Abstract: A method for determining a motion vector field is provided, comprising: determining an optical flow of a spatial point in a scene according to different frames of images acquired by an image acquisition unit; determining a movement velocity of the spatial point in a coordinate system of the image acquisition unit according to spatial point data; determining a first order derivative of a projection of the spatial point on an image plane according to the spatial point data; and determining a velocity vector of the spatial point according to intrinsic parameters, a rotation matrix in a global coordinate system, a movement velocity, and an angular velocity, of the image acquisition unit, as well as a pose, the optical flow, the movement velocity in the coordinate system of the image acquisition unit, and the first order derivative of the projection on the image plane, of the spatial point.

Abstract: A method and system for simulating a distribution of obstacles are provided. The method includes: acquiring a plurality of point clouds of a plurality of frames, wherein each point cloud includes a plurality of original obstacles; acquiring real labeling data of an acquisition vehicle, and obtaining data of a simulation position of the acquisition vehicle based on the real labeling data and a movement rule of the acquisition vehicle; determining the number of obstacles to be simulated based on the data of the simulation position of the acquisition vehicle; selecting the determined number of obstacles to be simulated, from a range with the simulation position of the acquisition vehicle as a center, wherein the range is less than or equal to a maximum scanning range of the vehicle; and acquiring real labeling data of the selected obstacles, and obtaining a position distribution of the selected obstacles.

Abstract: Embodiments of the present disclosure provide a method and an apparatus for clock synchronization, a device, a storage medium and a vehicle. The method includes: determining a first pose change of an image acquirer with respect to a reference coordinate system at different image acquisition time points; determining a second pose change of a calibration acquirer with respect to the reference coordinate system at different corrected image acquisition time points, in which, the different corrected image acquisition correction time points are determined according to the different image acquisition time points and each predetermined correction time variable; and performing a clock synchronization on the image acquirer and the calibration acquirer according to the first pose change of the image acquirer and the second pose change of the calibration acquirer corresponding to the each correction time variable.

Abstract: Embodiments of the present disclosure provide a ground detection method and apparatus, an electronic device, a vehicle, and a storage medium. The method includes: projecting a laser point cloud obtained to a high resolution mesh and a low resolution mesh respectively; filtering out candidate ground points in the high resolution mesh; and performing ground fitting based on the candidate ground points in the low resolution mesh.

Abstract: Embodiments of the present disclosure provide a method and a device for detecting a precision of an internal parameter of a laser radar, a related apparatus and a medium. The method may include the following steps. Point cloud data collected by the laser radar arranged on an autonomous mobile carrier travelling on a flat road is obtained. A three-dimensional scene reconstruction is performed based on the point cloud data collected to obtain a point cloud model of a three-dimensional scene. The point cloud model of the three-dimensional scene is divided to obtain the road. A thickness of the road is determined based on the point cloud data of the road. It is determined whether the internal parameter of the laser radar is precise based on the thickness of the road.

Abstract: A method, device and a computer-readable storage medium for optimizing simulation data are provided. The method for optimizing simulation data can include: inputting the simulation data generated by a simulator to a first generative adversarial network comprising a migration model; and optimizing the simulation data generated by the simulator with the migration model to generate optimized simulation data. In an embodiment of the present application, the simulation data is optimized by the generative adversarial network to enable the simulation data closer to the real data in representation. Therefore, the quality and accuracy of the simulation data can be ensured, the validity and reliability of the simulation data can be improved at least to some extent, and the cost for constructing the simulator can also be reduced.

Abstract: A device with thermal control is presented. In some embodiments, the device includes a plurality of die positioned in a stack, each die including a chip, interconnects through a thickness of the chip, metal features of electrically conductive composition connected to the interconnects on a bottom side of the chip, and adhesive or underfill layer on the bottom side of the chip. At least one thermally conducting layer, which can be a pyrolytic graphite layer, a layer formed of carbon nanotubes, or a graphene layer, is coupled between a top side of one of the plurality of die and a bottom side of an adjoining die in the stack. A heat sink can be coupled to the thermally conducting layer.

Abstract: An interposer (110) has contact pads at the top and/or bottom surfaces for connection to circuit modules (e.g. ICs 112). The interposer includes a substrate made of multiple layers (110.i). Each layer can be a substrate (110S), possibly a ceramic substrate, with circuitry. The substrates extend vertically. Multiple interposers are fabricated in a single structure (310) made of vertical layers (310.i) corresponding to the interposers' layers. The structure is diced along horizontal planes (314) to provide the interposers. An interposer's vertical conductive lines (similar to through-substrate vias) can be formed on the substrates' surfaces before dicing and before all the substrates are attached to each other. Thus, there is no need to make through-substrate holes for the vertical conductive lines. Non-vertical features can also be formed on the substrates' surfaces before the substrates are attached to each other. Other embodiments are also provided.

Abstract: A method, an apparatus, a device, and a medium for calibrating a posture of a moving obstacle are provided. The method includes: obtaining a 3D map, the 3D map including first static obstacles; selecting a target frame of data, the target frame of data including second static obstacles and one or more moving obstacles; determining posture information of each of the one or more moving obstacles in a coordinate system of the 3D map; registering the target frame of data with the 3D map; determining posture offset information of the target frame of data in the coordinate system according to a registration result; calibrating the posture information of each of the one or more moving obstacles according to the posture offset information; and adding each of the one or more moving obstacles after the calibrating into the 3D map.

