Patents by Inventor Liang Yao

Liang Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230358436
    Abstract: The present invention discloses a new-type air pump housing including a main body housing, a rear body housing, a fan-shaped air hole and a slot air vent; one end of the main body housing being fixedly connected to the rear body housing, the other end of the main body housing being provided with the slot air vent, and the outside of the rear body housing being provided with the fan-shaped air hole; a first air hole being opened outside the slot air vent. The new-type air pump housing better solves the problem that the traditional air pump housing cannot reduce the gas resistance during use, by means of the slot air vent being provided and combined with the fan-shaped air hole. As the fan-shaped air hole and the slot air vent are arranged opposite to each other.
    Type: Application
    Filed: January 12, 2021
    Publication date: November 9, 2023
    Inventor: Liang YAO
  • Publication number: 20230193644
    Abstract: The invention discloses a non-pneumatic pool with inclined supports, which comprises a pool, wherein the pool includes a first hard sandwich, a first soft inner wall and a first soft outer wall. An outer side of the pool is provided with inclined supports, which include a second soft outer wall, a second soft inner wall and a second hard sandwich. The first soft outer wall of the pool is fixedly connected to a soft top portion of the inclined support through a first inclined support connection. When the non-pneumatic pool is in used, the whole pool is supported from the sides; multiple inclined supports form stable triangular structures with the pool walls to ensure the stability of the pool during use. Meanwhile, the inclined supports can be tightly attached to the pool walls during storage, which can save space and has strong practicability.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Applicant: Jiangsu Jinrui Outdoor Products Co., Ltd.
    Inventor: Liang YAO
  • Publication number: 20230153950
    Abstract: The noise reduction convolutional auto-encoding method includes the following tasks. A distorted image is received and input into a noise reduction convolutional auto-encoding model. In the noise reduction convolutional auto-encoding model, an image feature of the distorted image is transferred to a first deconvolution layer through skip-connection. A plurality of multi-stride encoding convolutional layers are performed for the distortion image to reduce a dimension. A same-dimensional encoding convolutional layer is then performed. According to the corresponding multi-stride encoding convolutional layers and same-dimensional encoding convolutional layers, the corresponding plurality of decoding multi-stride convolutional layers and same-dimensional decoding convolutional layers are upscaled to obtain a reconstructed image. The result of the up-scaled dimension is input into the same-dimensional decoding convolutional layer of a balanced channel using the first deconvolution layer.
    Type: Application
    Filed: January 13, 2022
    Publication date: May 18, 2023
    Inventors: Liang-Yao WANG, Sau-Gee CHEN
  • Publication number: 20230153951
    Abstract: The noise reduction convolutional auto-encoding method includes the following tasks. A distorted image is received and input into a noise reduction convolutional auto-encoding model. In the noise reduction convolutional auto-encoding model, an image feature of the distorted image is transferred to a first deconvolution layer through skip-connection. A plurality of multi-stride encoding convolutional layers are performed for the distortion image to reduce a dimension. A same-dimensional encoding convolutional layer is then performed. According to the corresponding multi-stride encoding convolutional layers and same-dimensional encoding convolutional layers, the corresponding a plurality of decoding multi-stride convolutional layers and a same-dimensional decoding convolutional layers are upgraded. The result of up-scaled dimension is input into the same-dimensional decoding convolutional layer of a balanced channel using the first deconvolution layer.
    Type: Application
    Filed: January 13, 2022
    Publication date: May 18, 2023
    Inventors: Liang-Yao WANG, Sau-Gee CHEN
  • Publication number: 20230074196
    Abstract: A method for preparing a butyronitrile rubber powder-based polyvinyl chloride (PVC) thermoplastic elastomer and a use of the butyronitrile rubber powder-based PVC thermoplastic elastomer in preparing automotive parts are provided. The method includes: activating a wasted nitrile butadiene rubber (NBR) powder; plasticizing one of NBR and chloroprene rubber (CR) to obtain a plasticized rubber; dispersing the activated NBR fine rubber powder with one of PVC and chlorinated polyethylene (CPE) in a kneader evenly to obtain a mixture; adding the mixture and pine tar into the plasticized rubber, then mixing evenly to obtain a mixed plastic; adding various compounding agents into the mixed plastic and dispersing evenly to perform cross-linking reaction, thereby obtaining the butyronitrile rubber powder-based PVC thermoplastic elastomer.
