Patents by Inventor Liang Wu

Liang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • Patent number: 11955721
    Abstract: An antenna apparatus, a communication apparatus, and a steering adjustment method thereof are provided. The antenna apparatus includes an antenna structure. The antenna structure includes an antenna unit. The antenna unit includes i feeding ports, where i is a positive integer larger than 2. A vector of each of the feeding ports is controlled independently. In the steering adjustment method, a designated direction is determined, where the designated direction corresponds to beam directionality of the antenna structure. In addition, the vectors of the feeding ports of the antenna unit are configured according to the designated direction. Accordingly, the antenna size can be reduced, and beam steering in multiple directions would be achieved.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: April 9, 2024
    Assignee: Gemtek Technology Co., Ltd.
    Inventors: Chung-Kai Yang, Sin-Liang Chen, Hsu-Sheng Wu, Hsiao-Ching Chien
  • Patent number: 11953972
    Abstract: Selective privileged container augmentation is provided. A target group of edge devices is selected from a plurality of edge devices to run a plurality of child tasks comprising a pending task by mapping edge device tag attributes of the plurality of edge devices to child task tag attributes of the plurality of child tasks. A privileged container corresponding to the pending task is installed in each edge device of the target group to monitor execution of a child task by a given edge device of the target group. A privileged container installation tag that corresponds to the privileged container is added to an edge device tag attribute of each edge device of the target group having the privileged container installed. A child task of the plurality of child tasks comprising the pending task is sent to a selected edge device in the target group to run the child task.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Yue Wang, Xin Peng Liu, Wei Wu, Liang Wang, Biao Chai
  • Patent number: 11956611
    Abstract: A portable electronic device can include a housing at least partially defining an internal volume. The device can include a venting module including a membrane, a porous member, and a support structure. The membrane and porous member can define a fluid path extending a width of the porous member and placing the internal volume in fluid communication with an ambient environment adjacent the housing. The support structure can be coupled to the porous member.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 9, 2024
    Assignee: APPLE INC.
    Inventors: Jiahui Liang, Kahn C. Wu, Stephen L. Frey
  • Patent number: 11952368
    Abstract: Provided are a fibroblast activation protein inhibitor (FAPI) dimer compound, an FAPI dimer-based positron emission tomography (PET) imaging agent for tumor diagnosis, and a preparation method and use thereof. An amphiphilic polyethylene glycol (PEG) chain and a dimerized structure of FAPI in the FAPI dimer compound with a structure shown in formula I can improve the in vivo kinetic properties of the compound and prolong a residence time of the compound in a tumor, thereby improving the uptake and imaging effects in the tumor. The accurate tumor diagnosis can be achieved by labeling the FAPI dimer compound with a diagnostic nuclide (68Ga), which has promising application prospects in PET imaging for diagnosis and in the preparation of a therapeutic nuclide (such as 177Lu or 90Y)-labeled drug for treating a FAP-?-expressing tumor.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: April 9, 2024
    Assignee: Xiamen University
    Inventors: Haojun Chen, Liang Zhao, Qin Lin, Kaili Fu, Yizhen Pang, Zhide Guo, Jianyang Fang, Long Sun, Hua Wu
  • Patent number: 11955405
    Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20240113676
    Abstract: A detection device for detecting an eyeball includes a frame element, a transceiver, and a contact lens element. The transceiver is disposed on the frame element. The transceiver transmits a first RF (Radio Frequency) signal. The contact lens element includes a resonator. The resonator converts the first RF signal into a first ultrasonic signal. The first ultrasonic signal is transmitted to the eyeball. The resonator converts a second ultrasonic signal from the eyeball into a second RF signal. The transceiver receives the second RF signal.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Applicant: HTC Corporation
    Inventors: Chun-Yih WU, Ta-Chun PU, Yen-Liang KUO, Wei-Chih CHANG
  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Patent number: 11947172
    Abstract: An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: April 2, 2024
    Assignee: FOCI FIBER OPTIC COMMUNICATIONS, INC.
