication circuit configured to transmit a wireless signal in a first communication mode and a second communication mode, and a processor, wherein the processor determines whether a first condition is satisfied, the first condition relating to the sensor signal or to communication by the first communication circuit, and shifts the system to a second communication mode responsive to the first condition being satisfied.