    Type: Application
    Filed: July 21, 2022
    Publication date: March 9, 2023
    Inventors: YANQIU WANG, YANAN ZANG, FENG LIU, LIANG YAO, TAICHUANG LIU, GUOWEN WENG, XIAOPING ZHANG
  • Publication number: 20220400896
    Abstract: An air fryer includes a housing, in which a cooking cavity and a heating cavity are formed, the heating cavity being located behind the cooking cavity; a heating device, which is arranged in the housing to heat the cooking cavity; and a food container, which is placed inside the cooking cavity.
    Type: Application
    Filed: September 1, 2020
    Publication date: December 22, 2022
    Inventors: Zhibo XU, Huayong LIU, Zujing DU, Liang YAO, Huimin WU, Fufeng XIAO
  • Patent number: 11281835
    Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: March 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Heng Hsieh, Sheng-Hsiung Wang, Hui-Zhong Zhuang, Yu-Cheng Yeh, Tsung-Chieh Tsai, Juing-Yi Wu, Liang-Yao Lee, Jyh-Kang Ting
  • Publication number: 20220068812
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first contact and a second contact disposed over a substrate. A center of a first upper surface of the first contact is laterally separated from a center of a second upper surface of the second contact by a first distance. A first interconnect contacts the first upper surface and a second interconnect contacts the second upper surface. A center of a first lower surface of the first interconnect is laterally separated from a center of a second lower surface of the second interconnect by a second distance that is greater than the first distance.
    Type: Application
    Filed: October 14, 2021
    Publication date: March 3, 2022
    Inventors: Liang-Yao Lee, Tsung-Chieh Tsai, Juing-Yi Wu, Chun-Yi Lee
  • Patent number: 11234642
    Abstract: A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount ass
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: February 1, 2022
    Assignee: Mad Apparel, Inc.
    Inventors: James Artel Berg, Gaston MacMillan, Chris Glaister, Wesley Groom, Liang Yao
  • Publication number: 20210339086
    Abstract: An athletic garment includes sensors at different locations of the garment. The sensors are electrically coupled to a processing unit and/or a power source via one or more conduits that are printed onto the garment. The conduits are designed for improved flexibility to accommodate stretching in the garment that occurs as a user wearing the garment performs an exercise and for improved durability to resist corrosion due to friction, sweat, or washing of the garment. In one embodiment, the conduits are designed for decreased stress concentrations at seams of the garment. In one embodiment, the conduits are designed to create a conductive pathway between different surfaces of the garment to electrically couple sensors on a first side (skin side) of the garment and a processing unit and/or a power source on a second side (outer side) of the garment.
    Type: Application
    Filed: July 6, 2021
    Publication date: November 4, 2021
    Inventors: James Artel Berg, Wesley Groom, Liang Yao, Hamid Hameed Butt, Anna Asnis, Dhananja Jayalath
  • Patent number: 11152303
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a plurality of gate structures disposed over a substrate. A plurality of metal structures continuously extend from lower surfaces contacting the plurality of gate structures to upper surfaces contacting one or more interconnects within an overlying conductive interconnect layer. The plurality of metal structures are arranged at a first pitch that is larger than a second pitch of the plurality of gate structures.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Liang-Yao Lee, Tsung-Chieh Tsai, Juing-Yi Wu, Chun-Yi Lee
  • Patent number: 10998304
    Abstract: A conductive line structure includes two conductive lines in a layout. The two cut lines are over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 4, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ru-Gun Liu, Tung-Heng Hsieh, Tsung-Chieh Tsai, Juing-Yi Wu, Liang-Yao Lee, Jyh-Kang Ting
  • Patent number: 10925540
    Abstract: A garment can be manufactured by bonding an adhesive to a first layer of fabric and a second layer of fabric. Holes are cut into each layer of fabric to accommodate the integration of sensors and a processing unit mount. Conductive thread embroidered onto a support layer is bonded to the adhesive of the second layer of fabric. The support layer is removed such that the conductive thread remains bonded to the adhesive. The layers of fabric are bonded together such that the conductive thread is coupled between the two layers of adhesive. A back plate is added to the layers of fabric to provide structural support for the mount. The conductive thread is exposed within each hole, and the mount and sensors can be coupled within the holes such that an electrical connection is established between the mount and at least one sensor via the conductive thread.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 23, 2021
    Assignee: Mad Apparel, Inc.