    Inventors: Ting-Ta Hu, Hsu-Liang Hsiao, Po-Yi Wu
  • Patent number: 11949720
    Abstract: Systems and methods are disclosed for securing a network, for admitting new nodes into an existing network, and/or for securely forming a new network. As a non-limiting example, an existing node may be triggered by a user, in response to which the existing node communicates with a network coordinator node. Thereafter, if a new node attempts to enter the network, and also for example has been triggered by a user, the network coordinator may determine, based at least in part on parameters within the new node and the network coordinator, whether the new node can enter the network.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: April 2, 2024
    Assignee: Entropic Communications, LLC
    Inventors: Yoav Hebron, Na Chen, Zong Liang Wu, Ronald Lee
  • Patent number: 11948886
    Abstract: A semiconductor device includes one or more active semiconductor components, wherein a front side is defined over the semiconductor substrate and a back side is defined beneath the semiconductor substrate. A front side power rail is formed at the front side of the semiconductor device and is configured to receive a first reference power voltage. First and second back side power rails are formed on the back side of the semiconductor substrate and are configured to receive corresponding second and third reference power voltages. The first, second and third reference power voltages are different from each other.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien
  • Patent number: 11949142
    Abstract: A feeding structure is provided, which includes first and second substrates opposite to each other, a reference electrode, and a dielectric layer between the first and second substrates. The first substrate includes a coupling branch and a delay branch, which are respectively connected to two output terminals of a power divider and form a current loop with the reference electrode, on a side of a first base plate proximal to the dielectric layer. The second substrate includes a receiving electrode on a side of a second base plate proximal to the dielectric layer, the receiving electrode and the coupling branch form a coupling structure, and their orthographic projections on the first base plate at least partially overlap each other. A length of an orthographic projection of both the coupling branch and the receiving electrode on the first base plate is different from a length of the delay branch.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: April 2, 2024
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haocheng Jia, Tienlun Ting, Ying Wang, Jie Wu, Liang Li, Cuiwei Tang, Qiangqiang Li
  • Patent number: 11949376
    Abstract: A VCO (voltage-controlled oscillator) includes: a resonant tank having a parallel connection of an inductor, a fixed capacitor, a variable capacitor, a first temperature compensating capacitor, and a second temperature compensating capacitor across a first node and a second node, and configured to establish an oscillation of a first oscillatory voltage at the first node and a second oscillatory voltage at the second node; and a regenerative network placed across the first node and the second node to provide energy to sustain the oscillation. The variable capacitor is controlled by a control voltage, the first temperature compensating capacitor is controlled by a first temperature tracking voltage of a positive temperature coefficient, and the second temperature compensating capacitor is controlled by a second temperature tracking voltage of a negative temperature coefficient.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 2, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: I-Chang Wu, Chia-Liang (Leon) Lin
  • Publication number: 20240102359
    Abstract: A liquid-cooling fracturing system includes a fracturing device; a power device connected to the fracturing device through a transmission device and configured to provide power for the fracturing device; a cooling medium storage device configured to store a cooling medium for cooling the power device; and a first heat exchange device, the first heat exchange device using cooling liquid to exchange heat with the cooling medium to cool the cooling medium.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Inventors: Jifeng ZHONG, Liang LV, Yipeng WU, Xincheng LI
  • Patent number: 11942420
    Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu
  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20240096825
    Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.
    Type: Application
    Filed: February 8, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Hua YU, Chih-Hang TUNG, Kuo-Chung YEE, Yian-Liang KUO, Jiun-Yi WU
  • Publication number: 20240096866
    Abstract: An integrated circuit includes first-type transistors aligned within a first-type active zone, second-type transistors aligned within a second-type active zone, a first power rail and a second power rail extending in a first direction. A first distance between the long edge of the first power rail and the first alignment boundary of the first-type active zone is different from a second distance between the long edge of the second power rail and the first alignment boundary of the second-type active zone. Each of the first distance and the second distance is along a second direction which is perpendicular to the first direction.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Guo-Huei WU, Chih-Liang CHEN, Li-Chun TIEN
  • Publication number: 20240095072
    Abstract: A method includes, in response to receiving an incoming service request and establishing a call chain of pods of a service mesh network, setting a retry locker parameter to a locked state for each pod in the call chain. A locked retry locker parameter prevents the pod from initiating retries of a service request. The method includes, in response to determining that a pod in the call chain is unavailable, setting the retry locker parameter to an unlocked state for a previous pod just prior to the pod that is unavailable. The unlocked state allows a retry to the pod that is unavailable. In response to the previous pod reaching a retry limit, the method includes setting the retry locker parameter to unlocked for each pod in the call chain and sending a service termination message to a service requester.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Yue Wang, Wei Wu, Xin Peng Liu, Liang Wang, Biao Chai
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai