Abstract: The present disclosure provides a thin film transistor, a display substrate and a display device, and belongs to the field of display technology. The thin film transistor of the present disclosure includes: a base, and a gate, an active layer, a source and a drain located on the base, where the gate includes a first gate and a second gate which are sequentially provided on the base and are electrically connected to each other; the active layer is located between the first gate and the second gate, and orthographic projections of the first gate and the second gate on the base are partially overlapped with an orthographic projection of the active layer on the base, and the orthographic projections of the first gate and the second gate on the base are partially overlapped with each other.

Abstract: A method for estimating a beam domain channel in a spatial non-stationary massive MIMO system includes constructing a beam domain channel model for the spatial non-stationary massive MIMO system by using a visibility region; transforming a problem for estimating the beam domain channel into a problem for reconstructing a sparse channel based on a sparsity of beam domain channel and an influence of power leakage; proposing a beam domain structure-based sparsity adaptive matching pursuit scheme according to a cross-block sparse structure and a power ratio threshold of the beam domain channel; and verifying that the proposed scheme has a lower pilot overhead, a higher accuracy and a higher effectiveness compared to the traditional schemes in simulation results. The method can be effectively applied to communication channel estimation with non-stationary characteristics, and has obvious advantages in estimation accuracy and complexity.

Abstract: Disclosed are a display substrate, a display substrate motherboard and a display apparatus. The display substrate includes a display region and a bonding region located on a side of the display region, wherein the bonding region includes a fanout region, the fanout region includes a first anti-static area and a first wiring area located around the first anti-static area, the first wiring area includes a plurality of fanout wires, the first anti-static area includes at least one electrostatic protection structure disposed between the plurality of fanout wires, and the electrostatic protection structure includes at least one pair of electrostatic protection lines, and the pair of electrostatic protection lines includes two electrostatic protection lines disposed symmetrically about a center line extending in a first direction.

Abstract: A bonded assembly of a primary semiconductor die and a complementary semiconductor die includes first pairs of first primary bonding pads and first complementary bonding pads that are larger in area than the first primary bonding pads, and second pairs of second primary bonding pads and second complementary bonding pads that are smaller in area than the second primary bonding pads.

Abstract: Provided is an amorphous silicon thin-film transistor including an amorphous silicon semiconductor layer, a source electrode, and a drain electrode that are successively disposed on a base substrate. Ions doped by an ion implantation process are present in a region, proximal to the source electrode and the drain electrode, of the amorphous silicon semiconductor layer. A concentration of the ions in a surface region, proximal to the source electrode and the drain electrode, of the amorphous silicon semiconductor layer is greater than or equal to 5*10{circumflex over (?)}20 atoms/cc.

Abstract: A device of updating library required by a testing program for testing and a method thereof are disclosed. A system configuration file of an old testing device is modified to make the old testing device enter a testing mode when booting, so that library supporting the testing program of an application is updated in the testing mode; when the application is executed, the testing program is connected to the to-be-tested device for performing testing, so that the old testing device can be updated through network without dedicated hardware, and the technical effect of reducing the time and labor cost for updating the old testing device can be achieved.

Abstract: A bonded assembly includes a first semiconductor die containing a first substrate, first semiconductor devices, and first bonding pads laterally surrounded by a first pad-level dielectric layer. The first pad-level dielectric layer includes at least one first encapsulated airgap located between neighboring pairs of first bonding pads and encapsulated by a first dielectric fill material of the first pad-level dielectric layer. The bonded assembly includes a second semiconductor die containing a second substrate, second semiconductor devices, and second bonding pads laterally surrounded by a second pad-level dielectric layer. Each of the second bonding pads is bonded to a respective one of the first bonding pads.

Abstract: Systems and methods for Internet access control are presented. A third-party application is hosted by a third-party server on the Internet. The third-party application has third-party data of a user. An Internet access control device detects an Internet access by the user to a target server on the Internet. The Internet access control device allows or blocks the Internet access depending on whether the Internet access is permitted or prohibited based on the third-party data.

Abstract: A bonded assembly includes a first semiconductor die and a second semiconductor die that are bonded to each other by dielectric-to-dielectric bonding. First conductive via structures vertically extend through the second semiconductor die and a respective subset of the first dielectric material layers in the first semiconductor die, and contact a respective first metal interconnect structure in the first semiconductor die. Second conductive via structures vertically extend through a second substrate and a respective subset of the second dielectric material layers in the second semiconductor die, and contacting a respective second metal interconnect structure in the second semiconductor die. Redistribution metal interconnect structures located over a backside surface of the second substrate electrically connect the first conductive via structures and the second conductive via structures, and provide electrical interconnection between the first semiconductor die and the second semiconductor die.

Abstract: A device of updating library required by a testing program for testing and a method thereof are disclosed. A system configuration file of an old testing device is modified to make the old testing device enter a testing mode when booting, so that library supporting the testing program of an application is updated in the testing mode; when the application is executed, the testing program is connected to the to-be-tested device for performing testing, so that the old testing device can be updated through network without dedicated hardware, and the technical effect of reducing the time and labor cost for updating the old testing device can be achieved.