    Inventors: James Artel Berg, Hamid Hameed Butt, Liang Yao, Gaston J. MacMillan, J. M. Hasitha B. Jayasundara
  • Patent number: 10758945
    Abstract: A liquid knife cleaning apparatus and a liquid knife are provided. The liquid knife cleaning apparatus includes: a frame configured to be arranged on the liquid knife and be capable of reciprocating in an extending direction of the knife edge; a cleaning blade configured to extend into the knife edge of the liquid knife and be capable of reciprocating inside the knife edge under the driving of the frame to clean the knife edge, the cleaning blade being arranged on the frame; and a movable mechanism configured to control the frame to reciprocate on the liquid knife in the extending direction of the knife edge, the frame being connected to the movable mechanism.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: September 1, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Liang Yao, Lin Huang, Wei Zhou, Yu Yang, Giseub Lim, Erlun Chen, Chen Yuan, Liming Xu, Chengnan Hsieh
  • Publication number: 20200257842
    Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 13, 2020
    Inventors: Tung-Heng Hsieh, Sheng-Hsiung Wang, Hui-Zhong Zhuang, Yu-Cheng Yeh, Tsung-Chieh Tsai, Juing-Yi Wu, Liang-Yao Lee, Jyh-Kang Ting
  • Patent number: 10731329
    Abstract: A reusable modular housing system has a gridded structure comprising reusable components with dimensions corresponding to a two-unit system. The structure has floor and ceiling grids with dimensions that correspond to multiples of a first unit of measurement. The vertical beams that connect the floor and ceiling grids are spaced apart at dimensions that also correspond to multiples of the first unit of measurement. The structure has a variety of other components that can be coupled to the floor and ceiling grids and the vertical beams, and those other components have dimensions that correspond to a multiple of a second unit of measurement. Dimensions of the structure can vary, but each of the component parts can be detachably coupled into the gridded structure, so as to fit within the grid's dimensions based on respective multiples of the first unit of measurement and the second unit of measurement.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: August 4, 2020
    Assignee: Airbnb, Inc.
    Inventors: Petr Novikov, Joseph Gebbia, Christopher Perry Barton, Fedor Novikov, Lisa Feine Dudley, Jaeyoung Huh, Nicole Voyen, Liang Yao, James Nicholas Pazzi, David Sharps, Andrei Goverdovskii, Daniel Joseph Chavez, Miguel Christophy, Stefano Pantrerotto, Alexis Fabrice Tourron, Cormac Eubanks
  • Patent number: D987112
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: May 23, 2023
    Assignee: Jiangsu Comco Outdoor Products Co., Ltd.
    Inventor: Liang Yao
  • Patent number: D987113
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: May 23, 2023
    Assignee: Jiangsu Comco Outdoor Products Co., Ltd.
    Inventor: Liang Yao
  • Patent number: D987114
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: May 23, 2023
    Assignee: Jiangsu Comco Outdoor Products Co., Ltd.
    Inventor: Liang Yao
  • Patent number: D995685
    Type: Grant
    Filed: January 23, 2021
    Date of Patent: August 15, 2023
    Inventor: Liang Yao