Patents by Inventor Liang Yao

Liang Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090183045
    Abstract: A testing system for a device under test (DUT) includes a test parameter-generating device and a platform module. The test parameter-generating device stores test information, and is operable so as to execute a test algorithm, so as to generate a transmission signal upon execution of the test algorithm, and so as to generate a test environment with reference to the transmission signal. The platform module is operable so as to conduct testing of the DUT using the test information stored in the test parameter-generating device under the test environment generated by the test parameter-generating device.
    Type: Application
    Filed: January 14, 2008
    Publication date: July 16, 2009
    Inventors: Cheng-Liang YAO, Ming-Tsung Hsia
  • Publication number: 20080115964
    Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and an insulating medium for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of slots is defined in the ground plane and located close to facing edges of the two power modules, and the slots are arranged in rows along the facing edges of the two power modules.
    Type: Application
    Filed: July 30, 2007
    Publication date: May 22, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU
  • Publication number: 20080099231
    Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and a strip made of insulating medium disposed between the two power modules for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of vias electrically connects the power plane and the ground plane, and is close to the strip. Each via is insulated from the power module by an annular insulating medium. Each power module and the vias forms an equivalent coupling capacitance, and SSN can be conducted to the ground plane via the equivalent coupling capacitance, therefore, the SSN in the PCB is suppressed.
    Type: Application
    Filed: July 30, 2007
    Publication date: May 1, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU
  • Publication number: 20080053687
    Abstract: A printed circuit board includes a power plane, a ground plane insulated from the power plane, and at least one via. The power plane includes two power modules, an insulating medium for insulating the two power modules, and a signal transmission line positioned between the two power modules and insulated from the two power modules by the insulating medium. The at least one via connects the signal transmission line with the ground plane for conducting simultaneous switching noise (SSN) transmitted to the power modules to the ground plane.
    Type: Application
    Filed: June 11, 2007
    Publication date: March 6, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU
  • Patent number: 5047132
    Abstract: Dirhodium complexes such as tetrakis (.mu.-2-anilinopyridinato)dirhodium are used in the catalytic reduction of dioxygen. An electric potential is applied to the dirhodium complex either dissolved in solution or supported by an electrode.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: September 10, 1991
    Assignee: University of Houston
    Inventors: John L. Bear, Chao-Liang Yao