Patents by Inventor Lijie HUANG
Lijie HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120024054Abstract: With increasing demands on data communication and remote control in current industrial processes or gas measurement applications, development of new technologies would be necessary. The current invention presents a MEMS mass flow meter that are cost compatible with conventional variable area flow meters while providing all digital data process including accumulated flow rate measurements, user programmable flow rate alarm and flow data storage. These in-line meters provide packages in pipe diameter from 4 mm up to 100 mm. It is powered with battery and can be used as a stand-alone hand-held option. The meter is also equipped with the industrial standard RS485 Modbus communication interface for easy network and remote management.Type: ApplicationFiled: July 30, 2010Publication date: February 2, 2012Applicant: Siargo Ltd.Inventors: Liji Huang, Kai Peng, Changming Jiang, Wenhong Deng, Chih-Chang Chen
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Publication number: 20120011940Abstract: Nowadays many electronic devices, such as LCD projector, computer servers, and air fresher etc. require reliable air cooling system to reduce the risk of electronics damage caused by overheating. The present invention disclosed an apparatus integrated with air flow sensor as an alarm apparatus for air flow clog detection. The major prior approach for air flow circulation failure detection is based on an indirect measurement method of temperature monitoring on surrounding environments, which method is suffering from the slow response and poor identification of real-time situation. The present invention will demonstrate the advantages by directly monitoring air flow over by indirectly monitoring the surrounding temperature as for the purpose of preventing air flow path clog.Type: ApplicationFiled: May 25, 2010Publication date: January 19, 2012Applicant: Siargo Ltd.Inventors: Liji Huang, Jian Luo, Changming Jiang, Yenan Liu, Wenhong Deng, Jialuo Jack Xuan, Chih-Chang Chen
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Publication number: 20120001273Abstract: The current invention disclosed a micro-package design for packaging of micromachining liquid flow sensor. The package in present invention is fabricated with micromachining or micro-molding approach, which can greatly reduce the manufacturing cost due to the batch production. The micro-package design provides packaging solution for general micromachining liquid flow sensors that can enable various microfluidic applications while reaching the cost threshold for a disposable unit.Type: ApplicationFiled: July 2, 2010Publication date: January 5, 2012Applicant: Siargo Ltd.Inventors: Chih-Chang Chen, Liji Huang
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Publication number: 20110301765Abstract: An apparatus integrated with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon thermal sensor as a proximity switch sensor in air/oil Lubricators is disclosed in the present invention. The present invention relates to mass flow sensing and measurement for both gas and liquid phase and relates to air/oil lubrication process for multi-point lubrication machine. The invented apparatus is utilized as an alarm device to prevent mechanical system failures caused by the discontinuity of oil lubrication. The MEMS silicon thermal sensor is distinguished with a variety of advantages of small size, low power consumption, high reliability and high accuracy. In addition to the above benefits, the most significant and critical advantage is its fast response time of less than 20 msec, which makes the proximity switch control become viable for preventing equipment damage from oil lubricants discontinuity.Type: ApplicationFiled: June 8, 2010Publication date: December 8, 2011Applicant: Siargo Ltd.Inventors: Liji Huang, Jiliang Ruan, Jian Luo, Chih-Chang Chen
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Publication number: 20110283812Abstract: An apparatus integrated with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure air flow velocity on targeting correction for projectiles arms is disclosed in the present invention. The air flow velocity component perpendicular to the travel direction of bullets with respect to projectile arm body (e.g. bullets, shells, or arrows) has main effect to the targeting accuracy. Such effect is pretty much determined by the wind speed and the projectile travel distance. The integration with MEMS mass flow sensor has made the invented apparatus possible to be compact, low power consumption, low cost and high accuracy. The low power consumption characteristic of MEMS mass flow sensor is especially crucial for making the apparatus of present invention feasible by battery operated.Type: ApplicationFiled: May 24, 2010Publication date: November 24, 2011Applicant: SIARGO LTD.Inventors: Liji Huang, Wei Ching, Chih-Chang Chen
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Publication number: 20110283811Abstract: A wind or gas velocity profiler integrated with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensors in an open or enclosed space is disclosed in the present invention. There are three main embodiments disclosed in the present invention. Through the preambles of the independent claims, the advantages and merits of such measurement apparatus with MEMS flow sensor will be demonstrated as well. A silicon-based MEMS flow sensor can greatly reduce the sensor fabrication cost by a batch production. The integration with MEMS flow sensor makes the invented anemometer operate in the ways of better measurement accuracy, lower power consumption, higher reliability and a compact dimension compared to traditional anemometers such as cup anemometer, thermal anemometer and ultrasonic anemometer.Type: ApplicationFiled: May 18, 2010Publication date: November 24, 2011Applicant: Siargo Ltd.Inventors: Liji Huang, Jialuo Jack Xuan, Chih-Chang Chen
