Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A memory device includes a plurality of memory dies. Each memory die of the plurality of memory dies includes a memory die and control logic, operatively coupled with the memory die, to perform operations including receiving, during a current auxiliary data communication cycle, a token to enable auxiliary data communication, in response to receiving the token, determining whether to communicate auxiliary data via an auxiliary data channel to at least one other memory die of a plurality of memory dies, and in response to determining to communicate the auxiliary data via the auxiliary data channel to the at least one other memory die, causing the auxiliary data to be communicated to the at least one other memory die.

Abstract: A display device includes a panel, a conductive layer, a first color filter array and a second color filter array. The panel has a display surface and multiple sub-pixel regions where the multiple sub-pixel regions and the conductive layer are on this display surface. The first color filter array including multiple first color filter elements is disposed on the conductive layer while the second color filter array including multiple second color filter elements is disposed on the first color filter array. One first overlaid region and one second overlaid region are defined by the orthogonal projections of the color filter elements within one of the sub-pixel regions. In one sub-pixel region, a section of the first overlaid region does not overlap a section of the second overlaid region.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: The present disclosure provides a electrostatic discharge (ESD) protection circuit, coupled between a first reference terminal and a second reference terminal; the ESD protection circuit includes a first voltage divider, a second voltage divider, a first trigger circuit and a second trigger circuit. The first trigger circuit includes a first terminal and a second terminal, wherein the first terminal is coupled to the first reference terminal, and the second terminal is coupled to the second reference terminal via the first voltage divider. The second trigger circuit includes a first terminal and a second terminal, wherein the first terminal is coupled to the second reference terminal, the second terminal is coupled to the first reference terminal via the second voltage divider, and the second trigger circuit and the first trigger circuit are in parallel connection.

Abstract: The present invention discloses a multi-energy complementary system for a co-associated abandoned mine and a use method. The multi-energy complementary system for a co-associated abandoned mine includes a mining mechanism, a grouting mechanism and an energy mechanism. In the present invention, the mining of coal and uranium resources is realized through the mining mechanism, the subsidence and seepage reduction of the stratum is realized through the grouting mechanism, and the effective utilization of waste resources is realized through the energy mechanism. Finally, with the efficient cooperation of the three mechanisms, safe and efficient development and utilization of co-associated resources in the full life cycle are realized, and the purposes of green and efficient mining of coal and uranium resources and secondary development of a coal seam goaf are achieved, thereby facilitating the realization of dual-carbon goals and the development of low-carbon green energy.

Abstract: The present disclosure provides a method and a system for acquiring seismic data of a four-component ocean bottom node (OBN). The method is implemented by the system, comprising controlling installations of a plurality of ocean bottom submerged buoys and a plurality of four-component OBN seismic data acquisition instruments and sending positioning signals and timing signals to the plurality of ocean bottom submerged buoys through armored opto-electronic composite cables. The method also includes obtaining real-time and uninterrupted water temperature data, pressure data, density data, and salt saturation data along the armored opto-electronic composite cables from the ocean surface to locations of the plurality of ocean bottom submerged buoys, and calculating real-time and three-dimensional data of waters of a whole measurement work area through interpolation.

Abstract: The present application discloses a liquid crystal display panel, a method for manufacturing the liquid crystal display panel, and a curved display. The liquid crystal display panel is configured with an alignment layer only on an array substrate, but not on an opposing substrate opposite to the array substrate. After photo-alignment, a pretilt angle of liquid crystal molecules near the array substrate is greater than a pretilt angle of liquid crystal molecules near the opposing substrate to effectively mitigate a problem of “black clusters.

Abstract: A method includes selecting a particular ready/busy pin (R/B #) among a plurality of R/B # pins that are associated with respective memory dice among a plurality of memory dice of a memory device. The method further includes receiving, by at least one memory dice among the plurality of memory dice, signaling indicative of performance of a memory access while the particular R/B # pin is set to low, and, initiating an internal clocking signal subsequent to receipt of the signaling indicative of performance of the memory access, wherein the internal clocking signal is associated with timing of operations performed by the plurality of memory dice.

Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: An intelligent experimental device for collaborative mining of associated resources includes a signal transmission mechanism, a pressure maintaining mechanism, a feeding mechanism, and a reaction mechanism. The signal transmission mechanism includes a centralized controller, an annunciator, signal receivers, a power supply, a power cord, signal transmitters, and signal sensing valves. The pressure maintaining mechanism includes ambient and axial pressure oil chambers, ambient and axial pressure pumps, ambient and axial pressure liquid distribution tanks, a comprehensive pressure distribution pipe, and hydraulic transmission pipes. The feeding mechanism includes monitoring analyzers, temperature controllers, solution transfer pipes, seepage pumps, mixture conveying pipes, a comprehensive liquid distributor, an aggregate chamber, a liquid chamber, an oil chamber, a gas chamber, a mixing chamber and an analytical purifier.

Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

Abstract: An antenna includes a patch radiator, a feed point, a first ground point, and a second ground point. The patch radiator has a first side edge and an intersecting second side edge, and a first coupling contact and a second coupling contact. The patch radiator is coupled to the first ground point and the second ground point through the first coupling contact and the second coupling contact, and is biased coupled to the feed point. A distance between the first coupling contact and the first side edge, a distance between the first coupling contact and the second side edge, a distance between the second coupling contact and the first side edge, and a distance between the second coupling contact and the second side edge are all greater than or equal to 0.05?, where ? is an operating wavelength of the antenna in an operating frequency band range of the antenna.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Abstract: An engagement and disengagement device used in a seat belt retractor including a first rotating member capable of being driven to rotate about a rotation axis thereof, a second rotating member provided coaxially with the first rotating member and connected to a reel of the seat belt retractor in an anti-torsion manner, and a transmission member provided between the first and second rotating member. The first rotating member is capable of transmitting torque to the second rotating member by means of the transmission member. The transmission member includes a holder and a transmission element in the holder. A first elastic component elastically holds the transmission element by radially exerting a force that enables the transmission element to be located away from the first or the second rotating member, and the first elastic component is integrated on the holder.

Abstract: A package structure includes a first thermal dissipation structure, a first semiconductor die, a second semiconductor die. The first thermal dissipation structure includes a semiconductor substrate, conductive vias embedded in the semiconductor substrate, first capacitors electrically connected to the conductive vias, and a thermal transmission structure disposed over the semiconductor substrate and the conductive vias. The first semiconductor die is disposed on the first thermal dissipation structure. The second semiconductor die is disposed on the first semiconductor die opposite to the first thermal dissipation structure.

Abstract: A memory device might include a controller configured to cause the memory device to generate a first sum of expected peak current magnitudes for a plurality of memory devices, and generate a second sum of expected peak current magnitudes for a subset of the plurality of memory devices, if the memory device were to initiate a next phase of an access operation in a selected operating mode; to compare the first sum to a first current demand budget for the plurality of the memory devices; to compare the second sum to a second current demand budget for the subset of memory devices; and to initiate the next phase of the access operation in the selected operating mode in response to the first sum being less than or equal to the first current demand budget and the second sum being less than or equal to the second current demand budget.

Abstract: Examples described herein relate to offload reliable transport management to a network interface device and store packets to be resent, based on received packet receipt acknowledgements (ACKs), into one or more kernel space queues that are also accessible in user space.

Abstract: The present disclosure provides a device for full-wave field seismic source based on a gas explosion technology and a method for acquiring seismic data. The device includes a cylindrical explosion-proof metal outer barrel, and four sides of the explosion-proof metal outer barrel are fixedly connected to four high-strength steel plates. The device also includes a cylindrical explosion-proof metal gas explosion inner barrel and pipelines for injecting high-pressure air and high-pressure gas into the gas explosion inner barrel. A center of the gas explosion inner barrel is installed with an electronic ignition gun, which is connected to a GPS timing module connected to the electronic ignition gun. The device further includes a controller configured to control a seismic source of a gas explosion full-wave field.