Abstract: Bonding strength and yield can be enhanced by providing a mating pair of a convex bonding surface and a concave bonding surface. The convex bonding surface can be provided by employing a conductive barrier layer having a higher electrochemical potential than copper. The concave bonding surface can be provided by employing a conductive barrier layer having a lower electrochemical potential than copper. Alternatively additionally, a copper material portion in a bonding pad may include at least 10% volume fraction of (200) copper grains to provide high volume expansion toward a mating copper material portion. The mating copper material portion may be formed with at least 95% volume fraction of (111) copper grains to provide high surface diffusivity, or may be formed with at least 10% volume fraction of (200) copper grains to provide high volume expansion.

Abstract: Provided are a display substrate motherboard and manufacturing method thereof, a display substrate and a display apparatus. The display substrate motherboard includes a substrate, a display substrate area on the substrate, and a mark area on the periphery of the display substrate area. The display substrate motherboard also includes a thin film transistor disposed in the display substrate area, a mark structure disposed in the mark area and a planarization layer disposed on one side of the thin film transistor away from the substrate, and the planarization layer includes a groove which is disposed at the corresponding position of the mark structure and extends along a direction close to the substrate, and an orthographic projection of the groove on the substrate covers an orthographic projection of the mark structure on the substrate.

Abstract: A bonded assembly of a primary semiconductor die and a complementary semiconductor die includes first pairs of first primary bonding pads and first complementary bonding pads that are larger in area than the first primary bonding pads, and second pairs of second primary bonding pads and second complementary bonding pads that are smaller in area than the second primary bonding pads.

Abstract: An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes: a base substrate; a first electrode located on the base substrate and including a pad portion, the pad portion including a first surface and a second surface, the second surface being closer to the base substrate than the first surface; a first insulation layer located on the first electrode and including a first via hole; a second insulation layer located on the first insulation layer and including a second via hole; and a second electrode located on the second insulation layer; the second electrode is electrically connected with the first electrode at the pad portion through the first via hole and the second via hole, and an orthographic projection of the pad portion on the base substrate falls within an orthographic projection of the second via hole on the base substrate.

Abstract: A first metal layer can be deposited over first dielectric material layers of a first substrate, and can be patterned into first bonding pads. A first low-k material layer can be formed over the first bonding pads. The first low-k material layer includes a low-k dielectric material such as a MOF dielectric material or organosilicate glass. A second semiconductor die including second bonding pads can be provided. The first bonding pads are bonded to the second bonding pads to form a bonded assembly.

Abstract: A bonded assembly includes a first semiconductor die and a second semiconductor die. The first semiconductor die includes first metallic bonding pads embedded in first dielectric material layers, the second semiconductor die includes second metallic bonding pads embedded in second dielectric material layers, the first metallic bonding pads are bonded to a respective one of the second metallic bonding pads; and each of the first metallic bonding pads includes a corrosion barrier layer containing an alloy of a primary bonding metal and at least one corrosion-suppressing element that is different from the primary bonding metal.

Abstract: An array substrate and a method for manufacturing the same, and a display device are provided. The array substrate includes a base substrate and the array substrate includes a plurality of pixel units. In each of the plurality of pixel units, the array substrate includes a thin film transistor and a storage capacitor disposed above the base substrate, the storage capacitor includes a metal layer, an intermediate layer, and a reflective layer disposed in a stacked manner, the metal layer being adjacent to the base substrate. The array substrate further includes a common electrode layer disposed on a side of the storage capacitor facing away from the base substrate, the reflective layer is electrically connected to the common electrode layer, and the metal layer is electrically connected to an active layer of the thin film transistor.

Abstract: A bonded assembly includes a first semiconductor die and a second semiconductor die that are bonded to each other by dielectric-to-dielectric bonding. First conductive via structures vertically extend through the second semiconductor die and a respective subset of the first dielectric material layers in the first semiconductor die, and contact a respective first metal interconnect structure in the first semiconductor die. Second conductive via structures vertically extend through a second substrate and a respective subset of the second dielectric material layers in the second semiconductor die, and contacting a respective second metal interconnect structure in the second semiconductor die. Redistribution metal interconnect structures located over a backside surface of the second substrate electrically connect the first conductive via structures and the second conductive via structures, and provide electrical interconnection between the first semiconductor die and the second semiconductor die.

Abstract: Methods and systems for managing security in a cloud computing environment are provided. Exemplary methods include: gathering data about workloads and applications in the cloud computing environment; updating a graph database using the data, the graph database representing the workloads of the cloud computing environment as nodes and relationships between the workloads as edges; receiving a security template, the security template logically describing targets in the cloud computing environment to be protected and how to protect the targets; creating a security policy using the security template and information in the graph database; and deploying the security policy in the cloud computing environment.

Abstract: A bonded assembly of a first semiconductor die and a second semiconductor die includes first and second semiconductor dies. The first semiconductor die includes first semiconductor devices, first metal interconnect structures embedded in first dielectric material layers, and first metal bonding pads laterally surrounded by a semiconductor material layer. The second semiconductor die includes second semiconductor devices, second metal interconnect structures embedded in second dielectric material layers, and second metal bonding pads that include primary metal bonding pads and auxiliary metal bonding pads. The auxiliary metal bonding pads are bonded to the semiconductor material layer through metal-semiconductor compound portions formed by reaction of surface portions of the semiconductor material layer and an auxiliary metal bonding pad. The primary metal bonding pads are bonded to the first metal bonding pads by metal-to-metal bonding.