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Patent number: 7908096Abstract: An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises an upstream thin-film heater, an downstream thin-film heater, and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heaters and the sensors out of contact with the substrate base. This mass flow sensor is operated with three sets of circuits, a first circuit for measuring a flow rate in a first range of flow rates, a second circuit for measuring a flow rate in a second range of flow rates, and a third circuit in a differential configuration for measuring a flow rate in said first range of flow rates or said second range of flow rates, to significantly increase range of flow rate measurements and provide an optional for concentration measurement, while maintains a high degree of measurement accuracy.Type: GrantFiled: September 28, 2007Date of Patent: March 15, 2011Assignee: Siargo Ltd.Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
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Publication number: 20110030468Abstract: The present invention is generally related to a novel micromachining thermal mass flow sensor and, more particularly, to a device incorporated with high strength and robust characteristics, which therefore is capable of operating under harsh environments. The new disclosed sensor is made of essential material which can provide robust physical structure and superior thermal properties to support the flow measuring operation. The invented thermal mass flow sensor is featuring with the advantages of micro-fabricated devices in terms of compact size, low power consumption, high accuracy and repeatability, wide dynamic range and easiness for mass production, which could avoid the drawbacks of fragility and vulnerability.Type: ApplicationFiled: August 10, 2009Publication date: February 10, 2011Applicant: SIARGO, LTD.Inventors: Chih-Chang Chen, Gaofeng Wang, Liji Huang, Yahong Yao
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Patent number: 7878056Abstract: The current invention generally relates to Micro Electro Mechanical Systems (MEMS) thermal mass flow sensors for measuring the flow rate of a flowing fluid (gas/liquid) and the methods of manufacturing on single crystal silicon wafers. The said mass flow sensors have self-cleaning capability that is achieved via the modulation of the cavity of which the sensing elements locate on the top of the cavity that is made of a silicon nitride film; alternatively the sensing elements are fabricated on top of a binary silicon nitride/conductive polycrystalline silicon film under which is a porous silicon layer selective formed in a silicon substrate. Using polycrystalline silicon or the sensing elements as electrodes, an acoustic wave can be generated across the porous silicon layer which is also used for the thermal isolation of the sensing elements.Type: GrantFiled: December 19, 2007Date of Patent: February 1, 2011Assignee: Siargo Ltd.Inventors: Liji Huang, Chih-Chang Chen, Yahong Yao, Gaofeng Wang
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Patent number: 7797997Abstract: This invention discloses a mass flow sensor manufactured by applying the micro-electromechanical system (MEMS) process to provide a new and improved mass flow sensor that is a self-calibrated in a time-of-flight manner with configuration to measure the flow velocity directly. The self-calibration of a mass flow rate sensor is achieved by providing an electric pulse to a heater in the flow and determining a temperature variations of the fluid. The method further includes a step of measuring a temperature variation by a temperature sensor disposed at a short distance from the heater. The method further includes a step of correlating the temperature variation measured at the temperature sensor with the temperature variation of the heater to determine a time delay and a corresponding flow velocity.Type: GrantFiled: August 24, 2008Date of Patent: September 21, 2010Assignee: Siargo Inc.Inventors: Xiaozhong Wu, Liji Huang
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Patent number: 7780343Abstract: A device with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure gas or liquid concentration in a binary mixture formality is disclosed in the present invention. A process for fabricating the said MEMS silicon concentration sensor, which thereby can greatly reduce the sensor fabrication cost by a batch production, is revealed as well. This MEMS process can mass-produce the sensors on silicon substrate in the ways of small size, low power, and high reliability. In addition to the gas or liquid concentration measurement, the present invention further discloses that the said sensor can also readily measure gas or liquid mass flow rate while record the concentration data, which is not viable by other related working principle.Type: GrantFiled: July 9, 2007Date of Patent: August 24, 2010Assignee: Siargo Ltd.Inventors: Chih-Chang Chen, Yahong Yao, Gaofeng Wang, Liji Huang