Abstract: Structures and techniques provide bond enhancement in microelectronics by trapping contaminants and byproducts during bonding processes, and arresting cracks. Example bonding surfaces are provided with recesses, sinks, traps, or cavities to capture small particles and gaseous byproducts of bonding that would otherwise create detrimental voids between microscale surfaces being joined, and to arrest cracks. Such random voids would compromise bond integrity and electrical conductivity of interconnects being bonded. In example systems, a predesigned recess space or predesigned pattern of recesses placed in the bonding interface captures particles and gases, reducing the formation of random voids, thereby improving and protecting the bond as it forms. The recess space or pattern of recesses may be placed where particles collect on the bonding surface, through example methods of determining where mobilized particles move during bond wave propagation.

Abstract: Embodiments of the present disclosure are directed to a method for generating simulated point cloud data, a device, and a storage medium. The method includes: acquiring at least one frame of point cloud data collected by a road collecting device in an actual environment without a dynamic obstacle as static scene point cloud data; setting, according to set position association information, at least one dynamic obstacle in a coordinate system matching the static scene point cloud data; simulating in the coordinate system, according to the static scene point cloud data, a plurality of simulated scanning lights emitted by a virtual scanner located at an origin of the coordinate system; and updating the static scene point cloud data according to intersections of the plurality of simulated scanning lights and the at least one dynamic obstacle to obtain the simulated point cloud data comprising point cloud data of the dynamic obstacle.

Abstract: Structures and techniques provide bond enhancement in microelectronics by trapping contaminants and byproducts during bonding processes, and arresting cracks. Example bonding surfaces are provided with recesses, sinks, traps, or cavities to capture small particles and gaseous byproducts of bonding that would otherwise create detrimental voids between microscale surfaces being joined, and to arrest cracks. Such random voids would compromise bond integrity and electrical conductivity of interconnects being bonded. In example systems, a predesigned recess space or predesigned pattern of recesses placed in the bonding interface captures particles and gases, reducing the formation of random voids, thereby improving and protecting the bond as it forms. The recess space or pattern of recesses may be placed where particles collect on the bonding surface, through example methods of determining where mobilized particles move during bond wave propagation.

Abstract: The present disclosure provides a method and a device for generating a 3D scene map, a related apparatus and a storage medium. The method includes the following. At least two frames of point cloud data collected by a collection device is obtained. Data registration is performed on the at least two frames of point cloud data. First type of point cloud data corresponding to a movable obstacle is deleted from each frame of point cloud data and each frame of point cloud data is merged to obtain an initial scene map. Second type of point cloud data corresponding to a regularly shaped object is replaced with model data of a geometry model matching with the regularly object for the initial scene map to obtain the 3D scene map.

Abstract: A balancing board may include a first and a second platform section. Each platform section may include a housing formed of a bottom housing member and a top housing member. The top housing members may have a foot placement section or area formed integrally therewith. In one embodiment, the balancing board may include a water jet that includes a water receiving space and a water fog generating unit. More specifically, when the user stands on the balancing board, the weight of the user can trigger the water jet, wherein the water can be transported to the water fog generating unit from the water receiving space and the water fog can then be generated, so there is more entertainment effect when the user stands on the balancing board.

Abstract: A multicast frame directed to a plurality of devices coupled to a network can be received, where the plurality of devices comprising at least one intended recipient device and at least one unintended recipient device. A destination unicast address corresponding to an intended recipient device can be identified. The multicast frame can be converted into a unicast frame directed to the intended recipient device, the unicast frame configured with the destination unicast address. The unicast frame can be blocked from accessing the unintended recipient device. The unicast frame can be provided to the intended recipient device.

Abstract: A flexible self-adaptive composite carbon brush-type electromagnetic composite field synchronous laser cladding device, comprising an electromagnetic field synchronous coupling module that processes a part to be processed, a mechanical arm that drives the electromagnetic field synchronous coupling module to move, and a laser that generates laser; the electromagnetic field synchronous coupling module comprises a laser head, an electric field portion and a magnetic field portion; the magnetic field portion comprises two magnetic field generating modules, and the electric field portion comprises two electric field generating modules, the magnetic field portion and the electric field portion both being fixedly erected at the periphery of the laser head by means of a supporting structure.

Abstract: High performance light emitting diode with vias. In accordance with a first embodiment of the present invention, an article of manufacture includes a light emitting diode. The light emitting diode includes a plurality of filled vias configured to connect a doped region on one side of the light emitting diode to a plurality of contacts on the other side of the light emitting diode. The filled vias may comprise less that 10% of a surface area of the light emitting diode.

Abstract: This application relates to a metal oxide and a method for preparing the same. Specifically, Co3O4 is selected as a precursor of lithium cobalt oxide, and one or more metal elements M are doped in the particles of Co3O4 to obtain a doped lithium cobalt oxide precursor Co3?xMxO4, where 0<x?0.3. The difference value, measured by a spectrometer of a scanning electron microscope, of the weight percentage of one of M in two identical area regions is E, wherein 0<E?1% (wt. %). A lithium ion battery with lithium cobalt oxide prepared from the precursor as a cathode material shows great cycle stability, high-temperature energy storage performance and safety performance in a high-voltage (equal to or greater than 4.45 V) charging and discharging environment.

Abstract: A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.

Abstract: Apparatuses and methods are described. This apparatus includes a bridge die having first contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted wafer has a wafer surface including a layer surface of the molding layer and the die surface. A redistribution layer on the wafer surface includes electrically conductive and dielectric layers to provide conductive routing and conductors. The conductors extend away from the die surface and are respectively coupled to the first contacts at bottom ends thereof. At least second and third IC dies respectively having second contacts on corresponding die surfaces thereof are interconnected to the bridge die and the redistribution layer. A first portion of the second contacts are interconnected to top ends of the conductors opposite the bottom ends thereof in part for alignment of the at least second and third IC dies to the bridge die.