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Patent number: 7765679Abstract: A mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or lightly doped P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed.Type: GrantFiled: September 19, 2006Date of Patent: August 3, 2010Assignee: Siargo, Inc.Inventors: Yahong Yao, Chih-Chang Chen, Gafeng Wang, Liji Huang
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Patent number: 7752910Abstract: A mass flow sensor is supported on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range.Type: GrantFiled: April 3, 2008Date of Patent: July 13, 2010Assignee: Siargo, Inc.Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
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Publication number: 20090158859Abstract: The current invention generally relates to Micro Electro Mechanical Systems (MEMS) thermal mass flow sensors for measuring the flow rate of a flowing fluid (gas/liquid) and the methods of manufacturing on single crystal silicon wafers. The said mass flow sensors have self-cleaning capability that is achieved via the modulation of the cavity of which the sensing elements locate on the top of the cavity that is made of a silicon nitride film; alternatively the sensing elements are fabricated on top of a binary silicon nitride/conductive polycrystalline silicon film under which is a porous silicon layer selective formed in a silicon substrate. Using polycrystalline silicon or the sensing elements as electrodes, an acoustic wave can be generated across the porous silicon layer which is also used for the thermal isolation of the sensing elements.Type: ApplicationFiled: December 19, 2007Publication date: June 25, 2009Applicant: SIARGO LTD.Inventors: Liji Huang, Chih-Chang Chen, Yahong Yao, Gaofeng Wang
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Publication number: 20090164163Abstract: An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises an upstream thin-film heater, an downstream thin-film heater, and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heaters and the sensors out of contact with the substrate base. This mass flow sensor is operated with three sets of circuits, a first circuit for measuring a flow rate in a first range of flow rates, a second circuit for measuring a flow rate in a second range of flow rates, and a third circuit in a differential configuration for measuring a flow rate in said first range of flow rates or said second range of flow rates, to significantly increase range of flow rate measurements and provide an optional for concentration measurement, while maintains a high degree of measurement accuracy.Type: ApplicationFiled: September 28, 2007Publication date: June 25, 2009Applicant: SIARGO LTD.Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
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Patent number: 7536908Abstract: An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed.Type: GrantFiled: June 21, 2005Date of Patent: May 26, 2009Assignee: Siargo, Ltd.Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
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Publication number: 20090049907Abstract: This invention discloses a mass flow sensor manufactured by applying the micro-electromechanical system (MEMS) process to provide a new and improved mass flow sensor that is a self-calibrated in a time-of-flight manner with configuration to measure the flow velocity directly. The self-calibration of a mass flow rate sensor is achieved by providing an electric pulse to a heater in the flow and determining a temperature variations of the fluid. The method further includes a step of measuring a temperature variation by a temperature sensor disposed at a short distance from the heater. The method further includes a step of correlating the temperature variation measured at the temperature sensor with the temperature variation of the heater to determine a time delay and a corresponding flow velocity.Type: ApplicationFiled: August 24, 2008Publication date: February 26, 2009Inventors: Xiaozhong Wu, Liji Huang
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Publication number: 20090016403Abstract: A device with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure gas or liquid concentration in a binary mixture formality is disclosed in the present invention. A process for fabricating the said MEMS silicon concentration sensor, which thereby can greatly reduce the sensor fabrication cost by a batch production, is revealed as well. This MEMS process can mass-produce the sensors on silicon substrate in the ways of small size, low power, and high reliability. In addition to the gas or liquid concentration measurement, the present invention further discloses that the said sensor can also readily measure gas or liquid mass flow rate while record the concentration data, which is not viable by other related working principle.Type: ApplicationFiled: July 9, 2007Publication date: January 15, 2009Inventors: Chih-Chang Chen, Yahong Yao, Gaofeng Wang, Liji Huang
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Publication number: 20080271525Abstract: A mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or lightly doped P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed.Type: ApplicationFiled: April 3, 2008Publication date: November 6, 2008Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
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Publication number: 20070017285Abstract: An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed.Type: ApplicationFiled: June 21, 2005Publication date: January 25, 2007Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang